5 results on '"Hsiang, Te-Pei"'
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2. Microscopic mechanical simulation and experimental demonstration of deformed-induced failure for Li-ion battery package in electric vehicle.
3. Microscopic mechanical simulation and experimental demonstration of deformed-induced failure for Li-ion battery package in electric vehicle
4. Estimation of Suppressing Warpage for Heterogeneous Integration of Packaging Framework by Utilizing Equivalent Material Simulated Technique
5. A novel multi-chip stacking technology development using a flip-chip embedded interposer carrier integrated in fan-out wafer-level packaging
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