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This paper presents a novel piezoelectric micromachined ultrasonic transducer (PMUT) with theoretical simulation, fabrication, and testing. Conventional methods using a PCB or an external horn to adjust the PMUT acoustic field angle are limited by the need for transducer size. To address this limitation, the stepped-tube (expanded tube) backside cavity PMUT has been proposed. The stepped-tube PMUT and the tube PMUT devices have the same membrane structure, and the acoustic impedance matching of the PMUT is optimized by modifying the boundary conditions of the back cavity structure. The acoustic comparison experiments show that the average output sound pressure of the stepped-tube backside cavity PMUT has increased by 17%, the half-power-beam-width (θ-3db) has been reduced from 55° to 30° with a reduction of 45%, and the side lobe level signal is reduced from 147 mV to 66 mV. In addition, this work is fabricated on an eight-inch wafer. The process is compatible with standard complementary metal oxide semiconductor (CMOS), conditions are stable, and the cost is controllable, plus it facilitates the batch process. These conclusions suggest that the stepped-tube backside cavity PMUT will bring new, effective, and reliable solutions to ranging applications. [ABSTRACT FROM AUTHOR]

The advancement of spatial interaction technology has greatly enriched the domain of consumer electronics. Traditional solutions based on optical technologies suffers high power consumption and significant costs, making them less ideal in lightweight implementations. In contrast, ultrasonic solutions stand out due to their lower power consumption and cost-effectiveness, capturing widespread attention and interest. This paper addresses the challenges associated with the application of ultrasound sensors in spatial localization. Traditional ultrasound systems are hindered by blind spots, large physical dimensions, and constrained measurement ranges, limiting their practical applicability. To overcome these limitations, this paper proposes a miniature ultrasonic spatial localization module employing piezoelectric micromechanical ultrasonic transducers (PMUTs). The module is comprised of three devices each with dimension of 1.2 mm × 1.2 mm × 0.5 mm, operating at a frequency of around 180 kHz. This configuration facilitates a comprehensive distance detection range of 0–800 mm within 80° directivity, devoid of blind spot. The error rate and failure range of measurement as well as their relationship with the SNR (signal-to-noise ratio) are also thoroughly investigated. This work heralds a significant enhancement in hand spatial localization capabilities, propelling advancements in acoustic sensor applications of the meta-universe. [ABSTRACT FROM AUTHOR]

3D printing (3DP) technologies have transformed the processing of advanced ceramics for small‐scale and custom designs during the past three decades. Simple and complex parts are designed and manufactured using 3DP technologies for structural, piezoelectric, and biomedical applications. Manufacturing simple or complex geometries or one‐of‐a‐kind components without part‐specific tooling saves significant time and creates new applications for advanced ceramic materials. Although development and innovations in 3DP of ceramics are far behind compared with metals or polymers, with the availability of different commercial machines in recent years for 3DP of ceramics, exponential growth is expected in this field in the coming decade. This article details various 3DP technologies for advanced ceramic materials, their advantages and challenges for manufacturing parts for various applications, and perspectives on future directions. We envision this work will be helpful to advanced ceramic researchers in industry and academia who are using different 3DP processes in the coming days. [ABSTRACT FROM AUTHOR]

The advancement of spatial interaction technology has greatly enriched the domain of consumer electronics. Traditional solutions based on optical technologies suffers high power consumption and significant costs, making them less ideal in lightweight implementations. In contrast, ultrasonic solutions stand out due to their lower power consumption and cost-effectiveness, capturing widespread attention and interest. This paper addresses the challenges associated with the application of ultrasound sensors in spatial localization. Traditional ultrasound systems are hindered by blind spots, large physical dimensions, and constrained measurement ranges, limiting their practical applicability. To overcome these limitations, this paper proposes a miniature ultrasonic spatial localization module employing piezoelectric micromechanical ultrasonic transducers (PMUTs). The module is comprised of three devices each with dimension of 1.2 mm × 1.2 mm × 0.5 mm, operating at a frequency of around 180 kHz. This configuration facilitates a comprehensive distance detection range of 0-800 mm within 80° directivity, devoid of blind spot. The error rate and failure range of measurement as well as their relationship with the SNR (signal-to-noise ratio) are also thoroughly investigated. This work heralds a significant enhancement in hand spatial localization capabilities, propelling advancements in acoustic sensor applications of the meta-universe.

This paper presents a novel piezoelectric micromachined ultrasonic transducer (PMUT) with theoretical simulation, fabrication, and testing. Conventional methods using a PCB or an external horn to adjust the PMUT acoustic field angle are limited by the need for transducer size. To address this limitation, the stepped-tube (expanded tube) backside cavity PMUT has been proposed. The stepped-tube PMUT and the tube PMUT devices have the same membrane structure, and the acoustic impedance matching of the PMUT is optimized by modifying the boundary conditions of the back cavity structure. The acoustic comparison experiments show that the average output sound pressure of the stepped-tube backside cavity PMUT has increased by 17%, the half-power-beam-width (θ -3db ) has been reduced from 55° to 30° with a reduction of 45%, and the side lobe level signal is reduced from 147 mV to 66 mV. In addition, this work is fabricated on an eight-inch wafer. The process is compatible with standard complementary metal oxide semiconductor (CMOS), conditions are stable, and the cost is controllable, plus it facilitates the batch process. These conclusions suggest that the stepped-tube backside cavity PMUT will bring new, effective, and reliable solutions to ranging applications.