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Considering potential applications related to superconductivity and aerospace (typically less than 100 K), in this article, the temperature dependence of silicon carbide (SiC) power diodes is systematically characterized and analyzed over a wide temperature range of 90–478 K, especially focusing on cryogenic temperature. First, the static performance degradation mechanism of SiC diodes is established in an ultrawide temperature range, including forward/reverse I-V characteristics and junction capacitance (Cj) characteristics. Second, the reverse recovery characteristics are achieved, including peak reverse recovery current (Irm), reverse recovery charge (Qrr), and switching energy (Esw), clarifying a clearer internal relationship between reverse recovery and junction temperature. Meanwhile, the aforementioned critical parameters are further analyzed on an electrical scale with normal atmosphere temperature, including switching speed range of 62.3–2054.8 A/μs, load current range of 6–30 A, and dc voltage range of 400–1000 V. Third, based on newly proposed power loss analysis method, the continuous operation performance of SiC diodes is quantified and analyzed in actual cryogenic converters. The excellent temperature dependence indicates that SiC diodes have great superiority for extreme applications. Importantly, SiC mosfet's body diode shows the great potential to operate as a freewheeling diode in the compact converter, especially at cryogenic temperature. [ABSTRACT FROM AUTHOR]

In this article, the static, dynamic, and short-circuit properties of 1.2-kV commercial 4H-SiC planar and trench gate metal–oxide–semiconductor field-effect transistors (MOSFETs) are compared and analyzed in a wide temperature range from 90 to 493 K. The temperature-dependent specific ON-resistance (${R}_{\text {sp}- \mathrm{\scriptscriptstyle ON}}$) and threshold voltage (${V}_{\text {th}}$) are analyzed in relation to the density of the interface state. The turn-on rise and turn-off fall times (${T}_{r}$ and ${T}_{f}$) and the corresponding energy loss (${E}_{r}$ and ${E}_{f}$) are extracted from a double-pulse test from cryogenic to high temperature and analyzed. The short-circuit capability of the two structures is studied at low temperature for the first time. The comprehensive comparison and analysis of the planar and trench gate MOSFET versus temperature in this work show the importance to study applications with SiC MOSFETs in a wide temperature range, especially for the cryogenic temperatures. [ABSTRACT FROM AUTHOR]

In this paper, an improved 4H-SiC U-shaped trench-gate metal–oxide–semiconductor field-effect transistors (UMOSFETs) structure with low ON-resistance (${R}_{ \mathrm{\scriptscriptstyle ON}}$) and switching energy loss is proposed. The novel structure features an added n-type region, which reduces ON-resistance of the device significantly while maintaining the breakdown voltage (${V}_{\textsf {BR}}$). In addition, the gate of the improved structure is designed as a p-n junction to reduce the switching energy loss. Simulations by Sentaurus TCAD are carried out to reveal the working mechanism of this improved structure. For the static performance, the ON-resistance and the figure of merit (FOM $= {V}_{\textsf {BR}}^{\textsf {2}}/{R}_{ \mathrm{\scriptscriptstyle ON}}$) of the optimized structure are improved by 40% and 44%, respectively, as compared to a conventional trench MOSFET without the added n-type region and modified gate. For the dynamic performance, the turn-on time (${T}_{ \mathrm{\scriptscriptstyle ON}}$) and turn-off time (${T}_{ \mathrm{\scriptscriptstyle OFF}}$) of the proposed structure are both shorter than that of the conventional structure, bringing a 43% and 30% reduction in turn-on energy loss and total switching energy loss (${E}_{\mathbf {SW}}$). [ABSTRACT FROM AUTHOR]

A novel post-oxidation annealing (POA) process with supercritical N2O (SCN2O) fluid is reported to be highly effective in improving the interface properties of the SiO2/4H–silicon carbide (SiC) (0001) systems. After SCN2O POA, the interface state density reduces to 2.8 × 1011 eV−1cm−2, which is about 3.5 times lower than that after a traditional high-temperature N2O POA process. Meanwhile, the highest oxide critical electric field shows an increase of 18.19% and the near-interfacial oxide traps is reduced by 69.90% compared with that after N2O POA process. The process temperature is as low as 120 °C. The significantly reduced processing temperature avoids additional defect generation while the supercritical state provides a stronger nitridation effect. SCN2O annealing is a promising candidate for POA process toward high-performance SiC power metal-oxide-semiconductor field effect transistors (MOSFETs). [ABSTRACT FROM AUTHOR]