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In this study, standard diamond bars were prepared using an ultra-thick diamond plate, and the bars had sizes consistent with the International Organization for Standardization (ISO) 14704:2016(E) three-point bending method for measuring the fracture strength. Ultra-thick diamond plate with dimensions of 125 mm (diameter) × 6.5 mm (thickness) were deposited using direct current arc plasma jet chemical vapour deposition. After cutting, grinding, and polishing, 12 diamond bars meeting the requirements of the ISO standard were prepared (36 mm × 4 mm × 3 mm) and tested for fracture strength using the cited ISO standard and elastic modulus using deflection measurements. The fracture strength of the ultra-thick diamond plate was found to be 580 ± 66 MPa. In addition, for comparison, the fracture strengths of standard ZnS, sapphire, and alumina were also analysed. Crucially, this is the first report of the fracture strength of standard-sized diamond plate. The effects of the defects and grain size on the crack formation and failure of the diamond film were analysed. The diamond's fracture strength was affected by the sample thickness, which caused the gradual accumulation of defects as this dimension increased, but not by its length and width. The elastic moduli of sapphire and alumina were compared. Overall, the measurement of the fracture strengths of ultra-thick diamond plate via the ISO standard is important for industrial applications. [ABSTRACT FROM AUTHOR]

The direct-current arc plasma jet method is advantageous for the rapid deposition of large-area self-supporting diamond films. However, dark defects tend to be generated during the growth process, significantly affecting the performance of the diamond. In this study, we use the direct-current arc plasma jet method to prepare transparent and translucent samples. Subsequently, we compare their optical, thermal, and mechanical properties and analyze the differences in their performances via microstructure and defect analyses. The results indicate that the transparent diamond samples exhibit excellent optical and thermal properties, with a transmittance of 68.4 % at a wavelength of 10.6 μm and a thermal conductivity similar to that of type-IIa single crystal diamond (i.e. 2002 W/(m·K)). Meanwhile, the translucent diamond exhibits outstanding mechanical properties, with a fracture strength of 984 MPa. Characterization results based on electron backscatter diffraction and X-ray computed tomography suggest that a preferred orientation along the (220) planes is conducive to the densification growth of the samples, thereby enhancing their optical and thermal properties. However, the generation of numerous twins results in interlocking between grains, which improves sample's mechanical properties but introduces porosity and impurities, thus deteriorating its optical and thermal performance. [Display omitted] • Optical and thermal diamond films were deposited by DC-arc plasma jet CVD with growth rates >6 μm/h. • Strong (220) texture and numerous twins can improve optical transmittance and fracture strength, respectively. • X-ray CT was used to reveal defects distribution and content within diamond samples. [ABSTRACT FROM AUTHOR]

In this study, the effect of defects on fracture toughness in different directions was investigated. Two diamond films with a diameter of 122 mm and as-deposited thicknesses of 2.2 and 1.5 mm, respectively, were deposited by DC arc plasma jet chemical vapor deposition. To accurately obtain the fracture toughness, the films were ground and polished to 1.6 and 0.8 mm, respectively. The results indicate that many defects, including pores, are introduced into the films during the growth process, particularly on the side close to the growth surface in thicker film. The size of pores reaches micrometres, which affects the fracture toughness under loading in different directions. Due to the minimum grain size, both films exhibit a maximum toughness of 8.2 and 10.0 MPa·m1/2, respectively, with growth-surface cracks. For the thinner sample, the maximum value is followed by that of the edge-surface cracks. As the grain size of the edge surface falls between that of the growth surface and that of the nucleation surface, the results indicate that fracture toughness is affected by grain size. However, the number of pores near the growth side increases when the thickness exceeds 0.8 mm. Pores reduce the toughness, resulting in the minimum fracture toughness (6 MPa·m1/2) of the thicker diamond film with edge-surface laser cracks. The sample with an edge-surface sharp pre-crack has a similar fracture toughness of 5.6 MPa·m1/2. This study provides guidance for selecting the applied load direction. • Two thick diamond films with thicknesses 2.18 and 1.48 mm were deposited. • Fracture toughnesses of the diamond films in three directions were investigated. • Numerous pores were formed in the diamond films during orientation growth. • Due to the effect of pores, the toughness values among three directions differ. [ABSTRACT FROM AUTHOR]

Diamond has attracted increasing attention because it has high thermal conductive. Here, a freestanding diamond thermal conductive film with a diameter of about 7 in. and an average thickness of 1.54 mm was prepared by DC arc plasma jet CVD with multi-stage magnetic fields. Specifically, the thickness uniformity was ensured by adding the magnetic field during the deposition of the freestanding diamond film. The morphology, structure and thermal conductivity of the diamond film were studied. The results showed that the expansion area of the DC arc plasma approached the surface of the substrate increasing duo to add the bottom magnetic field. Structural characterization revealed that the grain of the diamond film in the arc main were coarse, affected by the shape of DC arc plasma, while in the arc center and edge were fine. The main orientation of polycrystalline structure of the diamond film was the crystalline plane of (220). The Raman peaks of diamond film in different areas moved to a higher wavelength, indicating the existence of compressive stress inside the diamond film. The coarse columnar grain and a few grain boundaries were in the arc main. Therefore, the average value of the thermal conductivity (k ⊥) of diamond film measured in the arc main was 1728.9 ± 4.9 W/(m·k). Meanwhile, the thermal conductivity of the arc center and edge area was lower than that of the arc main. [Display omitted] • A freestanding diamond thermal conductive film with a diameter of about 7 in. was prepared. • DC arc plasma jet CVD with multi-stage magnetic fields was adopted. • The average value of the thermal conductivity (k ⊥) of diamond film measured in the arc main was 1728.9 ± 4.9 W/(m·k). [ABSTRACT FROM AUTHOR]