7 results on '"Chang, Jing-Yao"'
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2. An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate
3. The New Design of Intelligent Power Module for Low Power Motor Drive Applications
4. Electromigration induced spontaneous Ag whisker growth in fine Ag-alloy bonding interconnects: Novel polarity effect
5. Development of Cu-Ag pastes for high temperature sustainable bonding
6. Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
7. Utilization of Zn alloy for the manufacture of automotive power device modules
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