1. Investigation on the interfacial microstructure and mechanical properties of the W-Cu joints fabricated by hot explosive welding
- Author
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Ran Chun, Xuekun Fan, Kaiyuan Liu, Pengwan Chen, Jianrui Feng, Lei Zhu, and Zhou Qiang
- Subjects
Materials science ,Weldability ,Metals and Alloys ,Welding ,Microstructure ,Industrial and Manufacturing Engineering ,Computer Science Applications ,Amorphous solid ,law.invention ,Explosion welding ,Optical microscope ,law ,Modeling and Simulation ,Ceramics and Composites ,Shear strength ,Composite material ,Electron backscatter diffraction - Abstract
The welding of thick W onto Cu, with good bonding, has been a big challenge due to the large differences in physical properties between W and Cu. Among various novel methods, explosive welding is the promising one to produce bimetals with large size and great thickness. However, the cracking of brittle W under high strain rate limits its application. In this work, hot-explosive welding technique was explored to overcome this problem. A 2 mm thick W plate was preheated to 500 ℃ and was successfully welded with pure Cu plate, without any cracks formed in W layer. The result suggests that preheating W to over its dynamic ductile-to-brittle transition temperature and decreasing the imported kinetic energy are two most important factors for the successful welding of thick W plate. The weldability window calculated using the parameters at 500 °C predicted the formation of a good wavy interface. The microstructures at W-Cu interface were characterized by optical microscope, SEM, EBSD and TEM. The mechanically mixed W-Cu phase and the 2∼6 nm thick amorphous layer along the interface created strong bonding between the immiscible W and Cu. The measured interfacial compressive shear strength reached 188 MPa, indicating a good bonding strength of the interface.
- Published
- 2022