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Time-resolved photoluminescence measurements have been performed on Mg-doped GaN for Mg concentrations in the low- to mid-1019 cm−3. As-grown and annealed (600–675 °C) samples were studied. In the as-grown samples, the nonradiative carrier lifetime was found to be about 200 ps and nearly independent of the Mg concentration. Upon annealing, the carrier lifetimes shorten to ∼150 ps but, again, show little dependence on the annealing temperature. The analysis of possible Shockley–Read–Hall recombination centers and their behavior during doping and annealing suggests that the main nonradiative recombination center is the Mg–nitrogen vacancy complex. The weak dependence of the PL decay times on temperature indicates that carrier capture into this center has a very low potential barrier, and the nonradiative recombination dominates even at low temperatures. [ABSTRACT FROM AUTHOR]

Electron emission spectroscopy was performed on metalorganic chemical vapor deposition grown p-n−-n+ junctions with p-thicknesses ranging from 50 to 300 nm, doped with [Mg] = 3.5 × 1019 cm−3. By measuring the decreasing emitted electron intensity from a cesiated p-GaN surface with increasing p-thickness, we were able to extract the minority carrier diffusion length of electron in p-type GaN, Le = 26 ± 3 nm. The measured value is in good agreement with literature reported values. The extrapolated electron current at the n− region–p-GaN interface is in reasonable agreement with the simulated electron current at the interface. [ABSTRACT FROM AUTHOR]

The recent progress in III-nitride tunnel junction (TJ) contacts for optoelectronic devices is summarized in this review paper. Due to the rapid developments of various III-nitride based optoelectronic devices for different emerging applications, TJs are of interest for these devices to achieve more efficient device performance. This review paper first briefly describes the working principles of TJs and the advantages of employing TJs in optoelectronic devices. The significant advancements in III-nitride TJs realized by metalorganic chemical vapor deposition (MOCVD) and molecular beam epitaxy (MBE) are addressed, as well as their TJ device performances. Lastly, the critical challenges for employing III-nitride TJs in wide bandgap ultraviolet (UV) light emitters are discussed for future investigations. [ABSTRACT FROM AUTHOR]

Metasurface‐based optical elements offer a wide design space for miniature and lightweight optical applications. Typically, metasurface optical elements transform an incident light beam into a desired output waveform. Recent demonstrations of light‐emitting metasurfaces highlight the potential for directly producing desired output waveforms via metasurface‐mediated spontaneous emission. In this work, reciprocal finite‐difference time‐domain (FDTD) simulations and machine learning are used to enable the inverse design of highly unidirectional photoluminescent III‐Nitride quantum well metasurfaces capable of directive p‐, s‐, or combined p‐ and s‐ polarized emission at arbitrary angles. In comparison with previous intuition‐guided designs using the same quantum well architectures, the inverse design approach enables new polarization capabilities and experimentally demonstrated improvements in directivity of 54%. An analysis of ways in which the inverse design both validates and contradicts previous intuition‐guided design heuristics is presented. Ultimately, the combination of reciprocal simulations and efficient global optimization (EGO) grants remarkable improvements in emission directivity and results in full control over the polarization and momentum of emitted light, including simultaneous directional emission of s‐ and p‐polarized light. [ABSTRACT FROM AUTHOR]

The V-defect is a naturally occurring inverted hexagonal pyramid structure that has been studied in GaN and InGaN growth since the 1990s. Strategic use of V-defects in pre-quantum well superlattices or equivalent preparation layers has enabled record breaking efficiencies for green, yellow, and red InGaN light emitting diodes (LEDs) utilizing lateral injection of holes through the semi-polar sidewalls of the V-defects. In this article, we use advanced characterization techniques such as scattering contrast transmission electron microscopy, high angle annular dark field scanning transmission electron microscopy, x-ray fluorescence maps, and atom probe tomography to study the active region compositions, V-defect formation, and V-defect structure in green and red LEDs grown on (0001) patterned sapphire and (111) Si substrates. We identify two distinct types of V-defects. The "large" V-defects are those that form in the pre-well superlattice and promote hole injection, usually nucleating on mixed (Burgers vector b = ± a ± c) character threading dislocations. In addition, "small" V-defects often form in the multi-quantum well region and are believed to be deleterious to high-efficiency LEDs by providing non-radiative pathways. The small V-defects are often associated with basal plane stacking faults or stacking fault boxes. Furthermore, we show through scattering contrast transmission electron microscopy that during V-defect filling, the threading dislocation, which runs up the center of the V-defect, will "bend" onto one of the six { 10 1 ¯ 1 } semi-polar planes. This result is essential to understanding non-radiative recombination in V-defect engineered LEDs. [ABSTRACT FROM AUTHOR]

The efficiency of high-power operation of multiple quantum well (QW) light emitting diodes (LEDs) to a large degree depends on the realization of uniform hole distribution between the QWs. In long wavelength InGaN/GaN QW LEDs, the thermionic interwell hole transport is hindered by high GaN barriers. However, in polar LED structures, these barriers may be circumvented by the lateral hole injection via semipolar 10 1 ¯ 1 QWs that form on the facets of V-defects. The efficiency of such carrier transfer depends on the transport time since transport in the semipolar QWs is competed by recombination. In this work, we study the carrier transfer from the semipolar to polar QWs by time-resolved photoluminescence in long wavelength (green to red) LEDs. We find that the carrier transfer through the semipolar QWs is fast, a few tens of picoseconds with the estimated room temperature ambipolar diffusion coefficient of ∼5.5 cm2/s. With diffusion much faster than recombination, the hole transport from the p-side of the structure to the polar QWs should proceed without a substantial loss, contributing to the high efficiency of long wavelength GaN LEDs. [ABSTRACT FROM AUTHOR]

The large polarization barriers between the quantum wells and quantum barriers in long-wavelength GaN-based light-emitting diodes (LEDs) inhibit their performance by requiring excess driving voltages to reach standard operating current densities. Lateral injection of carriers directly into quantum wells is required to circumvent this issue. V-defects are naturally occurring inverted hexagonal defects with semipolar 10 1 ¯ 1 -plane sidewalls generated on surface depressions from threading dislocations. LEDs engineered to intentionally generate V-defects below the active region of the LED can achieve lateral carrier injection through the V-defect sidewalls and have already been able to demonstrate world record wall-plug efficiencies for LEDs in the green-red wavelengths. V-defects can be enlarged during kinetically limited growth where the growth rate of the c-plane GaN is faster than that of their sidewalls, leaving them unfilled. We report on the metal organic chemical vapor deposition growth conditions required to fill in V-defects with p-GaN during epitaxial growth of the LED post the active region. Circular transmission length measurements of Pd/Au contacts processed on p-GaN surfaces with various amounts of unfilled V-defects showed no significant difference in their sheet resistance and specific contact resistance. J–V measurements of LEDs grown with varying unfilled V-defect densities showed no significant difference in the forward bias regime. However, in the reverse bias regime, catastrophic breakdown occurred at markedly lower voltages for samples with larger unfilled V-defect densities. This suggests that unfilled V-defects may act as hotspots for device failure, and planarizing LED surfaces may help prevent early degradation of LED devices. [ABSTRACT FROM AUTHOR]

A highly relaxed InGaN buffer layer was demonstrated over a full two-inch c-plane sapphire substrate by metalorganic chemical vapor deposition. The InGaN buffer layer was grown on a 100 nm GaN decomposition stop layer with a 3 nm thick high indium composition InGaN underlayer. After thermal decomposition of the underlayer at 1000 °C, a 200 nm thick In0.04Ga0.96N buffer showed 85% biaxial relaxation measured by a high resolution x-ray diffraction reciprocal space map. When used as a pseudo-substrate for the regrowth of InGaN/InGaN multi-quantum wells, the sample showed a 75 nm red-shift in room temperature photoluminescence when compared to a co-loaded GaN template reference. The longer emission wavelength is associated with higher indium incorporation in the InGaN layers from the lessening of the compositional pulling effect caused by compressive strain. Using this technique, a simple red light emitting diode was demonstrated with an active layer growth temperature of 825 °C and a peak wavelength of 622 nm at a current density of 20 A cm−2. This work represents a unique method to relax a III-nitride based layer over a full substrate. [ABSTRACT FROM AUTHOR]

We report on the material challenges of the growth of highly conductive n-AlGaN in germicidal ultraviolet light emitting diodes (GUV LEDs), with the degradation of the surface morphology of thick highly doped n-AlGaN due to the Si anti-surfactant effect. Threading dislocation inclination, increasing relaxation, and eventual cracking were observed with epitaxial n-AlGaN films thicker than 400 nm, along with an increasing Ga composition with the same metalorganic flows. With the optimization of the n-AlGaN conductivity in previous works, thin n-AlGaN films with high conductivity along with a smoothing superlattice were incorporated in GUV LED devices, resulting in LEDs with 285 nm electroluminescence, a low forward voltage of 4.2 V with a peak external quantum efficiency (EQE) of 10.6% and a peak wall-plug efficiency of 8.6% below 1 A/cm2, and an EQE of 5.5% at 20 A/cm2. [ABSTRACT FROM AUTHOR]

Hole injection through V-defect sidewalls into all quantum wells (QWs) of long wavelength GaN light emitting diodes had previously been proposed as means to increase efficiency of these devices. In this work, we directly tested the viability of this injection mechanism by electroluminescence and time-resolved photoluminescence measurements on a device in which QW furthest away from the p-side of the structure was deeper, thus serving as an optical detector for presence of injected electron–hole pairs. Emission from the detector well confirmed that, indeed, the holes were injected into this QW, which could only take place through the 10 1 ¯ 1 V-defect sidewalls. Unlike direct interwell transport by thermionic emission, this transport mechanism allows populating all QWs of a multiple QW structure despite the high potential barriers in the long wavelength InGaN/GaN QWs. [ABSTRACT FROM AUTHOR]

We investigate the unexpected high-energy electroluminescence (EL) peaks observed in long-wavelength InGaN light-emitting diodes (LEDs) with ground state emission peaks between ∼495 and 685 nm by studying the EL spectra of LEDs with varying quantum well (QW) thicknesses and indium compositions. In addition to the ground state emission, two high-energy emission peaks were observed in the LEDs with thick QWs and high indium compositions. The less energetic high-energy emission peak (2.4–2.6 eV) is attributed to the optical transitions involving excited states. Factors influencing the excited state transitions, such as the QW thickness and indium compositions, were also examined by simulations to better understand the occurrence of these transitions. The more energetic high-energy emission peak (2.8–3.1 eV) originates from V-defect sidewalls and was verified through micro-photoluminescence measurements. Identification of the high-energy emission peaks is essential as it enables targeted epitaxial or growth optimizations to minimize or eliminate these undesirable emission peaks. This work demonstrates the importance of using thin QWs to suppress the unwanted high-energy emissions due to excited state transitions and V-defect sidewalls for long-wavelength InGaN LEDs. [ABSTRACT FROM AUTHOR]

Atomic layer etching (ALE) was performed on (Al, In, Ga)N thin films using a cyclic process of alternating Cl2 gas absorption and Ar+ ion bombardment in an inductively coupled plasma etcher system. The etch damage was characterized by comparing photoluminescence of blue single quantum well light-emitting diodes before and after the etch as well as bulk resistivities of etched p-doped layers. It was found that etched surfaces were smooth and highly conformal, retaining the step-terrace features of the as-grown surface, thus realizing ALE. Longer exposures to the dry etching increased the bulk resistivity of etched surfaces layers slightly, with a damaged depth of ∼55 nm. With further optimization and damage recovery, ALE is a promising candidate for controlled etching with atomic accuracy. It was found that Al0.1Ga0.9N acts as an etch barrier for the ALE etch, making it a suitable etch to reveal buried V-defects in III-nitride light emitting diodes. [ABSTRACT FROM AUTHOR]

We report on the measurement of the lateral distribution of the junction current of an electrical biased p-n GaN diode by electron emission microscopy using a low-energy electron microscope. The vacuum level at the surface of the diode was lowered by deposition of cesium to achieve negative electron affinity, allowing overflow electrons at the surface of the biased diodes to be emitted and their spatial distribution imaged. The results were compared to the literature, and a good match with analytical solutions by Joyce and Wemple [J. Appl. Phys. 41, 3818 (1970)] was obtained. [ABSTRACT FROM AUTHOR]

Scanning tunneling electroluminescence (STL) microscopy is performed on a 3 nm‐thick InGaN/GaN quantum well (QW) with [In] = 0.23 such that the main light emission occurs in the green. The technique is used to map the radiative recombination properties at a scale of a few nanometers and correlate the local electroluminescence map with the surface topography simultaneously imaged by scanning tunneling microscopy. While the expected green emission is observed all over the sample, measurements performed on a 500 nm × 500 nm area around a 150 nm‐large and 2.5 nm‐deep hexagonal defect reveal intense emission peaks at higher energies close to the defect edges, features which are not visible in the macrophotoluminescence spectrum of the sample. Via a fitting of the local tunneling electroluminescence spectra, quantitative information on the fluctuations of the intensity, peak energy, width, and phonon replica intensity of the different spectral contributions is obtained, which provides information on carrier localization in the QW. This procedure also indicates that the carrier diffusion length on the probed area of the QW is shorter than 50 nm. [ABSTRACT FROM AUTHOR]

The heterogeneous integration of III-nitride materials with other semiconductor systems for electronic devices is attractive because it combines the excellent electrical properties of the III-nitrides with other device platforms. Pursuing integration through metalorganic chemical vapor deposition (MOCVD) is desirable because of the scalability of the technique, but the high temperatures required for the MOCVD growth of III-nitrides (>1000 °C) are incompatible with direct heteroepitaxy on some semiconductor systems and fabricated wafers. Thus, the MOCVD growth temperature of III-nitride films must be lowered to combine them with other systems. In this work, 16 nm-thick Si:GaN films were grown by MOCVD at 550 °C using a flow modulation epitaxy scheme. By optimizing the disilane flow conditions, electron concentrations up to 5.9 × 1019 cm−3 were achieved, resulting in sheet resistances as low as 1070 Ω/□. Film mobilities ranged from 34 to 119 cm2 V−1 s−1. These results are promising for III-nitride integration and expand device design and process options for III-nitride-based electronic devices. [ABSTRACT FROM AUTHOR]

The electrical performances of III-nitride blue micro-light-emitting diodes (µLEDs) with different tunnel junction (TJ) epitaxial architectures grown by metalorganic chemical vapor deposition are investigated. A new TJ structure that employs AlGaN is introduced. The current density–voltage characteristic is improved by incorporating AlGaN layer above the n-side of the TJ layer, and the effects of the AlGaN/GaN superlattices is examined. Based upon the data from band diagram simulation, net positive polarization charge is formed at the AlGaN/GaN interface, which results in a reduction in tunneling distance and increase in tunneling probability. Moreover, similar electrical improvement is observed in various device dimensions and is independent of operating current density, suggesting that AlGaN/GaN biaxial tensile strain or current spreading is not the main contribution for the improvement. Finally, the effects on the efficiency performances are determined. While the maximum external quantum efficiency of the TJ devices remains identical, the wall-plug efficiency of µLEDs is enhanced significantly by the proposed AlGaN-enhanced TJ design. This work reveals the possibility of energy efficient TJ contact with high transparency in the visible wavelength range. [ABSTRACT FROM AUTHOR]

We demonstrate room-temperature stimulated emission at 568 nm from low dislocation density InGaN/GaN multi-quantum wells. For a 1.4 mm long and a 50 μm wide ridge bar optically pumped by a high-power pulsed laser, we observed an emission peak at 568 nm with a narrow spectral width of less than 2 nm at room temperature. The measured pumping threshold is less than 1.5 MW/cm2, and the polarization ratio of the emission is over 90%. This demonstration paves the way for the future development of electrically injected InGaN semiconductor yellow laser diodes. [ABSTRACT FROM AUTHOR]

Nitride based light emitting diodes (LEDs) have demonstrated very high efficiency in the blue and green wavelength ranges. For full color LED based displays, efficient and small sized devices emitting in the three primary colors - red, green and blue are required. While phosphide based red LEDs are highly efficient, high surface recombination velocities limit their scaling to small dimensions. Nitride emitters can be scaled to smaller sizes, however for longer emission wavelength such as yellow, orange, and red, the indium content in the active region of the devices needs to be >30%. Due to the large lattice mismatch between GaN and InN, the needed high indium content introduces a large strain in the structure, often resulting in poor material quality. Recently, a novel technique to mitigate this lattice mismatch induced strain was demonstrated with the use of compliant porous GaN underlayer based substrates. In our previous reports, we have discussed the surface morphology, strain state evolution and device demonstrations using these substrates, however a detailed discussion regarding the pore cross-sections and dislocation propagation for each generation of these porous GaN substrates was yet to be reported. In this work, we will discuss the cross-sectional transmission electron microscopy (TEM) results of these substrates across multiple stages of the substrate technology development. [ABSTRACT FROM AUTHOR]

AlGaN germicidal ultraviolet (GUV) light emitting diodes (LEDs) are one of the most promising disinfection technologies in fighting the COVID-19 pandemic; however, GUV LEDs are still lacking in efficiency due to low p-type doping efficiency in p-AlGaN. The most successful approach for producing conductive p-type AlGaN is the implementation of a polarization-enhanced short period Al $_{\mathbf {x}}$ Ga $_{\mathbf {1-}\mathbf {x}}$ N/Al $_{\mathbf {y}}$ Ga $_{\mathbf {1-}\mathbf {y}}$ N superlattice (SL) structure, which enhances hole injection and reduces device operating voltage. In this report, we investigated different aspects of the superlattice including the Al $_{\mathbf {x}}$ Ga $_{\mathbf {1-}\mathbf {x}}$ N and Al $_{\mathbf {y}}$ Ga $_{\mathbf {1-}\mathbf {y}}$ N alloy constituent compositions, ${x}$ and ${y}$ , period thickness, total thickness, and Mg dopant concentration in terms of LED performance as well as electrical, optical, and morphological characteristics. The polarization-enhanced p-type doping in the AlGaN superlattice was also investigated computationally, giving excellent agreement with experimental results. Highly efficient UVC LEDs (279 nm) with EQE of 2% at 5 A/cm2 were demonstrated. A maximum output power of 5.5 mW (56 mW/mm2) was achieved at 100 mA. [ABSTRACT FROM AUTHOR]

This document is an erratum for an article titled "Planarization of p-GaN surfaces on MOCVD grown V-defect engineered GaN-based LEDs" published in Applied Physics Letters. The erratum states that Figure 5(e) in the original article did not display the dashed lines as intended and there were typographical errors in the caption of Figure 5. However, this error does not affect any other results, discussions, or conclusions in the original article. The authors of the original article are Tanay Tak, Alejandro Quevedo, Feng Wu, Srinivas Gandrothula, Jacob J. Ewing, Stephen Gee, Shuji Nakamura, Steven P. DenBaars, and James S. Speck. [Extracted from the article]

We present efficient red InGaN 60 × 60 μm2 micro-light-emitting diodes (μLEDs) with an epitaxial tunnel junction (TJ) contact. The TJ was grown by metal-organic chemical vapor deposition using selective area growth. The red TJ μLEDs show a uniform electroluminescence. At a low current density of 1 A/cm2, the emission peak wavelength is 623 nm with a full-width half maximum of 47 nm. The peak external quantum efficiency (EQE) measured in an integrating sphere is as high as 4.5%. These results suggest a significant progress in exploring high efficiency InGaN red μLEDs using TJ technology. [ABSTRACT FROM AUTHOR]

The N-polar orientation of GaN may be an option for the development of longer wavelength visible optoelectronics because of its higher indium uptake. N-polar InGaN LEDs with an inverted p-side down configuration and buried tunnel junctions were grown by metalorganic chemical vapor deposition. Fabricated devices in the wavelength range of 450–509 nm showed record high light output power for N-polar LEDs, up to 0.21 mW on-wafer at 20 A/cm2 with an emission wavelength of 470 nm. These results represent an improvement in performance of more than one order of magnitude over previously reported N-polar LEDs, demonstrating potential for the N-polar orientation in the nitride optoelectronics space. [ABSTRACT FROM AUTHOR]

Red micro-size light-emitting diodes (μLEDs) less than 10 × 10 μm2 are crucial for augmented reality (AR) and virtual reality (VR) applications. However, they remain very challenging since the common AlInGaP red μLEDs with such small size suffer from a dramatic reduction in the external quantum efficiency. In this work, we demonstrate ultra-small 5 × 5 μm2 607 nm amber μLEDs using InGaN materials, which show an EQE over 2% and an ultra-low reverse current of 10−9 A at −5 V. This demonstration suggests promising results of ultra-small InGaN μLEDs for AR and VR displays. [ABSTRACT FROM AUTHOR]

We study the high-temperature electroluminescence properties of 600 nm InGaN red 40 × 40 μm2 micro-light-emitting diodes (μLEDs) with a peak external quantum efficiency (EQE) of 3.2%. Temperature-dependent peak wavelength measurements show a low redshift of 0.05 nm/K. The injection efficiency improves with increasing temperature. The hot/cold (HC) factor is used to quantify the thermal droop: at 400 K, the EQE and wall-plug efficiency HC factors at 50 A/cm2 reach high values of 0.72 and 0.85, respectively. This demonstrates the robustness of InGaN red μLEDs up to high temperature, with a much-improved stability over conventional AlInGaP red μLEDs. [ABSTRACT FROM AUTHOR]

The optical and electrical characteristics of InGaN blue and green micro-light-emitting diodes (μLEDs) with GaN tunnel junction (TJ) contacts grown by metalorganic chemical vapor deposition (MOCVD) were compared at different activation temperatures among three activation methods from the literature, namely, sidewall activation, selective area growth (SAG), and chemical treatment before sidewall activation. The devices with chemical treatment before activation resulted in uniform electroluminescence and higher light output power, compared to the devices with sidewall activation and SAG. Moreover, the green μLEDs showed greater optical degradation at elevated activation temperatures, whereas the blue μLEDs yielded trivial difference with activation temperatures from 670 to 790 °C. The 5 × 5 μm2 devices with chemical treatment before activation and SAG yielded almost identical voltage at 20 A/cm2, and the voltage penalty significantly decreased with activation temperature in the case of devices with sidewall activation. The devices with chemical treatment before activation resulted in higher external quantum efficiency (EQE) and wall-plug efficiency (WPE) in low current density range compared to the devices with SAG. The enhancements in EQE and WPE were observed in different μLED sizes, suggesting that chemical treatment before sidewall activation enables the use of TJ contacts grown by MOCVD and is advantageous for applications that require high brightness and efficiency. [ABSTRACT FROM AUTHOR]

Investigations of the use of patterned porous GaN underlayers to achieve elastic relaxation of lattice‐mismatched top layers such as InGaN and AlGaN are reviewed. Thereby, the degree of relaxation of the top layers increases with the porosity and associated decrease in mechanical hardness of the porous GaN underlayers as well as with decreasing pattern size and increase in thickness of the lattice‐mismatched top layers, following the trends observed for nanostructures. Micrometer‐sized, high‐fill‐factor GaN‐on‐porous‐GaN tile arrays are used as universal substrate for the deposition of InGaN and AlGaN. Due to the elastic nature of the relaxation process, the threading dislocation density in the epitaxial material grown on top of the GaN‐on‐porous‐GaN tiles is equivalent to that in the GaN base material. InGaN and AlGaN layers grown on top of relaxed or partially relaxed InGaN or AlGaN underlayers by metal–organic chemical vapor deposition display a higher indium or aluminum content compared to their counterparts deposited on coloaded planar GaN reference wafers due to the decreased lattice mismatch. First applications of the patterned porous GaN‐based technology for optoelectronic and electronic devices are presented and serve as a pathway toward future implementations. [ABSTRACT FROM AUTHOR]

We have fabricated μLEDs of mesa sizes 10 × 10 and 15 × 15 μm2 on native (20 21 ¯) semipolar substrates and on epitaxial lateral overgrown (ELO) wings of the (20 21 ¯) substrate. The ELO μLEDs exhibited very low leakage current (less than 10−10 A) under forward bias (V < 2 V) and at reverse bias voltages, which was a reduction in several orders of magnitude when compared with planar μLEDs under the same fabrication and sidewall passivation scheme. Electrical characterization revealed that the mesa sidewall is less damaged in plasma dry etching in the ELO μLEDs due to a lower material defect density than the planar μLEDs. Moreover, the ELO μLEDs showed improved optical performance over the planar μLEDs. [ABSTRACT FROM AUTHOR]

Surface acoustic waves (SAWs) have large potential to realize quantum-optics-like experiments with single flying electrons employing their spin or charge degree of freedom. For such quantum applications, highly efficient trapping of the electron in a specific moving quantum dot (QD) of a SAW train plays a key role. Probabilistic transport over multiple moving minima would cause uncertainty in synchronization that is detrimental for coherence of entangled flying electrons and in-flight quantum operations. It is thus of central importance to identify the device parameters enabling electron transport within a single SAW minimum. A detailed experimental investigation of this aspect is so far missing. Here, we fill this gap by demonstrating time-of-flight measurements for a single electron that is transported via a SAW train between distant stationary QDs. Our measurements reveal the in-flight distribution of the electron within the moving acousto-electric quantum dots of the SAW train. Increasing the acousto-electric amplitude, we observe the threshold necessary to confine the flying electron at a specific, deliberately chosen SAW minimum. Investigating the effect of a barrier along the transport channel, we also benchmark the robustness of SAW-driven electron transport against stationary potential variations. Our results pave the way for highly controlled transport of electron qubits in a SAW-driven platform for quantum experiments. [ABSTRACT FROM AUTHOR]

Red micro-light-emitting diodes (μLEDs) have been generated significant interest for the next generation μLEDs displays. It has been shown that the external quantum efficiency (EQE) of AlInGaP red μLEDs markedly decreases as the size goes to very small dimension. Here, we demonstrate size-independent peak EQE of 611 nm InGaN red μLEDs. Packaged μLEDs show a peak EQE varied from 2.4% to 2.6% as the device area reduces from 100 × 100 to 20 × 20 μm2. These results demonstrate the promising potential for realizing high efficiency red μLED with very small size using InGaN materials. [ABSTRACT FROM AUTHOR]

Time-resolved and quasi-cw photoluminescence (PL) spectroscopy was applied to measure the internal quantum efficiency (IQE) of c-plane InGaN single quantum wells (QWs) grown on sapphire substrates using metal-organic chemical vapor deposition. The identical temperature dependence of the PL decay times and radiative recombination times at low temperatures confirmed that the low temperature IQE is 100%, which allowed evaluation of the absolute IQE at elevated temperatures. At 300 K, the IQE for QWs emitting in green and green–yellow spectral regions was more than 60%. The weak nonradiative recombination in QWs with a substantial concentration of threading dislocations and V-defects (∼2 × 108 cm−2) shows that these extended defects do not notably affect the carrier recombination. [ABSTRACT FROM AUTHOR]

The impact of AlGaN growth conditions on AlGaN:Si resistivity and surface morphology has been investigated using metalorganic chemical vapor deposition. Growth parameters including growth temperature, growth rate, and trimethylindium (TMI) flow have been systematically studied to minimize the resistivity of AlGaN:Si. We observed a strong anticorrelation between AlGaN:Si conductivity and growth temperature, suggesting increased silicon donor compensation at elevated temperatures. Secondary ion mass spectrometry and positron annihilation spectroscopy ruled out compensation by common impurities or group-III monovacancies as a reason for the observed phenomenon, in contrast to theoretical predictions. The underlying reason for AlGaN:Si resistivity dependence on growth temperature is discussed based on the possibility of silicon acting as a DX center in Al0.65Ga0.35N at high growth temperatures. We also show remarkable enhancement of AlGaN:Si conductivity by introducing TMI flow during growth. A minimum resistivity of 7.5 mΩ cm was obtained for n-type Al0.65Ga0.35N, which is among the lowest reported resistivity for this composition. [ABSTRACT FROM AUTHOR]

We demonstrate efficient cascaded blue/green micro-size light-emitting diodes (μLEDs) with independent junction control. The cascaded μLEDs, consisted of blue μLEDs, a tunnel junction, and green μLEDs, were fully grown by metalorganic chemical vapor deposition. Blue, green, and blue/green emissions can be independently controlled in the same device. The blue μLEDs (60 × 60 μm2) and green μLEDs (40 × 40 μm2) exhibit a forward voltage of 4.1 and 3.1 V at 20 A/cm2 and a high peak external quantum efficiency of 42% and 14%, respectively. This demonstration paves the way for monolithic integration of full color cascaded μLEDs. [ABSTRACT FROM AUTHOR]

Purpose: This study aims to focus on roughening N-face (backside) GaN substrate prior to GaN-on-GaN light-emitting diode (LED) growth as an attempt to improve the LED performance. Design/methodology/approach: The N-face of GaN substrate was roughened by three different etchants; ammonium hydroxide (NH4OH), a mixture of NH4OH and H2O2 (NH4OH: H2O2) and potassium hydroxide (KOH). Hexagonal pyramids were successfully formed on the surface when the substrate was subjected to the etching in all cases. Findings: Under 30 min of etching, the highest density of pyramids was obtained by NH4OH: H2O2 etching, which was 5 × 109 cm–2. The density by KOH and NH4OH etchings was 3.6 × 109 and 5 × 108 cm–2, respectively. At standard operation of current density at 20 A/cm2, the optical power and external quantum efficiency of the LED on the roughened GaN substrate by NH4OH: H2O2 were 12.3 mW and 22%, respectively, which are higher than its counterparts. Originality/value: This study demonstrated NH4OH: H2O2 is a new etchant for roughening the N-face GaN substrate. The results showed that such etchant increased the density of the pyramids on the N-face GaN substrate, which subsequently resulted in higher optical power and external quantum efficiency to the LED as compared to KOH and NH4OH. [ABSTRACT FROM AUTHOR]

This correction is consistent with the rest of the data presented in the published article, as well as the seventh paragraph that discusses the efficiency performance of the devices. The conclusions of the paper are not impacted by the erratum. Erratum: "Effects of activation method and temperature to III-nitride micro-light-emitting diodes with tunnel junction contacts grown by metalorganic chemical vapor deposition" [Appl. Phys. [Extracted from the article]

The lasing mode and internal optical absorption loss profiles of III-nitride edge-emitting laser diode (LD) designs operating at 440 nm were modeled using the transfer matrix method. These models indicate absorption losses are minimized in LDs utilizing tunnel junction (TJ) contacts that (1) optimize the TJ to be as close to fully depleted as possible; (2) spatially separate the metal contact from the lasing mode using lightly doped n-GaN located above the TJ; (3) in designs with optimized TJs, minimize the total thickness of p-type material. These features reduce absorption losses in the model, relative to comparable LD models with an unoptimized TJ contact or with a transparent conducting oxide p-contact, by up to 15.3% and 12.5%, respectively, while at the same time eliminating most or nearly all p-type material. [ABSTRACT FROM AUTHOR]