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1. Reducing Flip Chip BGA Open and Short Fail Rate.

Author

Ah-San Kyu, Hua, Dichen James, and Li, C.Y.

Subjects
*BALL grid array technology, *ELECTRONIC packaging
Abstract

Studies how to overcome the open and short fail rate of flip chip ball grid array package. Structural difference of FCBGA with wire bond package; Factors that contribute to the formation of solder bridge.

Published
2003

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