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3. Oxygen-Redox Activity in Non-Lithium-Excess Tungsten-Doped LiNiO2 Cathode

4. A 3nm CMOS FinFlex™ Platform Technology with Enhanced Power Efficiency and Performance for Mobile SoC and High Performance Computing Applications

5. Critical Process Features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and Beyond

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