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Start Over Descriptor "*INTEGRATED circuit packaging" Publication Year Range Last 50 years Region united states

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1 results on '"*INTEGRATED circuit packaging"'

1. Chip carrier packaging grows on widespread adoption of QFN package.

Subjects
*QUAD flat packaging, *INTEGRATED circuit packaging, *MANUFACTURING processes, *SEMICONDUCTOR industry
Abstract

The article reports on the growth of chip carrier packaging with the adoption of quad flat no-lead (QFN) package design in the U.S. in 2013. Semiconductor market research firm IC Insights Inc. forecasts that the demand for QFN packages will stimulate the growth of flatpack/chip carrier (FP/CC) category of packages. The benefits of employing QFN and dual flat no-lead (DFN) packages in accelerating the manufacturing processes are outlined.

Published
2013

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