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With the concept of peak carbon emission and carbon neutrality proposed in the 21st century, the shipping industry, which accounts for more carbon emissions, began to seek the transformation of clean ships. The International Maritime Organization (IMO) has issued a series of regulations and measures in recent years requiring the completion of the shipping industry decarbonization by 2050. However, carbon capture and storage (CCS) technology is currently seen as an effective way to reduce CO 2 emissions from the shipping industry in the absence of mature applications for clean fuels. This paper summarized the research progress of ship-based carbon capture technology. The application maturity of different carbon capture technologies in the field of the shipping industry is analyzed and compared. The transport and storage methods of CO 2 are also introduced. Based on the current research status, the challenges of carbon capture technology in the shipping industry and the prospects of future technology development are put forward. [ABSTRACT FROM AUTHOR]

[Display omitted] • The PCM used to control the chip temperature is summarized. • The research methods and results of PCM being encapsulated in chip modules are reviewed. • The standard for selecting chip-level PCM is proposed. • A structure to solve the PCM leakage problem and a theory of selecting PCM on the micro-scale are introduced. With the rapid development of integrated circuits, chips are gradually miniaturized, but the number of transistors inside them increases exponentially, which increases the complexity and power density of the chip. The increase in power density makes the peak temperature of the chip higher, which reduces the chip's performance and shortens its life. Heat management using the latent heat storage(LHS) technique is nowadays employed to reduce the chip's temperature peak. This paper reviews the theoretical basis of phase change materials(PCMs) applied to chip thermal management technology and summarizes the application progress of PCMs in electric chip thermal management through the research of recent related literature. This paper is composed of three parts. The first part introduces different types of PCMs used in the field of chip thermal management, especially composite PCMs. The second part discusses non-embedded cooling solutions, focusing on analyzing the effect of using thermal conductivity enhancers (TCE) to improve the thermal performance of the PCM heat sink. The third part is a pioneering review of the research methods and conclusions of embedded cooling, showing that the application of PCM on the micro-scale has an important effect on suppressing the temperature peak of electronic chips. [ABSTRACT FROM AUTHOR]

With the rapid increase of the thermal power of electronic devices, phase change material(PCM) have shown great application prospects in the field of electronic thermal management. However, due to the irregular surface of the electronic device, PCM can only act on the back of the component or the outside of the package, which leads to the occurrence of heat transfer hysteresis. In order to reduce the heat transfer distance between the heat source and PCM, a new type of ER/SAT/DSP composite functional material with thermal control function was prepared in this paper to solve the key technical problem of fluid seamless packaging thermal control. The composite material is encapsulated in a fluid state and will no longer melt after solidification. Through thermophysical experiments and morphological characterization, the results show that when the mass fraction of PCM is 35%, the composite material has the best physical properties and application performance. And after 200 thermal cycles, the leakage rate is only 3.7%. Through the PTC thermal control experiment, the results show that the maximum temperature at different positions of the device for pouring the new composite was reduced by 7.4 °C and 8.1 °C, respectively, and the operation time corresponding to different temperatures was increased by 5.76 times, 5.80 times and 6.98 times, respectively. Therefore, the composite material shows a good thermal control ability for electronic components of any surface shape. [ABSTRACT FROM AUTHOR]