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The article discusses the electronics industry in 2011. Topics covered include disruptions to the supply chain from disasters like the March 11, 2011 earthquake in Japan, the shortage of rare-earth materials, and counterfeit chips. Also mentioned are measures to address counterfeit electronic parts in the supply system.

The article offers a look at supply chain issues faced by the electronics industry in 2011. One of the factors that influenced supply chain visibility was the rise of Internet trading. It notes the damage brought by the March 11 earthquake and tsunami in Japan on the supply chain. Information on Renesas' three-pronged plan for the redundancy program is provided. Other issues faced by the industry were increasing rarity of rare-earth materials and a rise in chip counterfeiting.

The article informs that information technology company Toshiba has decided to close its flash memory production business except the NAND flash memory products.

Details the separation of peptides by hydrophilic interaction chromatography using Tosoh Bioscience's TSKgel Amide-80. Experimental conditions; Effect of various acids on separation of peptides with TSKgel Amide-80.

The article deals with the competitive advantage that natural gas is gaining over coal and other power generation sources in the U.S. Increased natural gas supplies and increased regulatory hostility to coal are cited as reasons for the increasing interest in natural gas as energy source for generating power. The U.S. Environmental Protection (EPA) is said to have made regulatory actions that discourage coal mining and coal combustion.

Discusses the popularity of package-on-package (PoP) systems among original equipment manufacturers as a mean of packaging microelectronics in the U.S. Capability of the technology to provide the space-saving of three-dimensional technology; Advantage in addressing the complexities of the design rule for Silicone devices; Challenges associated with the PoP concept.

Presents letters to the editor referencing articles discussed in previous issues. "Agencies: Reach Out to Future MBAs," which criticizes agencies for not getting involved with the promotion of their profession in business schools; "Hellbent for the Digital Highway," which analyzes the competitive long distance market; "An Adman's Struggle With Joe Camel and Free Speech," which deals with Joe Camel.

Discusses the benefits of a co-design effort among various engineering groups such as silicon, integrated circuit package and printed circuit board designers in designing a system-in-package. Limitations of stacked-die packaging; Effect of package solutions on silicon design or process technology; Challenges in designing cost-effective radio frequency system-in-packages for wireless local and personal area networks and Bluetooth applications.