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Your search keyword '"WANG Shuaipeng"' showing total 125 results
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125 results on '"WANG Shuaipeng"'

4. Optomechanical Anti-lasing with Infinite Group Delay at a Phase Singularity

Author

Liu, Yulong, Liu, Qichun, Wang, Shuaipeng, Chen, Zhen, Sillanpää, Mika A., and Li, Tiefu

Subjects
Quantum Physics, Condensed Matter - Mesoscale and Nanoscale Physics, Physics - Optics
Abstract

Singularities that symbolize abrupt changes and exhibit extraordinary behavior are of broad interest. We experimentally study optomechanically induced singularities in a compound system consisting of a three-dimensional aluminum superconducting cavity and a metalized high-coherence silicon nitride membrane resonator. Mechanically-induced coherent perfect absorption and anti-lasing occur simultaneously under a critical optomechanical coupling strength. Meanwhile, the phase around the cavity resonance undergoes an abrupt $\pi$-phase transition, which further flips the phase slope in the frequency dependence. The observed infinite-discontinuity in the phase slope defines a singularity, at which the group velocity is dramatically changed. Around the singularity, an abrupt transition from an infinite group advance to delay is demonstrated by measuring a Gaussian-shaped waveform propagating. Our experiment may broaden the scope of realizing extremely long group delays by taking advantage of singularities., Comment: 7pages,5figures

Published
2021
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31. Additive Manufacturing of Transparent Multi‐Component Nanoporous Glasses.

Author

Li, Beining, Li, Zhenjiang, Cooperstein, Ido, Shan, Wenze, Wang, Shuaipeng, Jiang, Benxue, Zhang, Long, Magdassi, Shlomo, and He, Jin

Subjects
GLASS, VISIBLE spectra, THREE-dimensional printing, NANOPOROUS materials, SPATIAL resolution, DIGITAL printing, SURFACE area
Abstract

Fabrication of glass with complex geocd the low resolution of particle‐based or fused glass technologies. Herein, a high‐resolution 3D printing of transparent nanoporous glass is presented, by the combination of transparent photo‐curable sol–gel printing compositions and digital light processing (DLP) technology. Multi‐component glass, including binary (Al2O3‐SiO2), ternary (ZnO‐Al2O3‐SiO2, TiO2‐Al2O3‐SiO2), and quaternary oxide (CaO‐P2O5‐Al2O3‐SiO2) nanoporous glass objects with complex shapes, high spatial resolutions, and multi‐oxide chemical compositions are fabricated, by DLP printing and subsequent sintering process. The uniform nanopores of Al2O3‐SiO2‐based nanoporous glasses with the diameter (≈6.04 nm), which is much smaller than the visible light wavelength, result in high transmittance (>95%) at the visible range. The high surface area of printed glass objectives allows post‐functionalization via the adsorption of functional guest molecules. The photoluminescence and hydrophobic modification of 3D printed glass objectives are successfully demonstrated. This work extends the scope of 3D printing to transparent nanoporous glasses with complex geometry and facile functionalization, making them available for a wide range of applications. [ABSTRACT FROM AUTHOR]

Published
2023
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37. Source Parameter Inversion and Century-Scale Stress Triggering Analysis of the 2021 Maduo M W 7.4 Earthquake Using GNSS and InSAR Displacement Fields.

Author

Xu, Keke, Wang, Shuaipeng, and Wan, Tongtong

Subjects
*STRAINS & stresses (Mechanics), *GLOBAL Positioning System, *EARTHQUAKES, *TSUNAMI warning systems, *SYNTHETIC aperture radar, *EARTHQUAKE aftershocks, *STRESS concentration
Abstract

To explore the degree of constraint by Global Navigation Satellite System (GNSS) and Interferometric Synthetic Aperture Radar (InSAR) data on the Maduo earthquake within a layered earth model structure and to gain an insight into the seismogenic mechanism and the seismic risk in the surrounding area, this study employs D-InSAR technology to acquire the InSAR co-seismic deformation field of the Maduo earthquake on 22 May 2021. Utilizing both GNSS and InSAR data, the inversions constrained by single and joint data are conducted and compared to determine the co-seismic slip model and fault plane stress distribution of the Maduo earthquake. Additionally, this paper calculates the Coulomb stress changes induced by 14 M ≥ 7 strong earthquakes, considering co-seismic effects, post-seismic viscoelastic relaxation, and inter-seismic tectonic stress loading, on 19 fault segments within the Bayan Har block research area (96°E~106°E, 29°N~36°N) since 1900. The findings are as follows: (1) The maximum line-of-sight (LOS) deformation was approximately 0.9 m. The joint inversion rupture was primarily located in the Dongcao Along Lake section (~98.6°E), aligning with previous research outcomes. (2) The cumulative Coulomb stress at the Maduo earthquake's source location was −0.1333 MPa, while the inter-seismic stress loading amounted to 0.0745 MPa. The East Kunlun Fault, Maduo–Gande Fault, Ganzi–Yushu Fault, and Dari Fault C exhibited considerable stress loading, warranting attention due to heightened seismic risk. (3) Based on three different co-seismic slip models, the stress disturbance results caused by the Maduo earthquake to the surrounding area and fault did not differ significantly. After the earthquake, the seismogenic fault still has high seismic risk. [ABSTRACT FROM AUTHOR]

Published
2023
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44. Thermally conductive composite phase change materials with excellent thermal management capability for electronic devices

Author

Kun Liang, Dong-Lin Han, Yu-Chuan Huang, Lu Bai, Hong-Qian Shen-Tu, Lu-Yao Yang, Guo Linqing, Liu Kai, Tang Lei, Wang Shuaipeng, and Xian-Qing Zeng

Subjects
chemistry.chemical_classification, Work (thermodynamics), Materials science, Composite number, Overheating (economics), Polymer, Condensed Matter Physics, Engineering physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials, Thermal conductivity, chemistry, Thermal, Electronics, Electrical and Electronic Engineering, Electrical conductor
Abstract

With the innovation of electronics industry and the advancement in 5G technology, the overheating problem has become an urgent obstacle to further realize the high performance and multi-function of electronic devices. Thus, it is essential to develop efficient thermal management materials to realize timely and effective heat dissipation. The thermal management systems based on phase change materials (PCMs) have received extensive attention in recent years. In this work, composite PCMs with a high phase change enthalpy of 149.56 J g−1, multiple phase change characteristics, a high thermal conductivity of 1.28 Wm−1 K−1, and excellent shape stability were fabricated by the means of cross-linked polymer swelling strategy. When the as-prepared composite PCMs were directly attached to the heating plate or served as thermal interface materials (TIMs) to dissipate heat, the temperature of heating plate can be reduced by 5.8 °C and 18.8 °C, respectively, revealing great potential in the thermal management application of electronic devices.

Published
2021

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