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This article puts forward a hybrid model predictive control (H-MPC) for an inner-interleaved hybrid multilevel converter (IHMC). The sign patterns of the original and shifted reference vectors in the original and virtual space vector diagrams (VSVDs) are used, respectively, to realize the phase-disposition pulsewidth modulation (PWM) and determine the low-frequency switching states. Then, the three adjacent vectors are selected in the second-layer VSVD and the optimal current tracking is safeguarded by the duty cycle optimization of the three adjacent vectors. Finally, through applying the phase-shifted PWM to the two interleaved legs, a constant and doubled equivalent switching frequency can be achieved, which further paves the way for dc-link and floating capacitor voltages balancing and circulating current mitigation with the use of the straightforward duty cycle adjustments. The proposed H-MPC enables the decoupling of the low- and high-frequency stages in the IHMC and also reduces both output current ripples and computational burden while achieving a constant switching frequency simultaneously. Comprehensive simulation and experimental studies on an all silicon carbide prototype verify the effectiveness of the proposed control strategy. [ABSTRACT FROM AUTHOR]

Power module heat dissipation with spatial inhomogeneity and induced nonuniform temperature distribution presents a challenging concern for system reliability due to thermo-mechanical stresses. These reliability challenges are especially important for nonplanar designs using 3-D packaging principles. Here, we develop a heat spreader thermal switch capable of actively reducing temperature gradients between silicon carbide (SiC) devices in a three-level T-type power converter, which can change depending on electronic operating conditions. The heat spreader thermal switch consists of a stainless-steel (SS) heat spreader and a copper sliding switch embedded within the spreader. Heat transfer from the SiC devices and within the spreader can be controlled by moving the slider between positions within the spreader. To understand heat transfer mechanisms and design the heat spreader thermal switch, we conducted 3-D finite element method simulations to calculate the minimum attainable temperature difference between SiC devices. We used the finite element simulation to quantify the reduction in junction temperature swing during dynamic operation and coupled the results to the Coffin–Manson reliability model to quantify lifetime to failure. We integrated the heat spreader thermal switch with one phase of a three-phase T-type converter and demonstrated isothermalization at different working conditions. At 2.4-kW converter power, each hot SiC device dissipated 4.7 W of heat, resulting in a device case temperature of 43 °C, with each cold SiC device dissipating 1.7 W at 38 °C. The device-to-device temperature difference was decreased from 5 °C to 0 °C by moving the switch a distance of 20 mm. Finite volume method (FVM) simulations of the conjugate heat transfer problem validate the experimental results and support analysis of key performance parameters. This work demonstrates successful isothermalization of a power converter with an active heat spreader thermal switch and develops simulation and design guidelines for successful electro-thermal codesign and implementation of thermal switches for other electronics applications for which isothermalization and enhanced device reliability is a key issue. [ABSTRACT FROM AUTHOR]

A series of novel externally reconfigurable power electronic modules (RPEMs) are invented to increase the flexibility of power modules and their application purposes. In this article, the concept of RPEMs, their switching arrangements, and power-module-based architectural design are demonstrated. An RPEM is then designed, analyzed through simulations, and compared with the conventional fixed-configuration power electronic modules. The sizes of the power modules and used power terminals are kept similar to avoid any differences in power loop inductance values solely due to various trace pad sizes. In addition, similar gate/source pads and signal pins are used for all of the designed power modules to have constant switching dynamics in all modules. The comparison results show that the internal parasitic inductance and performance are still comparable with the conventional modules despite having high configurability. The designed RPEM and a conventional full-bridge (FB) power module are fabricated and characterized. The experimental tests show that the difference between the overshoot voltages on both RPEM and FB power modules is less than 2%. Such flexibility without compromising the power module performance decreases the engineering time for designing different power modules for various power electronic converters; hence, the production speed can be improved while decreasing the overall module cost. [ABSTRACT FROM AUTHOR]

This article puts forward a hybrid model predictive control (H-MPC) that enables the decoupling of low- and high-frequency stages in a seven-level hybrid multilevel converter (7L-HMC). It first uses the sign pattern of the reference voltage vector to determine switching states of the low-frequency stage. Next, the reference vector is shifted to the internal hexagon of the original space vector diagram, which is thereby converted to a 120° oblique coordinate system, where the adjacent vectors can be rapidly selected. Then, the optimal current tracking is primarily safeguarded by the duty cycle optimization of the three adjacent vectors. Finally, an optimized symmetric switching sequence minimizing the dc voltage deviation over one control iteration is selected through the assessment of possible switching sequences that are subject to the chosen vectors with optimal duty cycles. The proposed H-MPC method can reduce both the current ripple and computational burden while achieving a constant switching frequency. Comprehensive simulation and experimental comparisons on an all-silicon-carbide 7L-HMC prototype verify the effectiveness of the proposed H-MPC. [ABSTRACT FROM AUTHOR]

In this article, an efficiency-oriented hybrid duty modulation (HDM) scheme is proposed for the dual active bridge (DAB) converter that can reduce the inductor root-mean-square (rms) current and extend the switch soft-switching range. First, a complete description of the combination forms of different modulation schemes is presented considering the allocation of the zero-voltage portion. A unified description for these combination forms is obtained in the frequency domain. Second, the symmetric–symmetric duty modulation (SSDM) scheme and asymmetric–symmetric duty modulation (A2SDM) scheme are established to minimize the inductor rms current by considering its fundamental component. Third, the characteristics of SSDM, A2SDM, and the traditional phase shift modulation schemes are compared from several aspects, mainly including the inductor rms current and the soft-switching performance. Furthermore, the loss breakdown analysis results for the three modulation schemes are presented and compared. According to these results, the HDM scheme is proposed to improve the overall efficiency of the DAB converter. Finally, an experimental prototype was built with a peak efficiency of 97%, which validates the effectiveness of the proposed modulation scheme. [ABSTRACT FROM AUTHOR]

The silicon carbide (SiC) devices have faster switching speed than that of the conventional silicon (Si) devices, which however may cause excessive device voltage overshoot. Larger gate resistance can help to restrain the overshoot, it however slows down the switching speed and increases switching losses. There are other methods that can mitigate the voltage overshoot, e.g., using low-inductance busbars, adding snubber circuits, etc. In this article, the busbar design for a 250-kW SiC three-level T-type inverter is investigated. The current commutation loops (CCLs) are first analyzed using a single-phase equivalent circuit. Then the detailed busbar design methods, especially a 3-D busbar design concept, are proposed to select the optimal stacking order for the multilayer laminated busbar and to address constraints posed by the physical terminal arrangements of SiC modules and dc-link capacitors. The stray inductance in each CCL is extracted via a finite element analysis and validated on the actual inverter busbar prototypes using an impedance analyzer. To further minimize the busbar stray inductance, a hybrid busbar structure with printed circuit board based buffer circuit using high-frequency decoupling capacitors is designed and evaluated in this article. Finally, the effectiveness of the designed busbars as well as the buffer circuit are validated using experimental studies. [ABSTRACT FROM AUTHOR]

The cascaded H-bridge (CHB) inverter is one of the most attractive multilevel topologies for renewable energy applications. Due to the fact that CHB inverters employ a large number of components, they suffer from a higher probability of fault, which reduces the system reliability. A fault-tolerant operation for a CHB inverter is described in this article. New features ensure reliable and robust operation of the converter in the event of a fault. The proposed strategy uses an additional cross-coupled CHB (X-CHB) unit in companion with the existing CHB units to support the output voltage and ensure continuity of operation in the event of an open/short-circuit fault. The operation of the proposed X-CHB inverter is described in detail. Simulation and experimental verification of the proposed concept are demonstrated using a seven-level CHB. Both simulation and experimental results confirm the fault-tolerant operation of the X-CHB for a battery energy storage system in case of switch faults. [ABSTRACT FROM AUTHOR]

This paper presents a three-dimensional (3-D) wire bondless power module using silicon carbide (SiC) power devices. Commercially available SiC power devices are designed for wire bonding. Wire bonds have an inherent parasitic inductance that limits high-frequency switching. This results in an underutilization of the full potential of SiC power devices, which have very low switching losses at high frequencies. Wire-bonded power modules run into a performance ceiling when it comes to ultrafast switching. This paper strives to provide a solution to this issue, which involves reconfiguring a commercially available bare die SiC power device into a flip-chip-capable device. A wire bondless SiC Schottky diode package was demonstrated and its performance was contrasted with a conventional wire-bonded package. A 24% reduction in the ON-state resistance was observed in the wire bondless package. As a next step, wire bondless SiC MOSFET packages were developed and tested in a half-bridge configuration in a highly integrated 3-D arrangement. This approach departs from the conventional concept of a power module—demonstrating a direct-bonded-copper-less and baseplate-less half-bridge switching cell. Double-pulse tests conducted on the cell showed >3× reduction in the parasitic inductance of the 3-D cell as compared with a conventional wire-bonded module. [ABSTRACT FROM AUTHOR]