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Dump trucks are widely used in construction industry, mining, agriculture, etc. There is a risk of stability loss when dumping. Cases of dump truck tipping over are often reported. The dump truck tipping over is the result of many causes which need more of research. Its design features and environments, inter alia, can lead to the dump truck tipping over. In order to effectively use electronic systems, it is necessary to identify the factors that most cause the loss of stability of a particular dump truck design. The paper deals with the case of the dump truck KRAZ-7133S4 tipping over. The assumption was made that the KRAZ-7133S4 tipping over was caused by the loss of stability of the body lifting system parts. Creo Parametric software methods for determining the strength and stability were used to analyze the possibility of the hydraulic cylinder lower support design stability loss. It was established that the hydraulic cylinder lower support design possesses more than 14-fold margin of safety. It was concluded that the dumping mechanism parts were strained at the final stage of the tipping process. The loss of stability of the hydraulic cylinder support is not the cause of the KRAZ-7133S4 dump truck tipping over.

In this work, we studied the kinetics of the cathodic process and the regularities of the initial stages of silicon electrodeposition with methods of cyclic voltammetry, square-wave voltammetry, and chronoamperometry on a glassy carbon substrate from a LiCl-KCl-CsCl melt with K2SiF6at a temperature of 545 ± 5°C. It is shown that the cathodic process of silicon reduction proceeds in one stage, and it is not electrochemically reversible. The diffusion coefficient of silicon ions found by CV and chronoamperometry was 8.44·10−11and 1.00·10−10m2s−1, respectively. It was also found that the nucleation of silicon on glassy carbon is progressive; the formation of new nuclei proceeds continuously against the background of the growth of existing ones. Based on electrochemical measurements, various modes of silicon electrodeposition in the form of thin films were chosen: potentiostatic, pulse, reverse and galvanostatic with preliminary anodizing. As a result of electrolysis, silicon films were obtained, which were analyzed by SEM and XRD methods. The thickness of such deposits during electrolysis reaches several microns, and it consists of many spherical nuclei up to 0.7 microns in diameter. The content of impurities in deposits is extremely low, and the main contaminant is oxygen (0.4–1.2 wt%).