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Soft gels with high toughness have drawn tremendous attention recently due to their potential applications in flexible electronic fields. The miniaturization and high‐power density of electronic devices require soft gels with both high toughness and low thermal resistance; however, it is difficult to achieve these properties simultaneously. Herein, a simple design strategy is reported for constructing soft (high stretchability of 6.91 and low Young's modulus of 340 kPa), tough (4741.48 J m−2) and thermal conductive (low thermal resistance of 0.14 cm2 K W−1, under 10 psi pressure) polydimethylsiloxane/aluminum composite gel. This is realized by precisely lengthening polymer strands between the chemical cross‐linked points and controlling the aluminum content in the composite gels. The symbiosis of this combination involves: lengthening the polymer strands facilitates its unfolding to increase the softness and intrinsic toughness; the thermally conductive spherical aluminum enables low thermal resistance and increases the intrinsic toughness and stress dissipation. By utilizing this gel as a thermal interface material, effective heat dissipation is demonstrated in electronic devices operating under high‐power conditions over numerous cycles. These results demonstrate the application potential of composite gels in meeting the performance maintenance and heat dissipation, which are needed for modern electronic devices. [ABSTRACT FROM AUTHOR]

Poly(lactic acid) (PLA) is an attractive candidate for replacing petrochemical polymers because it is fully biodegradable. This study investigated the potential of PLA as a sustainable and environmentally friendly alternative material that can be developed into commercially viable wearable mosquito repellent devices with desirable characteristics. PLA strands containing DEET and IR3535 were prepared by twin screw extrusion compounding and simultaneously functioned as plasticizers for the polymer. The plasticizing effect was investigated by thermal and rheological studies. DSC studies showed that the addition of DEET and IR3535 into PLA strands reduced the glass transition temperature consistent with predictions of the Fox equation, thus proving their efficiency as plasticizers. The rheology of molten samples of neat PLA and PLA/repellents blends, evaluated at 200 °C, was consistent with shear-thinning pseudoplastic behaviour. Raman studies revealed a nonlinear concentration gradient for DEET in the PLA strand, indicating non-Fickian Type II transport controlling the desorption process. Release data obtained at 50 °C showed initial rapid release followed by a slower, near constant rate at longer times. The release rate data were fitted to a novel modification of the Peppas-Sahlin desorption model.