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2D-NoCs have been the mainstream approach used to interconnect multi-core systems. 3D-NoCs have emerged to compensate for deficiencies of 2D-NoCs such as long latency and power overhead. A low-latency routing algorithm for 3D-NoC is designed to accommodate high-speed communication between cores. Both simulation and analytical models are applied to estimate the communication latency of NoCs. Generally, simulations are time-consuming and slow down the design process. Analytical models provide, within a fraction of the time, nearly accurate results which can be used by simulation to fine-tune the design. In this paper, a high performance and adaptive routing algorithm has been proposed for partially connected 3D-NoCs. Latency of the routing algorithm under different traffic patterns, different number of elevators and different elevator assignment mechanisms are reported. An analytical model, tailored to the adaptivity of the algorithm and under low traffic scenarios, has been developed and the results have been verified by simulation. According to the results, simulation and analytical results are consistent within a 10 percent margin. [ABSTRACT FROM AUTHOR]

The movement toward 3D fabrication coupled with Network-on-Chip (NoC) aims to improve area, performance, power, and scalability of many-core systems. However, reliability issue as a perpetual challenge in advanced silicon technology imperils it. Aging is an emerging reliability concern, which degrades the system's performance and causes timing failure eventually. Bias-Temperature-Instability (BTI) and Hot-Carrier-Injection (HCI) are the dominant aging mechanisms, which escalate in high temperature and stress (i.e., usage). In addition to the intra-layer temperature variations, 3D NoCs experience inter-layer temperature variations, which demand necessary investigations for aging as compared to 2D NoC. In this paper, we propose AROMa, an aging-aware deadlock-free adaptive routing algorithm integrated with a novel online aging monitoring system for 3D NoCs. The monitoring system in AROMa exploits Distributed-Centralized-Aging-Table (D-CAT) to obtain routers’ aging rates for each layer of 3D NoCs periodically. Consequently, AROMa swaps between different k-best source-destination shortest paths periodically to avoid highly aged routers, force them in recovery phase of BTI, and accordingly balance aging in the network. We prove that AROMa is deadlock free. Our extensive experimental analysis using gem5 full system mode for PARSEC and SPLASH-2 benchmark suites concludes that AROMa outperforms state-of-the-art works while improving age imbalance by 70 percent and maximum age by 35 percent in 3D NoC with negligible overheads. [ABSTRACT FROM AUTHOR]

Fault-tolerant minimal routing algorithms aim at finding a Manhattan path between the source and destination nodes and route around all faulty nodes. Additionally, some non-faulty nodes that are helpless to make up of a fault-tolerant minimal path should also be routed around. How to label such non-faulty nodes efficiently is a major challenge. State-of-the-art solutions could not address it very well. We propose a path-counter method. It can label every node that are helpless to make up of a fault-tolerant minimal path with low time complexity. By counter the number of fault-tolerant minimal paths, it can: support arbitrary fault distribution, check the existence of fault-tolerant minimal paths, not sacrifice any available fault-tolerant minimal paths. [ABSTRACT FROM AUTHOR]

3D ICs can take advantage of a scalable communication platform, commonly referred to as the Networks-on-Chip (NoC). In the basic form of 3D-NoC, all routers are vertically connected. Partially connected 3D-NoC has emerged because of physical limitations of using vertical links. Routing is of great importance in such partially connected architectures. A high-performance, fault-tolerant and adaptive routing strategy with respect to the communication flow among the cores is crucial while freedom from livelock and deadlock has to be guaranteed. In this paper we introduce a new routing algorithm for partially connected 3D-NoCs. The routing algorithm is adaptive and tolerates the faults on vertical links as compared to the predesigned routing algorithms. Our results show a $40-50\%$ improvement in the fraction of intact inter-level communications when the fault tolerant algorithm is used. This routing algorithm is light-weight and has only one virtual channel along the $Y$ dimension. [ABSTRACT FROM AUTHOR]

Reliability is one of the most challenging problems in the context of three-dimensional network-on-chip (3D NoC) systems. Reliability analysis is prominent for early stages of the manufacturing process in order to prevent costly redesigns of a target system. This article classifies the potential physical faults of a baseline TSV-based 3D NoC architecture by targeting two-dimensional (2D) NoC components and their inter-die connections. In this paper, through-silicon via (TSV) issues, thermal concerns, and single event effect (SEE) are investigated and categorized, in order to propose evaluation metrics for inspecting the resiliency of 3D NoC designs. A reliability analysis for major source of faults is reported in this article separately based on their mean time to failure (MTTF). TSV failure probability induced by inductive and capacitive coupling is also discussed. Finally, the paper provides a formal reliability analysis on the aggregated faults that affect TSV. This formal analysis is critical for estimating the resiliency of different components in order to mitigate the redundancy cost of fault-tolerant design or to examine the efficiency of any proposed fault-tolerant methods for 3D NoC architectures. [ABSTRACT FROM PUBLISHER]

NoC technology is composed of packet-based interconnections, where the communication resources are distributed across the network. Therefore, the optimal resource utilization is a crucial consideration for efficient architectural designs. This paper studies the practicality of the Constraint Programming (CP) models for NoC architecture designs that effectively use a regular mesh with wormhole switching and the XY routing. The complexity of the CP models is compared with the earlier Mixed Integer Programming (MIP) models. Practical CP-based mapping and scheduling models are developed and results are reported on the benchmark datasets. Results indicate that mapping and scheduling problems can be solved at near optimality even under relatively shorter run-time limits as compared to those required by the MIP models. [ABSTRACT FROM AUTHOR]

The network-on-chip (NoC) technology allows for integration of a manycore design on a single chip for higher efficiency and scalability. Three-dimensional (3D) NoCs offer several advantages over two-dimensional (2D) NoCs. Through-silicon via (TSV) technology is one of the candidates for implementation of 3D NoCs. TSV reliability analysis is still challenging for 3D NoC designers because of their unique electrical, thermal, and physical characteristics. After providing an overview of common TSV issues, this article aims to define a reliability criterion for NoC and provide a framework for quantifying this reliability as it relates to TSV issues. TSV issues are modeled as a time-invariant failure probability. Also, a reliability criterion for TSV-based NoC is defined. The relationship between NoC reliability and TSV failure is quantified. For the first time, the reliability criterion is reduced to a tractable closed-form expression that requires a single Monte Carlo simulation. Importantly, the Monte Carlo simulation depends only on network geometry. To demonstrate our proposed method, the reliability criterion of a simple 8×8×8 NoC supported by an 8×8×7 network of TSVs is calculated. [ABSTRACT FROM AUTHOR]

This paper discusses heterogeneous Network-on-Chip (NoC) design from a Constraint Programming (CP) perspective and extends the formulation to solving Voltage-Frequency Island (VFI) problem. In general, VFI is a superior design alternative in terms of thermal constraints, power consumption as well as performance considerations. Given a Communication Task Graph (CTG) and subsequent task assignments for cores, cores are allocated to the best possible places on the chip in the first stage to minimize the overall communication cost among cores. We then solve the application scheduling problem to determine the optimum core types from a list of technological alternatives and to minimize the makespan. Moreover, an elegant CP model is proposed to solve VFI problem by mapping and grouping cores at the same time with scheduling the computation tasks as a limited capacity resource allocation model. The paper reports results based on real benchmark datasets from the literature. [ABSTRACT FROM AUTHOR]

Highlights • BC-NoC is an efficient method to reduce network packet latency. • Proposed RIP BC-NoC partitioning method enhances workload consolidation density. • Task communication minimally uses other application resources. • Application tasks can be mapped close to each other in a straight path. • Increased consolidation density & reduced latency improve performance parameters. Abstract The network on a chip (NoC) is considered as the main shared communication resource to avoid compromise the system performance. A strict isolation strategy is employed in the NoC to avoid performance degradation; however, this strategy is accompanied by a low consolidation density or a complex routing mechanism, which leads to considerable latency and high hardware costs. We propose the row irregular partitioning (RIP) method, which results in a high consolidation density compared to regularity-oriented topology. We additionally propose a congestion awareness (CA) mapping scheme in which mapping is performed based on congestion control on a route in a bypass-channel-based NoC (BC-NoC). Furthermore, mapping methods, such as straight path (SP) and straight path and congestion awareness (SP&CA), are recommended to exploit the communication platform properties of BC-NoC. The experimental results show that the average delay in the SP mapping method is improved compared with SP&CA and CA. [ABSTRACT FROM AUTHOR]

Efficient on-chip communication is necessary for exploiting enormous computing power available on a many-core chip. Routing algorithms play a major role for the communication quality and performance of the on-chip interconnection networks. This paper proposes TagNoC, as an on-chip network router architecture with novel hybrid routing approach which reduces latency and power consumption at a fixed cost based on information redundancy. TagNoC is a hybrid routing approach which combines the source and distributed routing methods together. While eliminating packet routing in each router, TagNoC determines the forwarding output port in parallel with input buffering. For a marginal cost increase in header size, as compared to distributed routing techniques, routing latency can be hidden while eliminating power consuming portion of the routing, increasing router throughput and decreasing latency. The proposed TagNoC router is compared to baseline router with distributed routing implementation on a 16-node CMP mesh. Physical implementation of all routers is modeled using synthesized RTL, detailed area analysis, and accurate channel models. Performance evaluation is also carried out utilizing RTL simulation and detailed power analysis on both synthetic and application traffic is performed using post-synthesis gate-level simulation. The simulation results illustrate that TagNoC outperforms as compared to baseline distributed architecture and other source routing methods in terms of power, latency, and throughput. [ABSTRACT FROM AUTHOR]