27 results on '"Choe, Chanyang"'
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2. Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature
3. The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film
4. Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature
5. Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules
6. Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver
7. Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure
8. Bonding technology based on solid porous Ag for large area chips
9. Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
10. Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors
11. Low-stress design of bonding structure and its thermal shock performance (− 50 to 250 °C) in SiC/DBC power die-attached modules
12. Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests
13. Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro
14. Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature
15. Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere
16. Ag particles for sinter bonding: Flakes or spheres?
17. Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment
18. Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
19. Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere.
20. Effect of oxygen on Ag sintering technology with low temperature pressureless
21. Bonding technology using cold-rolled Ag sheet in die-attachment applications
22. Heat-resistant die-attach with cold-rolled Ag sheet
23. Printed Wiring for High-Power Electric Devices by Using Ag-sinter paste
24. Thermal effect on material properties of sintered porous silver during high temperature ageing
25. (Invited) Packaging Material Technology for Wide Band Gap Power Devices and Its Performance/Reliability Evaluation
26. Heat-resistant die-attach with cold-rolled Ag sheet
27. Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni⁻P Layers for High-Temperature Applications of Power Device Modules.
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