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A new report from ABI Research predicts that the total connection revenue generated from non-geostationary orbit D2C networks and legacy Mobile Satellite Service (MSS) and NTN services will reach $17 billion a year by 2032. The satellite industry is experiencing increased launch capacity, leading to a surge in satellite communication (satcom) applications. Companies like Starlink and Apple are expected to lead the satellite NTN marketplace with the launch of commercial services in 2024. Additionally, 5G Americas has published a briefing paper exploring spectrum sharing models and their potential benefits to the wireless industry. A study from Juniper Research also predicts a 150% growth in the number of satellites in orbit that can be used for IoT connectivity over the next five years. The study recommends substantial investment in multi-orbit satellite solutions to meet the growing demand for satellite IoT connectivity. [Extracted from the article]

The given text provides a series of updates and collaborations in the engineering industry. AMCAD Engineering has been acquired by Dassault Systèmes, L Squared Capital Partners and CogneSense have completed the acquisition of L&J Technologies, and EMITE's over-the-air chambers can now be combined with the R&S CMX500 one-box signaling tester from Rohde & Schwarz. Texas Metering & Device Company and The Antenna Company have collaborated to improve wireless connectivity for off-network smart meters, and Viavi Solutions Inc. and the Telecom Infra Project (TIP) have announced a strategic collaboration to expand testing capabilities. Tech Soft 3D and Spatial have strengthened their strategic alliance, ISE Labs Inc. has opened a second facility in San Jose, California, and Keysight Technologies Inc. has gained validations for the industry's first 5G NR FR1 1024-QAM demodulation test cases. NXP Semiconductors' single-chip NFC and embedded secure element solution, the SN220, has been certified by the Car Connectivity Consortium, and the U.S. Department of Commerce, GlobalWafers America LLC, and MEMC LLC have signed a preliminary memorandum of terms to provide funding for semiconductor wafer production. Raytheon has been awarded two strategic Mentor Protégé Agreement initiatives from the Department of the Navy to support the development of operational AI. The text also mentions a symposium that took place in Cincinnati, Ohio, which featured technical papers, exhibits [Extracted from the article]

This document showcases various companies and their products in the fields of electronic warfare, radar, and military communications. The featured companies offer a wide range of innovative solutions including switches, transceivers, converters, power amplifiers, oscillators, filters, and more. These products are designed for use in military and defense applications, providing high performance, reliability, and durability. The document provides links to the websites of each company for further information and contact. [Extracted from the article]

The article discusses the application of X-parameters modeling technology in power amplifiers (PA) design. PA designers can develop measurement-based behavior models of unmatched devices by integrating X-parameter modeling with load-pull measurements. A simple matching network topology is used to reduce fabrication related errors. The matching network and the X-parameter model are combined to predict the effects of connecting the matching networks to the transistor ports.

The article reports that Vishram Pandit of technology company Intel Corporation has won the Engineer of the Year Award at the DesignCon 2019 and for the Best Paper Award Finalist.

The article discusses the development of chipless radio frequency identification (RFID) tags with microstrip patch resonators to achieve higher coding capacity. The tags can be printed directly on products like credit cards, paper and textiles. Other topics include the effects of mutual coupling on the tags, and the categories of chipless RFID tags, including time domain reflectometry based chipless RFID.

This document is a list of upcoming events in the fields of technology and engineering. It includes conferences and symposiums taking place in various locations around the world, such as Paris, France; Fort Lauderdale, Florida; Cincinnati, Ohio; Las Vegas, Nevada; Munich, Germany; and Bali, Indonesia. The document also mentions an online panel series on 5G/6G technology and provides information on upcoming deadlines for submitting papers to conferences. [Extracted from the article]

The article focuses on the necessity of developing a comprehensive roadmap for new commercially available spectrum to ensure the successful deployment of future mobile networks, as highlighted in a white paper by 5G Americas titled "The Evolution of 5G Spectrum."

The article discusses the publication and distribution of the 5 generation (5G) executive version white paper from Frankfurt, Germany-based mobile telecommunications association Next Generation Mobile Networks (NGMN) Alliance.

The article focuses on the transformative potential of 3GPP's advancements, particularly in Release 17, toward shaping a future where connectivity is seamlessly integrated into daily life, as highlighted in a white paper by 5G Americas titled "3GPP Technology Trends."

The article presents several invited papers regarding radiofrequency (RF) and microwave electronic design automation (EDA) that support internet of things (IoT) design. Invited papers presented include from software companies including ANSYS, Computer Simulation Technology (CST), and FEKO (Altair Development). Topics of the papers include the use of over-the-air and mobile/base station antennas from baseband to RF, simulation of wearable antennas, and 5G antenna designs for mobile phones.

The article reports on the release of a white paper entitled "An Economical Alternative to Boundary Scan in Memory Devices," by the IEEE PI58I Working Group. The study offers an overview of the proposed standard that defines a low-overhead design-for-test methodology to be implemented in memory devices.

The article offers information on IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposium for microwave technologists, technical paper presentations, workshops and commercial exhibitions featuring equipment’s from Analog Devices, MathWorks and National Instruments.

The article discusses on the transformation of measuring electromagnetic interference (EMI) through digital EMI receivers. Topics mentioned include the compliance on Comité International Spécial des Perturbations Radioélectriques (CISPR) specifications to achieve the minimum performance speed levels, the white paper of measurement equipment maker Rohde & Schwarz that explains the benefits, and the insight of engineer Mark Terrien on fast fourier transform (FFT) analysis.

He told me that he was contacting his vision benefit company so that he could get his benefit back and go somewhere else. He opted for single vision computer glasses on an as-needed basis. The patient looked easy on paper: late 40s, getting hard to see up close, distance vision 20/15 in each eye uncorrected. [Extracted from the article]

This article presents information on the 2005 International Microwave Symposium to be held in Long Beach, California in June 11, 2005. There are nine hotels with convention rates. Five of these are downtown within walking distance of the convention center. There are six guest program tours for either full or half days plus a golf tournament on June 17, 2005. All of the tour busses load at the entrance of the Hyatt Hotel. This year there will be 344 papers presented in seven parallel regular IMS sessions plus an additional 149 papers presented in the open forum format. There will be 160 papers presented in tbe RFIC sessions.

The article presents information on 2004 IEEE MTT-S technical programs. Nonlinear device modeling session deals with nonlinear modeling of LDMOS devices. Papers describe formulations and results for IMD an ACPR prediction in GaN as well as electrothermal effects. Five sessions are presented in the theory and design of power dividers. The first paper covers a reconfigurable power-division tehnique using coupled lines or hybrid. The second paper describes a phase combiner for power amplifiers. The third paper presents a multiway power divider with arbitrary terminating impedences.

This article updates previous papers discussing significant developments, trends and breakthroughs in radar, phased arrays and the underlying technologies that enable them.1-8 [ABSTRACT FROM AUTHOR]

The article discusses the Wireless Broadband Alliance (WBA) published a paper which explores how Wi-Fi's latest features are ideal for meeting the demanding requirements for a wide variety of existing and emerging IIoT applications.

The article discusses the challenges of low-level signals measurement subject to thermally induced voltage errors or Seebeck effect as applied to low-level switching applications. Topics mentioned include the reed relay products from VTI instruments, Littlefuse general purpose HE3600 500-ma/200VDC reed relay and the National Instruments technical paper instructions to reduce thermal error voltages.

The article offers information about a research paper Antenna Design Challenges for New-Generation Nano Satellites. Topics discussed include the challenges faced during the standardization of satellites infrastructure and communication capabilities, impact of size of satellite as well as size and weight restrictions of launch vehicle on the development of antennas and impact of external factors on the performance of antennas. It further discusses importance of shape of the deployed antennas.

The article discusses publication of a new white paper entitled Mobile Communications Towards 2030 by 5G Americas, which details how the industry will continue to build and evolve wireless communications networks for consumers and enterprises.

The article reviews the production of two- and three-dimensional (2D/3D) wireless sensor modules on paper or liquid crystal polymer (LCP) substrates using inkjet printers and nanosilver ink technology. An overview is provided of printed wireless module fabrication, including antennas, carbon nanotube sensors, and power scavengers. The possible applications for these printed modules include power sources for radio frequency identification (RFID) and wireless sensor networks.

In this paper, the figures of merit for a satellite-terrestrial handset with internal and external antennas are extracted, based on the antenna measurements with the handset mechanics in free space. The gain statistics are derived from the measured antenna patterns. The antenna noise temperature is calculated from the sky brightness, the antenna efficiency and loss, and a few critical conclusions are obtained. [ABSTRACT FROM AUTHOR]

The article discusses the standards of electromagnetic compatibility (EMC) testing. A brief overview is given on two actual test examples which illustrate the range of situations facing EMC test laboratories. It describes the EMC test compliance achieved by Komatsu and General Motors. It also discusses the approach for dealing with EMC for one's next design project. Information is given on the evolution of EMC standards and EMC requirements. It outlines the specific recommendations of the Intertek white paper involving EMC test compliance.

The article discusses several forms of vision system user online help. A selection matrix is the most common form of user help on many web sites and in most cases, these are product-oriented rather than application-oriented. Other sources of user help include technical notes, case studies and white papers which can provide useful information. A number of companies also publish their own online newsletters, which often contain helpful application stories. On the other hand, training programs are offered by many suppliers.

The object of this paper is to outline the present state of art in the high power microwave field with special emphasis on linear beam circuits interacting with periodically loaded waveguides. A number of interaction circuits are discussed, both for "O" and "M" type tubes and areas of advances and future trends are indicated. [ABSTRACT FROM AUTHOR]

The article offers news briefs related to engineering in the U.S. The Institute of Electrical and Electronics Engineers Inc.(IEEE) International Reliability Physics Symposium (IRPS) 46th annual conference will feature new technical sessions and invited papers about microelectronic. RF Micro Devices Inc. has acquired Filtronic Compound Semiconductors Ltd. AAE Systems Inc. expanded its operations with the opening of an office in India to provide regional sales, engineering and customer support.

The article reports on the development of beam-forming network for European satellite antennas which is known to be connected to that of beam-forming networks. Related topics discussed include a proposal for a beam-forming network classification, beam-forming network topologies, beam-forming network transmission lines and transmission lines. It is concluded that this paper reviewed the basic concepts and techniques of beam-forming networks for satellite multiple beams and reconfigurable antennas.

The article addresses the provision and dissipation of power and electric current in wafer testing. It discusses improvements to the way power is supplied based on papers at the SouthWest Test Workshop. It describes a vertical probe card with added SmartClamp overcurrent protection. It analyzes the power supply-to-device under test electrical current path.

Microwave Week included the MTT-S international Microwave Symposium and Exhibition, as well as the 2004 IEEE Radio Frequency Integrated Circuit Symposium. Robert L. Leheny of DARPA and Michael J. Marcus of the Federal Communications Commission appropriately launched IMS 2004 with inspiring plenary speeches. They are to be congratulated on assembling a very talented technical program committee and presenting an unusually comprehensive and informative program. In addition, there were 141-student papers presented always one of the highlights of Microwave Week.

Presents information on the 2003 IEEE MTT-S International Microwave Symposium held from June 18 through 13, 2003 in Philadelphia, Pennsylvania. Number of research papers received for the symposium; Social events of the symposium; Details of the exhibition also held during the symposium.

Highlights the IMS 2002 symposium and exhibition at the Washington State Convention and Trade Center in Seattle, Washington. Overview of technical papers accepted for the symposium; Social events; Details on industry exhibition.

The article focuses on fifth generation (5G) networks having just finished their second year in existence, wireless industry leaders are exploring the path to future wireless networks beyond 5G. Topics include the 5G Americas has announced the publication of a white paper Mobile Communications Beyond 2020 The Evolution of 5G Toward Next G, and the global work from several academic and industry presents potential use cases and technologies integral to the evolution of 5G toward the "Next G."

The article offers information on the history of developments of Nokia Corporation from the 19th century to the 20th century and the new technology they are focusing for the 21st century in Finland. It states that the company got its name from the Nokianvirta river. It notes that Nokia started by making paper which is considered to be the original communications technology. It mentions several Nokia Research Centers (NRC) locations which includes NRC Helsinki, Finland, NRC Cambridge, U.S., and NRC Hollywood in Los Angeles, California, U.S.

The article summarizes four research papers on the fidelity and integrity of high-speed signal within a device or on a printed circuit board (PCB). The first paper examined the relationship between a pair of traces carrying a differential signal and two vias carrying a different differential signal. Another paper studied the signal imbalance that ground-return has on nearby differential pairs of vias. A third paper investigated shared anti-pads and higher order modes of current propagation.

The article focuses on successful deployment of fifth generation (5G) of mobile network operators need transport technologies that can meet stringent throughput, latency and reliability requirements over increasingly has densified. Topics icnlude the wireless industry trade association and voice of 5G and LTE for the Americas, and the published a white paper highlighting new innovative backhaul, midhaul and fronthaul transport technologies for 5G network.

Discusses ultrawideband (UWB) technology testing. Procedures used for testing such technology; Developments in testing standards for ultrawideband devices; Technical considerations with UWB discussed in the report "Consultation Paper on the Introduction of Wireless Systems Using Ultrawideband Technology" published by Industry Canada.

The article discusses various papers published within the issue, including one by Ted Saad about his experiences on the 1967 IMS Boston conference, another by Richard Mumford on an interview with 2009 IMS Plenary Speaker Peterri Alinikula, and one by Gayle Collins on the PA papers being delivered at IMS and their potential effects on the field.

The article offers information on the recently approved Association for Automated Identification and Mobility (AIM) Direct Part Mark (DPM) Quality Guideline DPM-1-2006, which is intended to handle a variety of marking techniques and part materials used in DPM applications. The metrics and methods that comprise the AIM DPM standard for assessing a mark's quality are discussed.

The article discusses whether scientists have developed a full-scale production memristor, a chip which is supposed to change its resistance according to its past electrical history and to work like a human brain's neurons. It focuses on the U.S. Defense Advanced Research Projects Agency's efforts to develop prototypes of memristor. It also refers to white papers from startup Knowm, founded by Alex Nugent, which claims to develop memristors with bidirectional incremental learning capability.

The article reports on the white paper from ISCO International Inc. which discusses the statistical distributions of traffic and interference in 3G networks. The white paper determines how poor correlation between measured traffic and uplink channel power can be used to assess interference severity. It is concluded that the application of a more network-centric approach represents a more proactive approach to interference management.

An introduction to the journal is presented in which the editor discusses several papers published within the issue concerning passive designs from the journal's divider/combiner/coupler files and technical papers on filter performance including one that incorporate a balun and another that consists of a bandpass filter to improve balanced port characteristics.

Reports that the Institute of Electrical and Electronics Engineers (IEEE) has formed an interest group in July 2003 that will develop an alternative physical layer for the IEEE wireless personal area networks (WPAN) standard. Details of the call for papers issued by the interest group; Overview of research papers about telecommunication systems that were presented during the group's initial meeting in Singapore in September 2003.

The article offers forecasts concerning telecommunications, mass media and the Internet industry worldwide. A research entitled "UWB 2008: Short-Term Problems and Long-Term Potential," by In-Stat shows that the ultra-wideband (UWB) technology market experienced setbacks in 2008 but will show progress in 2009. Meanwhile, ABI Research's white paper "What Isn't Going to Happen in 2009," looks into possible innovations in digital media, mobile communications and wireless fidelity (WiFi). Moreover, M/C Venture Partners predicts that the economic downturn will create investment opportunities in the communications and media sectors in 2009.

The article discusses the forthcoming 2008 Institute of Electrical and Electronics Engineers/Microwave Theory and Techniques Society (IEEE/MTT-S) International Microwave Symposium (IMS) to be held in Atlanta, Georgia from June 15 to 20, 2008. The event will include a student paper competition as well as three design competitions which is conducted by 240 reviewers on the Technical Program committee for the interactive forums. The event has historically been the premier opportunity to observe and showcase the latest technology while networking with other attendees. Organizers also rearranged the schedules of the regular sessions to allow the IMS attendees to have more flexibility to attend the sessions on radio frequency integrated circuit (RFIC).

The article reports on the paper "LTE-Advanced Carrier Aggregation Deployments: Peak Speeds," by Global mobile Suppliers Association (GSA) which confirms that 20 operators launched 300 Mpbs Category 6 Long-Term Evolution (LTE) Adavanced services in 15 countries including Austria, Spain and Russia.

The article discusses the paper "NBMC Tackles Human Performance Monitoring, Medical Diagnostics," published within the issue.

The article presents a step-by-step instruction for making a ring using a ribbon of paper, comic strip on how to keep the day occupied, and a poem by Eleanor Ninestein.