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Spherical explosives had regular shape and smooth surface, which gave them low sensitivity, excellent flowability, and high bulk density, thereby yield good charging performance. Traditional spherization methods always resulted in irregular shape, low sphericity, and uneven size. In this paper, a novel droplet microfluidic technology was used to fabricate hexanitrostilbene (HNS) microspherical with nitrocellulose (NC) as adhesive. The farication process (e. g., HNS concentration, NC concentration, flow rate) was fully investigated in pursuing for the ideal farication condition. The chemical structures, crystalline structures, and thermal stability of HNS were preserved. Meanwhile, the flowability and bulk density of HNS microspheres were significantly improved (Repose angle: HNS microsphere vs raw HNS, 33.1 vs 39.2°; bulk density: HNS microsphere vs raw HNS, 0.466 vs 0.301 g cm−3), which enhanced the charging and pressing performance of HNS.

The aim of the present work is to design a copper azide precursor direct writing ink for primary explosive-on-a-chip. The mixture of water/vinyl alcohol and isopropanol/ethyl cellulose was used as binder. Cetyltrimethylammonium bromide (CTAB) used as foaming agent and dodecanol as foam stabilizer were added into the binder to produce plenty of bubbles. 40 wt% of nano-copper powder was added into the binder and the three-dimensional porous precursor ink was obtained. After 24 h of in-situ gas–solid azide reaction, the copper precursor ink was completely transformed into copper azide. An explosive device was designed to verify the detonation performance of the copper azide by direct writing, and the result showed that it can reliably initiate the CL-20 into complete detonation.

Resistivity of Plane-film Energy Conversion Components is a key parameter to influence its resistance and explosive performance, and also it has important relations with the preparation of thin film technology, scale, structure and etc. In order to improve the design of Energy Conversion Components for MEMS Initiating Explosive Device, and reduce the design deviation of Energy Conversion Components in microscale, guarantee the design resistance and ignition performance of MEMS Initiating Explosive Device, this paper theoretically analyzed the influence factors of film resistivity in microscale, through the preparation of Al film and Ni-Cr film at different thickness with micro/nano, then obtain the film resistivity parameter of the typical metal under different thickness, and reveals the effect rule of the scale to the resistivity in microscale, at the same time we obtain the corresponding inflection point data.