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Two samples of an α + β Ti-4Al-4Mo-4Sn-0.5Si (wt%) alloy, one with fine prior β grains and a heterogeneous microstructure and the other with coarse prior β grains and a homogeneous microstructure were prepared by extrusion of compacts of TiH 2 /Al/Mo/Sn/Si powder blend at 1200 and 1300 °C respectively. The heterogeneous microstructure is manifested by softer Mo-rich regions with a full α/β lamellar structure containing a high number density of parallel and nanometer sized FCC δ (TiH) needles in a harder matrix with a microstructure consisting of interweaved α plates and β transformed structure (β t) domains and grain boundary α (GB α) layers. The matrix also contains a small fraction of Sn-rich regions which have the same microstructure as the matrix. The Mo-rich and Sn-rich regions form due to the limited diffusion of Mo and Sn alloying elements. This heterogeneous microstructure sustains a high tensile yield strength of 1199 MPa, a high strain hardening rate, and an excellent tensile ductility of 12.0%. In contrast, the homogeneous microstructure comprising of interweaved α plates and β t domains together with GB α layers sustains a similar high strength, but a clearly lower strain hardening rate and a significantly lower tensile ductility of 3.5%. Non-homogeneous deformation capacity, the release of energy by forming numerous microcracks and the intermittent growth of microcracks of the heterogeneous microstructure suggest that this microstructure has a high plasticity and high resistance to the growth of microcracks. • The α + β titanium alloy fabricated has a heterogeneous microstructure and fine prior β grains. • The heterogeneous microstructure encompasses softer Mo-rich regions in a matrix of α/β t microstructure. • This alloy exhibits a superior combination of high strength (YS: 1199 MPa and excellent ductility (12.0%). • This is attributed to the compatible deformation and high microcrack growth resistance of the microstructure. [ABSTRACT FROM AUTHOR]

• With an addition of 0.2 wt%Si, the Si atoms are equally in α and β phases. • Si solute atoms retard the growth of α phase, causing refinement of the α/β t lamellar structure. • Si atoms enhance solid solution strengthening and Si atoms enhanced α/β t interface strengthening. • Increasing the Si content to 0.5 wt% cause a further increase of the yield strength by 50 MPa. • With a high strength, the tensile ductility deteriorates, due to the premature fracture of grain boundary α layers. Ti-4Al-4Mo-4Sn-xSi (wt%) (x = 0, 0.2, 0.5) alloys were fabricated by hot extrusion of compacts of blends of TiH 2 , AlMo60 master alloy and other required elemental powders followed by heat treatments involving vacuum annealing, solution treatment, air cooling and aging. The microstructure of the alloys consists of α plates, lamellae of α and transformed β structure (β t), β t blocks as well as grain boundary α layers. With the addition of 0.2 wt%Si, the Si atoms exist in equal concentration in both α and β t regions as solute atoms, and they retard the growth of α phase, causing a decrease of the average thickness of α plates and lamellae and slight increase of the volume fraction of β t lamellae and blocks. The solid solution strengthening and enhanced α/β interface hardening brought by the 0.2 wt%Si cause the yield strength of the Ti-4Al-4Mo-4Sn alloy to increase significantly from 1030 to 1130 MPa with a slight decrease of the tensile ductility (7.4% vs 6.8%) and without changing the fracture behavior. With the addition of 0.5 wt%Si, the extra Si causes nanometer sized silicide (Ti 5 Si 3) precipitates to form in both α and β t regions and further microstructural refinement. The additional α/β interface hardening and precipitation hardening cause the yield strength of the alloy to increase further to 1177 MPa, but the tensile ductility deteriorates clearly with the elongation to fracture decreasing to 4.9%. The main reason for this ductility decrease is the premature fracture of grain boundary α layers caused by the higher flow stress which can induce more strain localization at the grain boundary α layers. [ABSTRACT FROM AUTHOR]