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2D transition metal dichalcogenides (TMDs) for advanced logic transistor technologies are deposited by various modifications of the chemical vapor deposition (CVD) method using a wide variety of precursors. Being a major electrical performance limiter, the TMD crystal grain size strongly differs between the various CVD precursor chemistries from nano‐ to millimeter‐sized crystals. However, it remains unclear how the CVD precursor chemistry affects the nucleation density and resulting TMD crystal grain size. This work postulates guiding principles to design a CVD process for highly crystalline TMD deposition using a quantitative analytical model benchmarked against the literature. The TMD nucleation density reduces favorably under low supersaturation conditions where the metal precursor sorption on the starting surface is reversible and the corresponding metal precursor desorption rate exceeds the overall deposition rate. Such reversible precursor adsorption guarantees efficient long‐range gas‐phase lateral diffusion of precursor species in addition to short‐range surface diffusion, which vitally increases crystal grain size. The proposed model explains the large spread in experimentally observed TMD nucleation densities and crystal grain sizes for state‐of‐the‐art CVD chemistries. Ultimately, it empowers the reader to interpret and modulate precursor adsorption and diffusion reactions through designing CVD precursor chemistries. [ABSTRACT FROM AUTHOR]

Anisotropic growth of two-dimensional (2D) tungsten disulfide (WS2) crystals occurs during atomic layer deposition (ALD) from WS2 seeds at predetermined locations on large area dielectric substrates. The number of ALD reaction cycles determines the lateral dimensions of the WS2 crystals. This 2D synthesis approach is compatible with temperature sensitive structures due to the low deposition temperature and can be extended to other 2D materials and heterostructures thereof. The crystallinity of the seed and the selectivity of ALD precursors toward seeds and underlying starting surface affect the structural quality of the 2D crystals. [ABSTRACT FROM AUTHOR]

Atomically thin, 2D semiconductors, such as transition metal dichalcogenides, complement silicon in ultra‐scaled nano‐electronic devices. However, the semiconductor and its interfaces become increasingly more difficult to characterize chemically and electrically. Conventional methodologies, including scanning probe microscopies, fail to capture insight into the chemical and electronic nature of the semiconductor, albeit vital to understand its impact on the semiconductor performance. Therefore, this work presents a unique and universal in situ approach combining time‐of‐flight secondary ion mass spectrometry and atomic force microscopy to map chemical differences between regions of different electrical conductivity in epitaxially deposited tungsten disulfide (WS2) on sapphire substrates. Surprisingly, WS2 regions of lower electrical conductivity possess a larger amount of sulfur compared to regions with higher conductivity, for which oxygen is also detected. Such difference in chemical composition likely roots from the non‐homogeneously terminated sapphire starting surface, altering the WS2 nucleation behavior and associated defect formation between neighboring sapphire terraces. These resulting sapphire terrace‐dependent doping effects in the WS2 hamper its electrical conductivity. Thus, accurate chemical assignment at a sub‐micrometer lateral resolution of atomically thin 2D semiconductors is vital to achieve a more detailed understanding on how the growth behavior affects the electrical properties. [ABSTRACT FROM AUTHOR]

The structure, crystallinity and properties of as-deposited two-dimensional (2D) transition metal dichalcogenides are determined by nucleation mechanisms in the deposition process. 2D materials grown by atomic layer deposition (ALD) in the absence of a template are polycrystalline or amorphous. Little is known about their nucleation mechanisms. Therefore, the nucleation behavior of WS2 during plasma enhanced ALD from WF6, H2 plasma and H2S at 300 °C is investigated on amorphous ALD Al2O3 starting surface and on monocrystalline, bulk sapphire. Preferential interaction of the precursors with the Al2O3 starting surface promotes fast closure of the WS2 layer. The WS2 layers are fully continuous at WS2 content corresponding to only 1.2 WS2 monolayers. On amorphous Al2O3, (0002) textured and polycrystalline WS2 layers form with grain size of 5 to 20 nm due to high nucleation density (∼1014 nuclei/cm2). The WS2 growth mode changes from 2D (layer-by-layer) growth on the initial Al2O3 surface to three-dimensional (Volmer-Weber) growth after WS2 layer closure. Further growth proceeds from both WS2 basal planes in register with the underlying WS2 grain and from or over grain boundaries of the underlying WS2 layer with different in-plane orientation. In contrast, on monocrystalline sapphire, WS2 crystal grains can locally align along a preferred in-plane orientation. Epitaxial seeding occurs locally albeit a large portion of crystals remain randomly oriented, presumably due to the low deposition temperature. The WS2 sheet resistance is 168 MΩμm, suggesting that charge transport in the WS2 layers is limited by grain boundaries. [ABSTRACT FROM AUTHOR]

Two-dimensional (2D) transition metal dichalcogenides are potential low dissipative semiconductor materials for nanoelectronic devices. Such applications require the deposition of these materials in their crystalline form and with controlled number of monolayers on large area substrates, preferably using deposition temperatures compatible with temperature sensitive structures. This paper presents a low temperature plasma-enhanced atomic layer deposition (PEALD) process for 2D WS2 based on a ternary reaction cycle consisting of consecutive WF6, H2 plasma, and H2S reactions. Strongly textured, nanocrystalline WS2 is grown at 300 °C. The composition and crystallinity of these layers depends on the PEALD process conditions, as understood by a model for the redox chemistry of this process. The H2 plasma is essential for the deposition of WS2 as it enables the reduction of -W6+Fx surface species. Nevertheless, the impact of subsurface reduction reactions needs to be minimized to obtain WS2 with well-controlled composition (S/W ratio of 2). [ABSTRACT FROM AUTHOR]

Recently, a step-flow growth mode has been proposed to break the inherent molybdenum disulfide (MoS 2 ) crystal domain bimodality and yield a single-crystalline MoS 2 monolayer on commonly employed sapphire substrates. This work reveals an alternative growth mechanism during the metal-organic chemical vapor deposition (MOCVD) of a single-crystalline MoS 2 monolayer through anisotropic 2D crystal growth. During early growth stages, the epitaxial symmetry and commensurability of sapphire terraces rather than the sapphire step inclination ultimately govern the MoS 2 crystal orientation. Strikingly, as the MoS 2 crystals continue to grow laterally, the sapphire steps transform the MoS 2 crystal geometry into diamond-shaped domains presumably by anisotropic diffusion of ad-species and facet development. Even though these MoS 2 domains nucleate on sapphire with predominantly bimodal 0 and 60° azimuthal rotation, the individual domains reach lateral dimensions of up to 200 nm before merging seamlessly into a single-crystalline MoS 2 monolayer upon coalescence. Plan-view transmission electron microscopy reveals the single-crystalline nature across 50 μm by 50 μm inspection areas. As a result, the median carrier mobility of MoS 2 monolayers peaks at 25 cm 2 V -1 s -1 with the highest value reaching 28 cm 2 V -1 s -1 . This work details synthesis-structure correlations and the possibilities to tune the structure and material properties through substrate topography toward various applications in nanoelectronics, catalysis, and nanotechnology. Moreover, shape modulation through anisotropic growth phenomena on stepped surfaces can provide opportunities for nanopatterning for a wide range of materials.