24 results on '"Vanfleteren, Jan"'
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2. Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics
3. A Novel Method for Component Positioning in Thermoformed Electronics
4. PoCOsteo: generic novel platform for bone turnover marker measurement & monitoring
5. Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics
6. Multifunctional Poly(2-ethyl-2-oxazoline) Copolymers Containing Dithiolane and Pentafluorophenyl Esters as Effective Reactive Linkers for Gold Surface Coatings
7. Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation
8. Optimized Packaging and Storage Strategies to Improve Immunosensors’ Shelf-Life
9. Measuring the Flex Life of Conductive Yarns in Narrow Fabric
10. Development of a Microfluidic Chip Powered by EWOD for In Vitro Manipulation of Bovine Embryos
11. Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion
12. Innovative component positioning method for thermoformed electronics
13. A Study on Over-Molded Copper-Based Flexible Electronic Circuits
14. Using Grubler's Criterion theory to position the electronic components in thermoformed electronics
15. Using non-stretchable structures for component positioning in thermoformed electronics
16. Development of a Stretchable Circuit and its Integration Method on Knit Fabrics for Lower Back Injury Prevention
17. The integration of electronic circuits in plastics using injection technologies: a literature review
18. Electrically-driven handling of gametes and embryos: taking a step towards the future of ARTs
19. Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles
20. In vivo blue light illumination for optogenetic inhibition: effect on local temperature and excitability of the rat hippocampus
21. Reducing out-of-plane deformation of metal interconnects in structural electronics
22. Over-molding of two-dimensional curved shape using polyimide copper cladding foil
23. Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles.
24. Integration of electronics in plastics using injection molding processes
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