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Intelligent materials possess the function of self‐judgment and self‐optimization while sensing external stimuli such as stress, temperature, moisture, pH, electric or magnetic fields, or light. Besides, they often require self‐healing—the ability to repair damage spontaneously—or shape‐memory—the ability to return from a deformed state to their original shape induced by an external stimulus. Introducing such intelligence into superconducting (SC) devices is highly desirable to meet the critical requirement of maintenance‐free performance. Here, self‐healing and shape‐memory functions are realized in liquid metal based SC devices using smart packaging polymers. Without deteriorating their superconductivity, the SC devices can repair themselves by simply raising the temperature, without any other treatment. Beyond the specific functions achieved here, this work sheds new light on future SC devices with advanced functions such as self‐diagnosis, self‐adjusting, and sensing. [ABSTRACT FROM AUTHOR]

Three-dimensional (3D) printing has emerged as an attractive manufacturing technique because of its exceptional freedom in accessing geometrically complex customizable products. Its potential for mass manufacturing, however, is hampered by its low manufacturing efficiency (print speed) and insufficient product quality (mechanical properties). Recent progresses in ultra-fast 3D printing of photo-polymers 1-5 have alleviated the issue of manufacturing efficiency, but the mechanical performance of typical printed polymers still falls far behind what is achievable with conventional processing techniques. This is because of the printing requirements that restrict the molecular design towards achieving high mechanical performance. Here we report a 3D photo-printable resin chemistry that yields an elastomer with tensile strength of 94.6 MPa and toughness of 310.4 MJ m -3 , both of which far exceed that of any 3D printed elastomer 6-10 . Mechanistically, this is achieved by the dynamic covalent bonds in the printed polymer that allow network topological reconfiguration. This facilitates the formation of hierarchical hydrogen bonds (in particular, amide hydrogen bonds), micro-phase separation and interpenetration architecture, which contribute synergistically to superior mechanical performance. Our work suggests a brighter future for mass manufacturing using 3D printing., (© 2024. The Author(s), under exclusive licence to Springer Nature Limited.)