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This paper proposes a three-stage op amp based on the SOI (silicon-on-insulator) process, which achieves a low offset voltage and temperature coefficient across a wide temperature range from −40 °C to 250 °C. It can be used in aerospace, oil and gas exploration, automotive electronics, nuclear industry, and in other fields where the ability of electronic devices to withstand high-temperature environments is strongly required. By utilizing a SC (Switched Capacitor) notch filter, the op amp achieves low input offset in a power-efficient manner. The circuit features a multi-path nested Miller compensation structure, consisting of a low-speed channel and a high-speed channel, which switch according to the input signal frequency. The input-stage operational amplifier is a fully differential, rail-to-rail design, utilizing tail current control to reduce the impact of common-mode voltage on the transconductance of the input stage. The two-stage operational amplifier uses both cascode and Miller compensation, minimizing the influence of the feedforward signal path and improving the amplifier's response speed. The prototype op amp is fabricated in a 0.15 µm SOI process and draws 0.3 mA from a 5 V supply. The circuit occupies a chip area of 0.76 mm2. The measured open-loop gain exceeds 140 dB, with a 3 dB bandwidth greater than 100 kHz. The amplifier demonstrates stable performance across a wide temperature range from −40 °C to 250 °C, and exhibits an excellent input offset of approximately 20 µV at room temperature and an offset voltage temperature coefficient of 0.7 μV/°C in the full temperature range. [ABSTRACT FROM AUTHOR]

This study addresses the emerging need for efficient and cost-effective solutions in low-volume production by exploring the mechanical performance and industrial feasibility of cutting tools that are fabricated using stereolithography apparatus (SLA) technology. SLA's high-resolution capabilities make it suitable for creating precise cutting dies, which were tested on aluminum sheets (Al99.5, 0.3 mm, and AlMg3, 1.0 mm) under a 60-ton hydraulic press. Measurements using digital image correlation (DIC) revealed minimal wear and deformation, with tolerances consistently within IT 0.1 mm. The results demonstrated that SLA-printed tools perform comparably to conventional metal tools in cutting and bending operations, achieving similar surface quality and edge precision while significantly reducing the production time and cost. Despite some limitations in wear resistance, the findings highlight SLA technology's potential for rapid prototyping and short-run manufacturing in the automotive and electronics sectors. This research fills a critical gap in understanding SLA-based tooling applications, offering insights into process optimization to enhance tool durability and broaden material compatibility. These advancements position SLA technology as a transformative tool-making technology for flexible manufacturing. [ABSTRACT FROM AUTHOR]

Trench MOS Barrier Schottky (TMBS) rectifiers offer superior static and dynamic electrical characteristics when compared with planar Schottky rectifiers for a given active die size. The unique structure of TMBS devices allows for efficient manipulation of the electric field, enabling higher doping concentrations in the drift region and thus achieving a lower forward voltage drop (VF) and reduced leakage current (IR) while maintaining high breakdown voltage (BV). While the use of trenches to push electric fields away from the mesa surface is a widely employed concept for vertical power devices, a significant gap exists in the analytical modeling of this effect, with most prior studies relying heavily on computationally intensive numerical simulations. This paper introduces a new physics-based analytical model to elucidate the behavior of electric field and potential in the mesa region of a TMBS rectifier in reverse bias. Our model leverages the concept of shared charge between the Schottky and MOS junctions, capturing how electric field distribution is altered in response to trench geometry and bias conditions. This shared charge approach not only simplifies the analysis of electric field distribution but also reveals key design parameters, such as trench depth, oxide thickness, and doping concentration, that influence device performance. This model employs the concept of shared charge between the vertical Schottky and MOS junction. Additionally, it provides a detailed view of the electric field suppression mechanism in the TMBS device, highlighting the significant effects of the inversion charge on the MOS interface. By comparing our analytical results with TCAD simulations, we demonstrate strong agreement, underscoring the model's accuracy and its potential to serve as a more accessible alternative to resource-intensive simulations. This work contributes to a valuable tool for TMBS device design, offering insights into electric field management that support high-efficiency, high-voltage applications, including power supplies, automotive electronics, and renewable energy systems. [ABSTRACT FROM AUTHOR]

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High-voltage and analog measurements occupy a large amount of automated test equipment (ATE) overhead. A method for realizing trimming automation through mixed digital and analog circuits is proposed. Taking a 40 nm 1 MB Flash chip test as an example, current high-voltage and analog quantity trimming accounts for 6.9% of the total test time. Through adding digital and analog circuits to the Built-In Self-Test (BIST) circuit, the trimming test time is reduced from 2.94 s to 0.23 s, and the ratio of the total test time is reduced to 0.58%. Compared with the original chip probing (CP) total time, the total time is reduced by 6.35%, the ATE overhead accounts for 19.35% of the total test time, and the Flash area is 0.63%. The measurement accuracy reaches 750 μV~6 mV, and the measurement error is 0.15% ± 7 mV, compared with the conventional ATE trimming method. [ABSTRACT FROM AUTHOR]

This work investigated the Vickers hardness and compressive properties of 0–30 % ZrMgMo 3 O 12p /2024Al composites with controlled thermal expansion. The composites exhibited superior Vickers hardness and compressive properties, highly dependent on the ZrMgMo 3 O 12 content. Under identical preparation conditions, an increase in ZrMgMo 3 O 12 content allows for adjusting the Vickers hardness from 163 to 280 HV and the compressive yield strength from 330 to 702 MPa. Additionally, the 5 % and 10 % ZrMgMo 3 O 12 composites exhibited 23 % and 8 % compressive strains, respectively. The Orowan strengthening effect of the ZrMgMo 3 O 12 particles and the thermal mismatch stress at the particle-matrix interface were identified as the key strengthening mechanisms for the composites. However, excessive stress can lead to interfacial debonding and composite failure. Agglomeration of the ZrMgMo 3 O 12 particles was observed beyond 10 % content. At 30 %, the thermal mismatch stress exceeded the binding strength, causing interfacial debonding and composite failure. The controlled mechanical properties of the 0–30 % ZrMgMo 3 O 12p /2024Al composites indicate a promising potential for application in the aerospace and automotive industries and electronics and optical instruments sectors. [ABSTRACT FROM AUTHOR]

Since lithium-ion batteries (LIBs) are essential parts of the automotive and electronics industries, high-energy-density LIB electrodes are proving to be an effective option for tackling issues in these domains. Making the right material selection is crucial because of the benefits and drawbacks of various electrode materials as well as the need to improve battery performance. Because of their remarkable electrochemical qualities, nanostructured anode materials have recently attracted a lot of scientific interest. This paper examines the developments and difficulties surrounding nanostructured anodes, encompassing several kinds of nano-architecture for LIB applications. It provides an overview of important topics such the processes of conversion reactions, the features of electrochemical energy storage, the design of nanostructures, synthesis techniques, and the difficulties in enhancing LIB anodes using nanostructured materials. [ABSTRACT FROM AUTHOR]

The integrity of the 12 V dc power distribution system on a vehicle is essential to guarantee continuous power supply to safety-relevant consumers. Safety-relevant consumers are critical loads, for example, electric power steering, braking systems with functionalities like Anti-Lock Braking or Electronic Stability Control, and autonomous drive systems. To prevent insufficient power supply for safety-relevant consumers due to an increased wiring harness resistance, a novel diagnostic approach is developed to determine the condition of the power distribution, especially the electrical resistance. The influence of measurement errors and bus commutation on the estimation is investigated by using a simulation. By using the diagnostic, a resistance determination in the milliohm range with a standard deviation of σ = 0.3 m Ω can be achieved under realistic conditions. This ensures that failures in the wiring harness can be identified, avoiding cascading effects and minimizing recalls. Compared to the state of the art, redundancies, costs, and weight can be saved with the proposed diagnostic system based on electrical resistance estimation. [ABSTRACT FROM AUTHOR]

A thorough understanding of media tightness in automotive electronics is crucial for ensuring more reliable and compact product designs, ultimately improving product quality. Concerning the fundamental characteristics of fluid leakage issues, the dynamic wetting and penetration behavior on small scales is of special interest and importance. In this work, four T-shaped microchannels with one inlet and two outlets are experimentally investigated in terms of contact angle dynamics and interface movement over time, generating novel insight into the wetting mechanisms and fluid distribution. With a main channel width of 1 mm, a crevice width of w = 0.3 mm , 0.4 mm and a rounding edge radius of r = 0.1 mm , 0.2 mm , the geometrical effects on the fluid penetration depth in the crevice and the interface edge pinning effect are analyzed quantitatively using an automated image processing procedure. It is found that the measured dynamic contact angles in all parts can be well described by molecular kinetic theory using local contact line velocities, even with local surface effects and abrupt geometry changes. Moreover, a smaller crevice width, a sharper edge and a larger flow velocity tend to enhance the interface pinning effect and prevent fluid penetration into the crevice. The rounding radius has a more significant effect on the interface pinning compared with crevice width. The experimental data and image processing algorithm are made publicly available. [ABSTRACT FROM AUTHOR]

Due to its superior reliability and performance, thick film technology is extensively employed in various applications, including automotive electronics, consumer electronics, communication engineering, and aerospace. However, a challenge arises from the mutual diffusion during the electronic paste production process, which leads to a decline in insulation performance and hinders the production of three-dimensional equipment. Inspired by the principles of low-temperature co-fired ceramic technology, a multi-layered ceramic structure has been successfully bonded using thick film technology by introducing a borosilicate glass-ceramics layer. To further enhance the properties of this multi-layered ceramic structure, approximately 8 wt% SiO 2 was incorporated into the borosilicate glass-ceramics. This addition effectively inhibits silver diffusion and reduces the diffusion depth within the glass-ceramic film. The key mechanisms behind this improvement are the increased activation energy for crystallization, resulting in a slower crystallization rate due to the addition of SiO 2. Moreover, the multi-layered ceramic with a sandwich structure exhibits remarkable properties. Notably, the dielectric strength of this system has been significantly enhanced to 13.9 kV/mm, accompanied by a high adhesion strength of 790 N. These enhanced properties of the optimized system indicate promising characteristics for multi-layer circuit applications. [ABSTRACT FROM AUTHOR]

Lane detection is a foundational technology for autonomous driving systems. It involves identifying the boundaries of lanes on the road and ensuring the vehicle stays within these boundaries. Accurate lane detection is crucial for safety, navigation and traffic management. This paper presents an artificial intelligent based autonomous road lane detection and navigation system for vehicles. The system can detect and analyse road lanes accurately and efficiently in real-time, with frame rates of up to 17 FPS. By utilizing image processing techniques, the system can identify the location and boundaries of road lanes and obstacles on the road and provide accurate and reliable navigation guidance to the driver. The system is integrated with sensors and actuators to provide comprehensive autonomous navigation. The efficiency of the proposed system is demonstrated using accuracy of lane detection on straight and curve lanes covering frames per second and motor of the speed as parameters for assessment. Results show that the proposed system detects lane as entire lane detection, partial lane detection and no detection status on different settings. [ABSTRACT FROM AUTHOR]

Structural adhesives that do not require heating are in high demand in the automotive and electronics industries. However, it remains a challenge to develop robust adhesives that rapidly achieve super adhesion near ambient temperature. Herein, a room‐temperature curable, fast‐bonding, and super strong epoxy‐based structural adhesive was designed from the perspective of cross‐scale structure, which lies in threefold pivotal aspects: (i) high branching topology of glycerol carbonate‐capped polyurethane (PUGC) increases the kinetics of the ring‐opening reaction, contributing to fast crosslinking and the formation of abundant urethane and hydroxyl moieties; (ii) asynchronous crosslinking of epoxy and PUGC synergistically induces phase separation of PUGC within the epoxy resin and the resulting PUGC domains surrounded by interpenetrated shell serves to efficiently toughen the matrix; (iii) abundant dynamic hydrogen bonds including urethane and hydroxyl moieties, along with the elastomeric PUGC domains, dissipate energy of shearing force. As a result, the adhesive strength rapidly grows to 16 MPa within 4 hours, leveling off to 21 MPa after 7 hours, substantially outperforming commercial room‐temperature curable epoxy adhesives. The results of this study could advance the field of high‐performance adhesives and provide valuable insights into designing materials for efficient curing at room temperature. [ABSTRACT FROM AUTHOR]

Technological advancements necessitate efficient electronic heat management, driving the need for effective cooling solutions. This study investigates the application of MXene-based nanofluids across varying concentrations in microchannel heat sinks to enhance electronic cooling performance. Utilizing numerical simulations, we analyze nanofluid concentrations, flow dynamics, and performance evaluation criteria (PEC) using an Eulerian model to characterize the inhomogeneous flow properties. Concentrations ranging from 0.01 to 0.04 vol% are incrementally examined, with validation against experimental data to ensure accuracy. Key findings reveal that at a Reynolds number (Re) of 300, a 0.04 vol% nanofluid fraction yields a 20.1% reduction in thermal resistance compared to pure water. Moreover, at Re 1000, the heat transfer coefficient improves by 29.4% compared to the 0.04 vol% concentration. These results underscore the potential of MXene nanoflakes as adequate heat sink working fluids for electronics cooling. Applications of this research extend to various electronic devices and systems requiring efficient cooling mechanisms. By leveraging MXene nanofluids, manufacturers can enhance thermal management in microelectronic components, such as integrated circuits, LEDs, and power electronics. Additionally, this study's insights can inform the design and optimization of cooling systems in high-performance computing, automotive electronics, and aerospace applications, where heat dissipation is critical for maintaining device reliability and performance. [ABSTRACT FROM AUTHOR]

To respond to the ever-increasing requirements of automotive electronics, universities need to adapt and play an active role in creating a new research environment and provide proper education to the young generation, which will face challenging tasks in this rapidly developed field. Vehicular technology education is crucial for the next generation of automotive electronics developers and engineers. Several education models, such as problem- and project-based learning (PPBL), academia–academia collaboration, and academia–industry collaboration, are highlighted as successful examples. [ABSTRACT FROM AUTHOR]

Copper (Cu) wire bonding has been widely used in automotive electronics as an interconnection technology. However, Cu wire bonding faces long-term reliability challenges due to corrosion, particularly when exposed to harsh environments. While the corrosion behavior and mechanisms of bulk-sized Cu metal are well studied, the corrosion behavior of submicron-sized Cu wire bonding in miniaturized components remains unclear. This study investigates the corrosion susceptibility of Cu wire with a 1 mil diameter, bonded to an Ag-plated leadframe in a small-outline transistor (SOT-23) package, commonly used in automotive electronics. The Cu wire bonds were subjected to varying concentrations of hydrochloric acid (HCl), specifically 3 M, 5 M, and 7 M, for exposure durations of 6, 12, and 18 hours. The samples were characterized using a field emission scanning electron microscope to observe the microstructure, and ImageJ software was used to quantify the corrosion of the Cu wire bonds. The findings show that the Cu wire bonding is susceptible to corrosion when exposed to high concentrations of HCl. The corrosion of the microstructure became more severe with increasing HCl concentration and exposure time. The affected area of the Cu wire bonding was 21% after 6 hours of exposure to 3 M HCl, increasing to 100% after 18 hours of exposure to 7 M HCl. This study reveals that the corrosion behavior of Cu wire bonding is a combination of selective and pitting-like corrosion, resulting in localized surface degradation rather than uniform corrosion. These findings provide valuable insights into the corrosion behavior of 1 mil Cu wire bonding in SOT-23 packages under highly corrosive environments. [ABSTRACT FROM AUTHOR]

Network-based architectures provide accessibility to various hardware elements and information. The Vehicle to Vehicle (V2V) protocol is a Wi-Fi-based communication that potentially exposes the system to a variety of vulnerabilities. Automotive electronics is a rapidly evolving field that combines numerous machine learning algorithms, dependable communication protocols, and precise image processing techniques to create a user-friendly and self-driving autonomous car. A generic network communication vulnerability assessment method is used to undertake a navigational attack against connected vehicles using GPS falsification. This study emphasizes the security risks of using Wi-Fi for V2V (vehicle 2 vehicle) communication without suitable access control measures in place. The tool used for establishing V2V Communication is based on Kali Linux. The breakdown of vulnerabilities within each layer, such as eavesdropping, spoofing, and Malevolent intermediary strike, highlights the diverse range of potential threats vehicles might face. The focus on the communication layer, both within the vehicle and with external infrastructure (V2X communication), aligns with the current trend of connectivity in automotive technology. Providing a state-of-the-art review of attacks and suggesting countermeasures demonstrates a proactive approach to mitigating potential risks. It's essential not only to identify vulnerabilities but also to propose effective solutions to safeguard vehicular communications and, ultimately, the control layer responsible for critical vehicle functions. [ABSTRACT FROM AUTHOR]

Purpose: In this paper, we investigate the coevolution of the supply network and procurement strategies in the context of semiconductors and electronics for the automotive industry over 3 decades. We aim to explain how procurement strategy interrelates with changes in supply network structure and what the implications of a hub-centric structure network structure are for procurement in supply. Design/methodology/approach: We collected in-depth primary and secondary data that stretched back to 1996 from a leading automotive European original equipment manufacturer (OEM) and its network. Using social network analysis (SNA), we identified OEMs' procurement focus and mapped the evolution of the supply network, the links in the network, and the environmental forces impacting the strategies and the network. Findings: Our findings describe the supply network for semiconductor and electronic components to the automotive industry. The findings suggest that a focus on cost can lead to a Tier 1-centric network structure with many tiers that can fail to assure supply or capture innovation when the external environment is marked by high uncertainty. In such situations, increasing complexity by creating more links in the network can improve transparency and contribute to supply assurance and innovation. Practical implications: The findings indicate that managers should consider the role of the supply network in selecting their strategy to attain objectives of cost, innovation, and supply assurance. Originality/value: This paper presents empirical-based insights into the automotive semiconductor and electronic component supply chain (SC), the unexpected implications of hub-centric supply networks, and the use of SNA in the SC in context. [ABSTRACT FROM AUTHOR]

Reductions in automobile weight and carbon dioxide emission are critical for the further development of the automobile industry. Aluminum is a lightweight material that can replace copper in automobile electronic equipment; therefore, laser welding of aluminum and copper is a subject of extensive research. This study investigates the influence of the laser strategy on the laser welding of aluminum and copper while preventing the formation of brittle Al–Cu intermetallic compounds. Aluminum and copper plates with a length of 20 mm and thickness of 0.3 and 1 mm, respectively, are used for the experiment. A continuous-wave laser with a power of 500 W and a spot beam radius of 150 μm is employed to irradiate the aluminum surface at different scan speeds. An electroless-plated nickel layer is used as a buffer between aluminum and copper, and the experimental results show that it can prevent copper surface damage and the formation of Al–Cu compounds during laser welding. In addition, the simulation and experimental results reveal that the residual thermal stress after laser welding can be reduced by heat treatment at different temperatures prior to laser irradiation. [Display omitted] • Al–Cu compound can be avoided during the laser welding process by the electroless nickel layer. • Residual thermal stress can be decreased by controlling the pre-heat treatment temperature for the metal before the laser weld. • Tension strength of welded joint will be decided by the laser scan speed in the welding process. • The contact area of the Al–Cu interface will affect the residual thermal stress after laser welding. [ABSTRACT FROM AUTHOR]

The reliability and durability of integrated circuits (ICs), present in almost every electronic system, from consumer electronics to the automotive or aerospace industries, have been and will continue to be critical concerns for IC chip makers, especially in scaled nanometer technologies. In this context, ICs are expected to deliver optimal performance and reliability throughout their projected lifetime. However, real-time reliability assessment and remaining lifetime projections during in-field IC operation remain unknown due to the absence of trustworthy on-chip reliability monitors. The integration of such on-chip monitors has recently gained significant importance because they can provide real-time IC reliability extraction by exploiting the fundamental physics of two of the major reliability degradation phenomena: bias temperature instability (BTI) and hot carrier degradation (HCD). In this work, we present an extensive study of ring oscillator (RO)-based degradation and annealing monitors designed on our latest 28 nm versatile array chip. This test vehicle, along with a dedicated test setup, enabled the reliable statistical characterization of BTI- and HCD-stressed as well as annealed RO monitor circuits. The versatility of the test vehicle presented in this work permits the execution of accelerated degradation tests together with annealing experiments conducted on RO-based reliability monitor circuits. From these experiments, we have constructed precise annealing maps that provide detailed insights into the annealing behavior of our monitors as a function of temperature and time, ultimately revealing the usage history of the IC. [ABSTRACT FROM AUTHOR]

With the escalating integration of Electronic Control Units (ECUs) in contemporary vehicles, the intricacy of vehicle networks is incessantly advancing. Diagnostic communication, as a pivotal facet within these networks, grapples with protracted development cycles and heightened intricacies. In a bid to augment software reusability and portability, this study meticulously scrutinized pertinent research and proffered an electric vehicle fault diagnosis system predicated on the Controller Area Network (CAN) bus, leveraging the diagnostic communication architecture advocated by the AUTOSAR standard. The integration of AUTOSAR seeks to pioneer an innovative software development paradigm for automotive fault diagnosis systems, thereby remedying extant limitations. The communication and diagnostic module of this study were instantiated using AUTOSAR, thereby obviating the necessity for developers to immerse themselves in hardware intricacies and communication implementations. This allows developers to focalize their efforts on crafting software features for fault diagnosis. Empirical results illustrate that the single-core CPU utilization rate of the proposed method in this article stands at 40.68%, with a fault detection time of 0.0217. The success rate of fault detection is 98.70%, indicating an increase of 12.97% and 8.98% when compared to the CAN bus and structural analysis methods, respectively. Testing indicators are significantly mitigated, yielding more precise fault detection outcomes. The exploration of this avant-garde software development methodology in automotive electronic products markedly amplifies the efficiency of automotive troubleshooting system software, underscoring its potential for academic contribution and application in real-world scenarios. [ABSTRACT FROM AUTHOR]

The additive manufacturing (AM) of functional copper (Cu) parts is a major goal for many industries, from aerospace to automotive to electronics, because Cu has a high thermal and electrical conductivity as well as being ~10× cheaper than silver. Previous studies on AM of Cu have concentrated mainly on high-energy manufacturing processes such as Laser Powder Bed Fusion, Electron Beam Melting, and Binder Jetting. These processes all require high-temperature heat treatment in an oxygen-free environment. This paper shows an AM route to multi-layered microparts from novel nanoparticle (NP) Cu feedstocks, performed in an air environment, employing a low-power (<10 W) laser sintering process. Cu NP ink was deposited using two mechanisms, inkjet printing, and bar coating, followed by low-power laser exposure to induce particle consolidation. Initial parts were manufactured to a height of approximately 100 µm, which was achieved by multi-layer printing of 15 (bar-coated) to 300 (inkjetted) layers. There was no evidence of oxidised copper in the sintered material, but they were found to be low-density, porous structures. Nonetheless, electrical resistivity of ~28 × 10−8 Ω m was achieved. Overall, the aim of this study is to offer foundational knowledge for upscaling the process to additively manufacture Cu 3D parts of significant size via sequential nanometal ink deposition and low-power laser processing. [ABSTRACT FROM AUTHOR]

Nanotechnology is a new field of science that produces extremely small structures from organic or inorganic materials. These nanoparticles can be used in many fields: medicine, foods, cosmetics, clothing, constructions, furniture, not only in the making of electronics or in the automotive industry. Because of their special properties nanoparticles, also known as nanomaterials, can revolutionize all fields in which they are used. But the domain in which they can bring the most important benefits for human life is medicine. Nanoparticles can be used in the medicine field in the production of drugs and vaccines, and also in diagnostic and investigative tools, etc. Nanomaterials are used with great success in imaging and in the construction of medical devices. Many European citizens have legitimate concerns about the safe use of nanoparticles in medicines. All these concerns can be put aside only through thoroughly testing all the medicines that contain nanoparticles before they will be put on the market for general use. [ABSTRACT FROM AUTHOR]

Abstract A 1 × 4 magneto‐electric dipole (ME dipole) antenna array for 77 GHz automotive radar is proposed. The ME dipole is fed by a fork‐shaped microstrip line coupling through a dog‐bone slot. To meet the requirements aimed at automotive radar applications, the beamwidths of the proposed antenna are well‐designed. Specially, a method of adding passive elements on both sides of the array is proposed to increase the 3 dB beamwidth from ±34° to ±52° in azimuth. Additionally, in elevation, a 3 dB beamwidth of ±10° is achieved by designing the spacing between array elements. Moreover, based on low‐loss printed circuit board substrates, radiation efficiency of the proposed array can reach approximately 90% at 77 GHz. Furthermore, a 4 × 4 array is established by arranging four 1 × 4 subarrays spacing 1.95 mm (half a free‐space wavelength at 77 GHz) to study the interactions between subarrays for multiple input multiple output scenarios. A 1 × 4 and a 4 × 4 antenna prototypes are fabricated and measured to validate the correctness of this design. The results show that the proposed antenna is an eligible candidate for the medium‐ and short‐range automotive radars.

Adapting sheets to doubly curved surfaces is a longstanding challenge in various engineering disciplines, from flexible and stretchable electronics to the automotive industry. However, current understanding often focuses on specific scenarios and neglects the diverse range of substrate conditions encountered in nature. This study investigates the pattern formation in confined core‐shell structures by modulating the levels of stiffness and curvature of the substrate. Beginning with the Föppl–von Kármán equation, this theory uncovers how the degree of confinement determines the location of wrinkles within confined sheets. Furthermore, the synchronization of patterns is observed: the formation of dimple or buckyball patterns on curved surfaces simultaneously with hierarchical wrinkles due to boundary constraints. The analytical models elucidate these phenomena, and both macroscopic and microscopic features can be systematically engineered to align with quantitative predictions. This research expands the current understanding of the sheet conformation problem and paves the way for pattern engineering across a range of curved structures. [ABSTRACT FROM AUTHOR]

In the field of ASIC and FPGA, Machine Learning (ML) techniques play a major role and become predominant for accurate results for different applications like big data analysis and automotive electronics, and driverless vehicles which are required speed and power savings. Due to increasing the demand for higher accuracy, low power, low area consumption, and higher throughput for the complexity of the designs in the latest technology, the proposed system is fulfilling these demands in ASIC and FPGA domains, reconfigurable hardware architecture has been proposed it consists of an ML-based Support Vector Machine (SVM), high-speed AHB protocol and Floating point (FP) operations and also the system has the flexibility to communicate with I2C and I2S protocols. In order to increase throughput with minimal latency, the proposed architecture with AHB protocol and AHB to APB bridge is incorporated between the fabric dynamically reconfigurable multi-processor (FDPM) and peripherals along with security algorithms using SHA-256bits and AES. In order to perform ML-based applications, the proposed system is incorporated double-precision floating point (DPFP) arithmetic operations. The overall proposed architecture is developed in Verilog HDL and quality checking using the LINT tool and Clock Domain Crossing (CDC) using Spyglass tool and synthesized using DC compiler for ASIC and Vivado Design Suite 2018.1 for FPGA implementation and verification. The entire design is interfaced with the Zynq processor and SDK tool to verify data transfer between hardware and software. The obtained results show the generated custom accelerator is able to compute any complex ML classifiers for a larger amount of data. The obtained results are compared with existing state-of-art results and found that 18 % improvement in throughput, a 21 % improvement in power consumption savings, and a 34 % reduction in latency. [ABSTRACT FROM AUTHOR]

Automobiles have undergone a transformation during the past two decades due to the merger of the electronics and automotive industries. The combination of autos and electronic sensors has resulted in a new generation of vehicles known as autonomous vehicles (AVs). These AVs have a few hundred thousand sensors, producing an enormous amount of raw data for computation. Data from the vehicular network can be offloaded to existing telecommunication infrastructure to address the problem of processing resources. In order to address vehicular network requirements, large-capacity servers deployed in major telecommunications networks are first used to offload resource-intensive tasks. Mobile Cloud Computing (MCC) is a critical enabling technology for 5 G networks, which has a key feature of offloading to divide application tasks into local and cloud server execution components. This paper proposes a novel Three TierEdge cloud computing (T2 EC2) system which uses an Energy-aware Dynamic Task offloading and collaborative task execution algorithm (EA-DTOCTE) for multilayer vehicular cloud computing networks. The EA-DTOCTE algorithm is included in the decision-making engine in the proposed system, which selects whether to offload the task to the remote environment or implement it locally. EA-DTOCTE focuses on consumption of energy by tasks both locally and remotely since its goal is to efficiently and dynamically split the application into tasks and schedule them on local devices and cloud resources. The proposed T2 EC2 has been evaluated in terms of parameters such as energy consumption, completion time, and throughput. Experimental results indicate that the proposed T2EC2 can save up to 28% of system energy consumption compared with other state-of-art techniques. [ABSTRACT FROM AUTHOR]

The lifecycles of vehicular resistor lead in random vibration environment were analyzed in this technical note and the finite element model of a vehicular printed circuit board (PCB) was established. It is with two short edges of PCB fixed for boundary condition to simulate the actual working conditions of the vehicle driving on the road, the constrained modal analysis was simulated and experimental verification were carried out. Both the PCB and the vehicular resistor which soldered on PCB were excited vertically according to Standard GJB150. Based on simulated vibration excitation environment, the power spectral density (PSD) stress value of the resistor lead was calculated. The lifecycles of the resistor lead were calculated theoretically and were verified by following failure-oriented accelerated testing (FOAT). Finally, in order to extend the lifecycles of resistor lead, an improved solution for PCB is put forward. [ABSTRACT FROM AUTHOR]

Capacitive micromachined ultrasonic transducer (CMUT) has been widely studied due to its excellent resonance characteristics and array integration. This paper presents the first study of the CMUT electrostatic stiffness resonant accelerometer. To improve the sensitivity of the CMUT accelerometer, this paper innovatively proposes the CMUT ring-perforation membrane structure, which effectively improves the acceleration sensitivity by reducing the mechanical stiffness of the elastic membrane. The acceleration sensitivity is 10.9 (Hz/g) in the acceleration range of 0–20 g, which is 100% higher than that of the conventional CMUT structure. This research contributes to the acceleration measurement field of CMUT and can effectively contribute to the breakthrough of vibration acceleration monitoring technology in aerospace, medical equipment, and automotive electronics. [ABSTRACT FROM AUTHOR]

Commercial adhesives typically fall into two categories: structural or pressure sensitive. Structural glues rely on covalent bonds formed during curing and provide high tensile strength whilst pressure‐sensitive adhesives use physical bonding to provide weaker adhesion, but with considerable convenience for the user. Here, a new class of adhesive is presented that is also reversible, with a bond strength intermediate between those of pressure‐sensitive and structural adhesives. Complementary water‐based formulations incorporating oppositely charged polyelectrolytes form electrostatic bonds that may be reversed through immersion in a low or high pH aqueous environment. This electrostatic adhesive has the advantageous property that it exhibits good adhesion to low‐energy surfaces such as polypropylene. Furthermore, it is produced by the emulsion copolymerization of commodity materials, styrene and butyl acrylate, which makes it inexpensive and opens the possibility of industrial production. Bio‐based materials have been also integrated into the formulations to further increase sustainability. Moreover, unlike other water‐based glues, adhesion does not significantly degrade in humid environments. Because such electrostatic adhesives do not require mechanical detachment, they are appropriate for the large‐scale recycling of, e.g., bottle labels or food packaging. The adhesive is also suitable for dismantling components in areas as varied as automotive parts and electronics. [ABSTRACT FROM AUTHOR]

Automated Vehicles are becoming more and more prevalent in the modern world. Although these vehicles are not without drawbacks, they are predicted to have numerous benefits to society and are here to stay. However, as society progresses towards a more computer-controlled and less human-operated vehicle world, U.S. laws have been unable to keep up with these scientific developments. The federal and state governments have yet to achieve uniformity in their automated vehicle laws and regulations. The former has only provided voluntary guidance. For the latter, some states have taken progressive approaches, while others have taken more conservative ones. Taking into consideration that the current and upcoming automated vehicle technologies will create difficulties for claimants to successfully bring claims under the existing state product liability laws, this Note will explore potential solutions and propose a solution to address the current flaws. This Note will examine what the European Union has achieved in this area of law and what solutions other legal scholars have proposed to address the issue. Finally, this Note will propose that the United States enact a unified federal automated vehicle regulation with a private cause of action for automated vehicle product liability. [ABSTRACT FROM AUTHOR]

Road accidents are a serious social problem, both in terms of public health and the costs associated with it, and as individual tragedies. Efforts to reduce the role of human factors in road accidents include partial or full automation of tasks performed by drivers through various types of advanced driver assistance systems. The question arises as to what characteristics of a technology user determine the degree of their trust in it in the context of the functionality and reliability of this technology. Two research questions related to the assessment of technology users (ADAS) of its reliability and effectiveness of operation and the differentiation of these assessments in individual groups of respondents were adopted. Data were obtained through survey research using the CATI (Computer Aided Interaction) technique Assisted Web Interview. 155 respondents participated in the study. As a result of the conducted research, it was found that the oldest systems, used for many years - ABS, airbags, inspire the greatest trust among drivers, while the least popular, used relatively recently - line assistance system. The respondent's metrics (gender, age, experience) do not affect the perception of the effectiveness and reliability of ADAS; this may be surprising, because it is commonly believed that young people are more willing to use various types of technological innovations. Many respondents have no opinion on the effectiveness and efficiency of ADAS systems - most often these are people who do not have such systems installed in their cars or have not had contact with them. The most "educated" group in terms of knowledge of ADAS are - which is not surprising - professional drivers, although the number of such respondents whose knowledge is negligible (17%) may be surprising. [ABSTRACT FROM AUTHOR]

Automotive electronics and related software market is growing significantly and expected to gain high demand of skilled employees in the next decade. The market drivers being the customer preferences, government regulations, technology adoption and recent participants like autonomous and electric vehicle technologies. Hence, industries are showing lot of interest in collaborations with academia for technology innovations and for getting industry ready employees. This paper presents the experiences and outcomes of collaborations with automotive industries in automotive embedded systems courses like, Automotive electronics, AUTOSAR, Multicore core architecture and programming, and Human-Machine-Interface offered to the students of Electronics and Communication Engineering program at KLE Technological University. These courses involve core technical concepts, computing, and design of hardware/ software architecture. The traditional mode of teaching is found to be less effective and hence, innovative pedagogical techniques are used with the help of industries for teaching these courses. The techniques helped to enhance students' ability to solve complex engineering problems and to build higher cognitive learning ability. The collaborative contributions from both industry experts and academic faculty in design and delivery of automotive embedded courses have resulted in building industry specific skills among students which in turn resulted into a greater number of in campus placements and reduction in on job training. [ABSTRACT FROM AUTHOR]

This tutorial paper focuses on the physical origin of thermal droop, i.e., the decrease in the luminescence of light-emitting diodes (LEDs) induced by increasing temperature. III-nitride-based LEDs are becoming a pervasive technology, covering several fields from lighting to displays, from automotive to portable electronics, and from horticulture to sensing. In all these environments, high efficiency is a fundamental requirement, for reducing power consumption and system cost. Over the last decade, a great deal of effort has been put in the analysis of the efficiency droop, the decrease in LED internal quantum efficiency (IQE) induced by high current density. On the other hand, an IQE decrease is observed also for increasing temperature, a phenomenon usually referred to as thermal droop. For commercial LEDs, the IQE decrease related to thermal droop can be comparable to that of efficiency droop: for this reason, understanding thermal droop is a fundamental step for making LEDs capable of operating at high temperature levels. In several fields (including street lighting, automotive, photochemical treatments, projection, entertainment lighting, etc.), compact and high-flux light sources are required: typically, to reduce the size, weight, and cost of the systems, LEDs are mounted in compact arrays, and heat sinks are reduced to a minimum. As a consequence, LEDs can easily reach junction temperatures above 85–100 °C and are rated for junction temperatures up to 150–175 °C (figures from commercially available LED datasheets: Cree XHP70, Osram LUW HWQP, Nichia NVSL219CT, Samsung LH351B, and LedEngin LZP-00CW0R) and this motivates a careful analysis of thermal droop. This paper discusses the possible physical causes of thermal droop. After an introduction on the loss mechanisms in junctions, we will individually focus on the following processes: (i) Shockley–Read–Hall (SRH) recombination and properties of the related defects; (ii) Auger recombination and its temperature dependence, including the discussion of trap-assisted Auger recombination; (iii) impact of carrier transport on the thermal droop, including a discussion on carrier delocalization, escape, and freeze out; (iv) non-SRH defect-related droop mechanisms. In addition, (v) we discuss the processes that contribute to light emission at extremely low current levels and (vi) the thermal droop in deep ultraviolet LEDs, also with reference to the main parasitic emission bands. The results presented within this paper give a tutorial perspective on thermal droop; in addition, they suggest a pathway for the mitigation of this process and for the development of LEDs with stable optical output over a broad temperature range. [ABSTRACT FROM AUTHOR]

In recent decades the market share of electrical cars has increased significantly, which has paved the way for the development of automotive electronics. Some of the most important parts of modern electrical vehicles are motor drives, which are used in car training and mechanization. Electrical drives are used in powertrains for traction, in air conditioning systems to cool cars and their parts, in doors for opening/closing as well as window movements, etc. The most popular motor type in electrical vehicles is synchronous motors with permanent magnets, which are compact and provide high torque. However, these motors require the development of control systems for proper operation. This system has to have the capacity to implement several state-of-the-art techniques, which can fully utilize motor potential, increase its efficiency, and decrease battery usage. One of these techniques is field-weakening, which overcomes speed limitations due to a lack of supply voltage and increases the motor's speed operation range. This paper discusses the most popular approaches to field-weakening, including a new method proposed by the author. It considers both the pros and cons of each approach and provides recommendations for their usage. After that, this manuscript demonstrates the experimental results of each field-weakening technique obtained in the same motor drive, compares their performance, and discusses their strengths and weaknesses. Finally, the experimental part demonstrates that the proposed field-weakening approach demonstrates similar dynamics in load transients but provides 10 times less load to the microcontroller. [ABSTRACT FROM AUTHOR]

Operation speed, data retention, thickness variation, and resistance drift are main shortages for conventional Ge2Sb2Te5 based phase change memory (PCM). In this Letter, we propose a type of ultrathin amorphous carbon (a-C)/Sb2Te multilayer nanostructures with semiconductor process compatibility, which has high speed and excellent reliability in terms of data retention (131 °C for 10-year), thickness variation (1.52%), and resistance drift (0.0095). The PCM devices based on [a-C (1 nm)/Sb2Te (7 nm)]5 multilayer nanostructures exhibit a fast operation speed of 5 ns. The SET/RESET resistance ratio remains constant over 105 cycles by more than two orders of magnitude. The excellent performance of a-C/Sb2Te multilayer nanostructures makes it a promising storage medium to expand the applications of PCM, such as automotive electronics. [ABSTRACT FROM AUTHOR]

Polyurethane and polyurea-based adhesives are widely used in various applications, from automotive to electronics and medical applications. The adhesive performance depends strongly on its composition, and developing the formulation–structure–property relationship is crucial to making better products. Here, we investigate the dependence of the linear viscoelastic properties of polyurea nanocomposites, with an IPDI-based polyurea (PUa) matrix and exfoliated graphene nanoplatelet (xGnP) fillers, on the hard-segment weight fraction (HSWF) and the xGnP loading. We characterize the material using scanning electron microscopy (SEM) and dynamic mechanical analysis (DMA). It is found that changing the HSWF leads to a significant variation in the stiffness of the material, from about 10 MPa for 20% HSWF to about 100 MPa for 30% HSWF and about 250 MPa for the 40% HSWF polymer (as measured by the tensile storage modulus at room temperature). The effect of the xGNP loading was significantly more limited and was generally within experimental error, except for the 20% HSWF material, where the xGNP addition led to about an 80% increase in stiffness. To correctly interpret the DMA results, we developed a new physics-based rheological model for the description of the storage and loss moduli. The model is based on the fractional calculus approach and successfully describes the material rheology in a broad range of temperatures (−70 °C–+70 °C) and frequencies (0.1–100 s−1), using only six physically meaningful fitting parameters for each material. The results provide guidance for the development of nanocomposite PUa-based materials. [ABSTRACT FROM AUTHOR]