25 results on '"Glover, Michael D."'
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2. A Solution to Press-Pack Packaging of SiC MOSFETS
3. Design and evaluation of press-pack SiC MOSFET
4. Flip-chip bonded silicon carbide MOSFETs as a low parasitic alternative to wire-bonding
5. The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer
6. 3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices.
7. The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer
8. Flip-chip Bonded SiC Power Devices on a Low Temperature Co-fired Ceramic (LTCC) Substrate for Next Generation Power Modules
9. Application and reliability analysis of sintered silver preforms for die attachment of wide bandgap devices
10. Nanosilver preform assisted die attach for high temperature applications
11. High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
12. Metal Layer Losses in Thin-Film Microstrip on LTCC
13. An integrated gate driver in 4H-SiC for power converter applications
14. A UVLO Circuit in SiC Compatible With Power MOSFET Integration
15. Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems
16. Frequency and Time-Domain Performance of LTCC Transmission Lines Fabricated Using Multiple Printing Techniques
17. Nickel–Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles
18. A Low Loss Power Distribution Network Design in Low Temperature Co-fired Ceramic Technology
19. Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles
20. Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles
21. Highly Reliable Double-sided Bonding used in Double-sided Cooling for High Temperature Power Electronics
22. Integration of Tantalum Pentoxide Capacitors With Through-Silicon Vias
23. Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles.
24. A Hybrid Hexaband Cellular Antenna.
25. A Hybrid "Hexa-Band" Cellular Antenna.
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