1. Damage-free finishing of CVD-SiC by a combination of dry plasma etching and plasma-assisted polishing.
- Author
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Deng, Hui, Endo, Katsuyoshi, and Yamamura, Kazuya
- Subjects
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SILICON carbide , *CHEMICAL vapor deposition , *PLASMA etching , *GRINDING & polishing , *SURFACE morphology - Abstract
To realize the damage-free finishing of CVD-SiC substrates, which are used as materials for space telescope mirrors and glass lens molds, plasma chemical vaporization machining (PCVM) and plasma-assisted polishing (PAP) were combined. In this study, the properties of such CVD-SiC substrates, including their surface morphology, composition and crystalline orientation, were investigated. Lapping using diamond abrasives and conventional chemical mechanical polishing (CMP) using CeO 2 slurry were conducted for comparison with the proposed atmospheric-pressure-plasma-based finishing process. Many scratches and a subsurface damage (SSD) layer were formed by the diamond lapping of CVD-SiC. Conventional CMP using CeO 2 slurry was conducted for the damage-free finishing of CVD-SiC. However, the polishing efficiency was very low. In the proposed process, PCVM, which is a noncontact dry etching process, was performed to remove the SSD layer while PAP, which combines plasma modification and soft abrasive polishing, was performed for damage-free surface finishing. PCVM was conducted on a diamond-lapped CVD-SiC surface. After PCVM for a short duration of 5 min, the scratches and SSD layer formed by lapping were completely removed, although the surface roughness was slightly increased. PAP using a resin-bonded CeO 2 grindstone was conducted to decrease the surface roughness of CVD-SiC processed by diamond lapping and PCVM for 5 min, for which a loose-held-type grindstone was demonstrated to be very useful. A flat and scratch-free surface with an rms roughness of 0.6 nm was obtained after PAP finishing. [ABSTRACT FROM AUTHOR]
- Published
- 2017
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