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Discusses a study on the assembly of solder flip chip devices. Background on the flip chip assembly process; Methods of applying flux for the flip chip investigated; Placement accuracy of a traditional SMT pick-and-place system; Results of the reliability testing.

Argues that cost-cutting should not be the basis for a manufacturer's entire competitive strategy in the U.S.. Cost-cutting measures implemented by American manufacturers; Need for game-changing solutions in the manufacturing sector; Potential growth of countries that are able to come up with innovative solutions that minimize the consumption of natural resources; American manufacturers' need to create new markets through innovation.