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Sputtered Ti--rich TiNiCu alloys are known to show excellent cyclic stability. Reversibility is mostly influenced by grain size, crystallographic compatibility, and precipitates. Isolating their impact on cyclic stability is difficult. [...]

The exploitation of the elastocaloric effect in superelastic shape memory alloys (SMA) for cooling applications shows a promising energy efficiency potential but requires a better understanding of the non-homogeneous martensitic phase transformation. Temperature profiles on sputter-deposited superelastic $${\mathrm {Ti_{55.2}Ni_{29.3}Cu_{12.7}Co_{2.8}}}$$ shape memory alloy thin films show localized release and absorption of heat during phase transformation induced by tensile deformation with a strong rate dependence. In this paper, a model for the simulation of the thermo-mechanically coupled transformation behavior of superelastic SMA is proposed and its capability to reproduce the mechanical and thermal responses observed during experiments is shown. The procedure for experiment and simulation is designed such that a significant temperature change from the initial temperature is obtained to allow potential cooling applications. The simulation of non-local effects is enabled by the use of a model based on the one-dimensional Müller-Achenbach-Seelecke model, extended by 3D mechanisms such as lateral contraction and by non-local interaction, leading to localization effects. It is implemented into the finite element software COMSOL Multiphysics, and comparisons of numerical and experimental results show that the model is capable of reproducing the localized transformation behavior with the same strain rate dependency. Additionally to the thermal and the mechanical behavior, the quantitative prediction of cooling performance with the presented model is shown. [ABSTRACT FROM AUTHOR]

Self-expandable medical devices provide mechanical functionality at a specific location of the human body and are viable for minimal invasive procedures. Besides radiopaque markers and drug-eluting coatings, next generation self-expandable devices can be equipped with additional functionality, such as conductive and flexible electrodes, which enables chronic recording of bioelectrical signals, stimulating or ablating tissue. This promises new therapeutic options in various medical fields, among them in particular neuromodulation (e.g. deep brain stimulation), BioMEMS, radio frequency ablation, mapping or denervation. However, the fabrication of such multi-functional devices is challenging. For this study we have realized a 35 μm thick, superelastic NiTi thin film stent structure with six isolated electrodes on the outer circumference, each electrode connected to a contact pad at the end of the stent structure, using magnetron sputtering, UV lithography and wet chemical etching. Mechanical and electrical properties of the device during typical loading conditions, i.e. crimping, simulated pulsatile and electrochemical testing, were characterized and reveal promising results. For the fabrication of future multifunctional, minimal invasive medical devices, such as electroceuticals or other intelligent implants, NiTi thin film technology is therefore a versatile alternative to conventional fabrication routes.

Functional shape memory alloys need to operate reversibly and repeatedly. Quantitative measures of reversibility include the relative volume change of the participating phases and compatibility matrices for twinning. But no similar argument is known for repeatability. This is especially crucial for many future applications, such as artificial heart valves or elastocaloric cooling, in which more than 10 million transformation cycles will be required. We report on the discovery of an ultralow-fatigue shape memory alloy film system based on TiNiCu that allows at least 10 million transformation cycles. We found that these films contain Ti2Cu precipitates embedded in the base alloy that serve as sentinels to ensure complete and reproducible transformation in the course of each memory cycle., (Copyright © 2015, American Association for the Advancement of Science.)