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4. Top-Gate Stack Engineering Featuring a High-κ Gadolinium Aluminate Interfacial Layer for Field-Effect Transistors Based on Two-Dimensional Transition-Metal Dichalcogenides

9. Improvement of the Ferroelectric Response of La-Doped Hafnium Zirconium Oxide Employing Tungsten Oxide Interfacial Layer with Back-End-of-Line Compatibility

10. Selectivity and Growth Rate Modulations for Ruthenium Area‐selective Deposition by Co‐Reagent and Nanopattern Design.

18. Quantified Uniformity and Selectivity of TiO2 Films in 45‐nm Half Pitch Patterns Using Area‐Selective Deposition Supercycles.

26. (Invited) Addressing Key Process and Material Challenges to Enable 2D Transition Metal Dichalcogenide Channels in Advanced Logic Devices

27. Two-dimensional WS2 crystals at predetermined locations by anisotropic growth during atomic layer deposition.

29. In situ analysis of nucleation reactions during TiCl4/H2O atomic layer deposition on SiO2 and H-terminated Si surfaces treated with a silane small molecule inhibitor.

30. Evaluation of Ta-Co alloys as novel high-k EUV mask absorber

32. Nucleation and growth mechanism for atomic layer deposition of Al2O3 on two-dimensional WS2 monolayer.

34. Mechanisms for undesired nucleation on H-terminated Si and dimethylamino-trimethylsilane passivated SiO2 during TiO2 area-selective atomic layer deposition.

36. A chemisorbed interfacial layer for seeding atomic layer deposition on graphite

37. Pulsed chemical vapor deposition of conformal GeSe for application as an OTS selector

44. Threshold Voltage Control in PMOSFETs with Polysilicon or Fully-Silicided Gates on Hf-Based Gate Dielectric Using Controlled Lateral Oxidation

45. (Invited) Exploring the ALD Al2O3/In0.53Ga0.47As and Al2O3/Ge Interface Properties: A Common Gate Stack Approach for Advanced III-V/Ge CMOS

46. High-k Dielectrics and Interface Passivation for Ge and III/V Devices on Silicon for Advanced CMOS

47. Development of ALD HfZrOx with TDEAH, TDEAZ and H2O

49. Beyond SiliconMOS: An Electrical Study on Interface and Gate Dielectrics withacAdmittance Techniques

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