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1. ISSCC: 3D integration panel, IMEC's low-cost TSV.

Author

J. M.

Subjects
*CONFERENCES & conventions, *SOLID state electronics
Abstract

Information on the Institute of Electrical & Electronics Engineers Inc. (IEEE) International Solid-State Circuits Conference (ISSCC) 2010 held on February 7-11, 2010 in San Franscisco, California is presented. The conference centered on three-dimensional (3D) integration technologies such as system-in-package, through-silicon via (TSV) and contactless chip-to-chip communication. In addition, Intel Corp. also presented papers on 32 nanometers "Westmere" processors.

Published
2010