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In this study, BO-SiO-ZnO-BaO (BSZB) glass-coated copper particles were prepared by sol-gel process for use in copper pastes. The pastes with different ratio of BSZB glass were sintered at temperatures ranging from 850 to 910 °C with low temperature co-fired ceramic (LTCC) substrate. When pastes prepared from 1 wt% glass-coated copper powder were sintered at 910 °C, both a dense copper film and a dense LTCC structure were obtained. At this condition, the film had a thickness of approximately 15 μm and a sheet resistance of 1.9 mΩ/□, and a good bonding behavior between copper film and LTCC substrate was also observed. [ABSTRACT FROM AUTHOR]