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With high-temperature power devices available, the support circuitry required for efficient operation, such as a gate driver, is needed as part of a complete high-temperature solution. The design of an integrated silicon carbide (SiC) gate driver using a 1.2-μm complementary metal–oxide–semiconductor (CMOS) process is presented. Adjustable drive strength is added to facilitate a minimal external component requirement for high-temperature power modules and lays the groundwork for dynamic adjustment of drive strength. The adjustable drive strength feature demonstrates a capability of reducing overshoot and controlling dv/dt dynamically. Measurement of the gate driver was performed driving a power mosfet gate over temperature, exceeding 500 °C. High-speed and high-voltage room temperature evaluation is provided, demonstrating a system capable of high performance over temperature. The driver accomplishes better than 75 ns of rise and fall time driving the Cree CPM3-0900-0065B from room temperature to over 500 °C indicating that it will be ideal for integration into an all-SiC power module where driver, protection circuits, and power devices are fabricated in SiC. [ABSTRACT FROM AUTHOR]

This paper describes a silicon carbide pulse width modulation (PWM) signal generator in the 1.2 μm HiTSiC CMOS process developed by Raytheon Systems Ltd. The design features a 6-b binary input, which allows for setting a system's duty cycle. The results presented in this paper utilize a field programmable gate array board in the test setup to dynamically set the duty cycle by controlling each bit. A control current is also available to give the user added flexibility for tuning the duty cycle. Experimental results show the duty cycle range of the PWM generator to be between 4.7% and 95.2% at 400 °C. Sustained operation of the circuit is demonstrated over a period of 50 h at 300 °C. Finally, the PWM generator is evaluated in the operation of a boost converter. [ABSTRACT FROM PUBLISHER]

In the last decade, significant effort has been expended toward the development of reliable, high-temperature integrated circuits. Designs based on a variety of active semiconductor devices including junction field-effect transistors and metal-oxidesemiconductor (MOS) field-effect transistors have been pursued and demonstrated. More recently, advances in low-power complementary MOS (CMOS) devices have enabled the development of highly integrated digital, analog, and mixed-signal integrated circuits. The results of elevated temperature testing (as high as 500°C) of several building block circuits for extended periods (up to 100 h) are presented. These designs, created using the Raytheon UK's HiTSiC® CMOS process, present the densest, lowest-power integrated circuit technology capable of operating at extreme temperatures for any period. Based on these results, Venus nominal temperature (470°C) transistor models and gate-level timing models were created using parasitic extracted simulations. The complete CMOS digital gate library is suitable for logic synthesis and lays the foundation for complex integrated circuits, such as a microcontroller. A 16-bit microcontroller, based on the OpenMSP 16-bit core, is demonstrated through physical design and simulation in SiC-CMOS, with an eye for Venus as well as terrestrial applications. [ABSTRACT FROM AUTHOR]