1. Origins of HDI stress in copper–brass laminates with dual-heterostructured interfaces.
- Author
-
Zhou, Zhongchen, Wang, Yanfei, Li, Jiansheng, Mao, Qingzhong, Liu, Yi, Yue, Yu, and Li, Yusheng
- Subjects
- *
DIFFUSION bonding (Metals) , *STRAINS & stresses (Mechanics) , *CRYSTAL grain boundaries , *LAMINATED materials - Abstract
In this work, a copper–brass hetero-laminate with dual-heterostructured interfaces was fabricated by diffusion welding in combination with cold deformation and annealing. These dual-heterostructured interfaces possess the characteristics of both gradient interface and sharp interface. The evolutions of geometrically necessary dislocations (GNDs) and local strains near these dual-heterostructured interfaces were investigated by in-situ and quasi in-situ tests. By employing a constitutive model, the evolutions of GND density and the HDI synergistic strengthening mechanism were systematically explored. The results demonstrated that the distribution of GNDs and local strains near the coarse/fine-grained interface exhibited a gradient feature, without any obvious concentrations of GNDs and strains, which can be attributed to the transition effect of the gradient interface. Furthermore, the density of sample-scale GNDs accumulated near the coarse/fine-grained interface was found to be at least one order of magnitude lower than that of grain-scale GNDs accumulated near grain boundaries. Both the constitutive model and experimental results confirmed that grain-scale GNDs serve as the primary origins of significant HDI stress, rather than the sample-scale GNDs. • GND density and local strains distribute in gradient manner near the coarse/fine-grained interface. • Numerous grain-scale GNDs accumulate around GBs to accommodate the strain gradient between adjacent grains. • A small number of sample-scale GNDs accumulate around the coarse/fine-grained interface. • HDI strengthening originates largely from the accumulation of grain-scale GNDs, rather than the sample-scale GNDs. [ABSTRACT FROM AUTHOR]
- Published
- 2024
- Full Text
- View/download PDF