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Gallium nitride (GaN) devices are generally more prone to severe switching oscillations than Si mosfets due to their fast switching speeds. Different from Si and SiC mosfets, GaN devices typically have a lower maximum gate voltage rating. Taking the Efficient Power Conversion Corporation series as an example, the gate drive voltage is usually 5 V, but the maximum voltage rating is 6 V. Therefore, GaN devices are more susceptible to damage from gate-source voltage oscillation. In this letter, a gate drive circuit with a clamping function is proposed to suppress gate-source voltage oscillation. The adopted method can not only clamp the gate voltage of the GaN device near the drive voltage to protect the device, but also does not affect the switching speed of the device. The proposed method mainly uses some passive components that make the circuit design simpler compared with other active gate driver methods. Finally, the effectiveness of the proposed method is verified by experiments. [ABSTRACT FROM AUTHOR]

With high-temperature power devices available, the support circuitry required for efficient operation, such as a gate driver, is needed as part of a complete high-temperature solution. The design of an integrated silicon carbide (SiC) gate driver using a 1.2-μm complementary metal–oxide–semiconductor (CMOS) process is presented. Adjustable drive strength is added to facilitate a minimal external component requirement for high-temperature power modules and lays the groundwork for dynamic adjustment of drive strength. The adjustable drive strength feature demonstrates a capability of reducing overshoot and controlling dv/dt dynamically. Measurement of the gate driver was performed driving a power mosfet gate over temperature, exceeding 500 °C. High-speed and high-voltage room temperature evaluation is provided, demonstrating a system capable of high performance over temperature. The driver accomplishes better than 75 ns of rise and fall time driving the Cree CPM3-0900-0065B from room temperature to over 500 °C indicating that it will be ideal for integration into an all-SiC power module where driver, protection circuits, and power devices are fabricated in SiC. [ABSTRACT FROM AUTHOR]

This paper describes a silicon carbide pulse width modulation (PWM) signal generator in the 1.2 μm HiTSiC CMOS process developed by Raytheon Systems Ltd. The design features a 6-b binary input, which allows for setting a system's duty cycle. The results presented in this paper utilize a field programmable gate array board in the test setup to dynamically set the duty cycle by controlling each bit. A control current is also available to give the user added flexibility for tuning the duty cycle. Experimental results show the duty cycle range of the PWM generator to be between 4.7% and 95.2% at 400 °C. Sustained operation of the circuit is demonstrated over a period of 50 h at 300 °C. Finally, the PWM generator is evaluated in the operation of a boost converter. [ABSTRACT FROM PUBLISHER]

The need for dependable digital circuitry with the capability to operate reliably in high-temperature environments has been increasing drastically in applications such as automobile, aerospace, oil exploration, and power electronics. However, wide temperature swings significantly alter the threshold voltage of individual transistors, which adversely affects circuit timing in traditional synchronous designs. Such timing changes may in turn violates the setup and hold times of the clocked components, leading to potential circuit failure. This paper presents a complex digital integrated circuit design methodology using both synchronous and asynchronous logic for comparison in a young silicon carbide (SiC) design process developed by Raytheon UK. Seventeen circuits were designed, fabricated, and tested with results showing correct operation at temperatures at and above the target temperature of 300 °C. [ABSTRACT FROM PUBLISHER]