1. FOWLP and embedded packaging.
- Author
-
Garrou, Phil
- Subjects
- *
EMBEDDED computer systems , *SEMICONDUCTOR industry , *PACKAGING , *PERFORMANCE standards , *MANAGEMENT ,UNITED States economy - Abstract
The article explores on the concept of fan-out wafer level packaging (FOWLP) and embedded packaging of the semiconductor industry in the U.S. It highlights the benefits of FOWLP and embedded packaging wherein it improve electrical and thermal performance of the mobile market. It examines the impact of technical challenges to the packaging systems including die shift, topography, warpage and chip-to- mold non planarity.
- Published
- 2015