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In dealing with the increasing power dissipation of electronic systems with increasing integration density, a field‐effect transistor (FET) with steep switching slope that overcomes the thermionic limit is vital to achieve low‐power operations. Here, we report two types of threshold switching (TS) FETs based on 2D Van der Waals heterostructures by virtue of the abrupt resistive switching of the hexagonal boron nitride (hBN) TS device. The common hBN dielectric layer functions as the switching medium for the TS device and the gate dielectric for the 2D FET enabling seamless integration of the hBN TS device and baseline 2D FET. TS FET in source configuration by connecting the TS device to the source terminal of the 2D FET offers an ultralow average subthreshold swing (SS) of 1.6 mV/dec over six decades of drain current at room temperature and suppressed leakage current. TS FET in gate configuration by connecting the TS device to the gate terminal of the 2D FET also exhibits steep switching slope with ultralow SS of 10.6 mV/dec. The proposed compact device structures integrating 2D FET and TS device provide a potential approach of monolithic integration toward next‐generation low‐power electronics. [ABSTRACT FROM AUTHOR]

Abstract In dealing with the increasing power dissipation of electronic systems with increasing integration density, a field‐effect transistor (FET) with steep switching slope that overcomes the thermionic limit is vital to achieve low‐power operations. Here, we report two types of threshold switching (TS) FETs based on 2D Van der Waals heterostructures by virtue of the abrupt resistive switching of the hexagonal boron nitride (hBN) TS device. The common hBN dielectric layer functions as the switching medium for the TS device and the gate dielectric for the 2D FET enabling seamless integration of the hBN TS device and baseline 2D FET. TS FET in source configuration by connecting the TS device to the source terminal of the 2D FET offers an ultralow average subthreshold swing (SS) of 1.6 mV/dec over six decades of drain current at room temperature and suppressed leakage current. TS FET in gate configuration by connecting the TS device to the gate terminal of the 2D FET also exhibits steep switching slope with ultralow SS of 10.6 mV/dec. The proposed compact device structures integrating 2D FET and TS device provide a potential approach of monolithic integration toward next‐generation low‐power electronics.

Abstract In this paper, we present a new novel simple iTFET with overlapping gate on source-contact (SGO), Drain Schottky Contact, and intrinsic SiGe pocket (Pocket-SGO iTFET). The aim is to achieve steep subthreshold swing (S.S) and high I ON current. By optimizing the gate and source-contact overlap, the tunneling efficiency is significantly enhanced, while the ambipolar effect is suppressed. Additionally, using a Schottky contact at the drain/source, instead of ion implantation drain/source, reduces leakage current and thermal budget. Moreover, the tunneling region is replaced by an intrinsic SiGe pocket posing a narrower bandgap, which increases the probability of band-to-band tunneling and enhances the I ON current. Our simulations are based on the feasibility of the actual process, thorough Sentaurus TCAD simulations demonstrate that the Pocket-SGO iTFET exhibits an average and minimum subthreshold swing of S.S avg = 16.2 mV/Dec and S.S min = 4.62 mV/Dec, respectively. At V D = 0.2 V, the I ON current is 1.81 $$\times$$ × 10–6 A/μm, and the I ON/I OFF ratio is 1.34 $$\times$$ × 109. The Pocket-SGO iTFET design shows great potential for ultra-low-power devices that are required for the Internet of Things (IoT) and AI applications.

In this paper, we present a new novel simple iTFET with overlapping gate on source-contact (SGO), Drain Schottky Contact, and intrinsic SiGe pocket (Pocket-SGO iTFET). The aim is to achieve steep subthreshold swing (S.S) and high ION current. By optimizing the gate and source-contact overlap, the tunneling efficiency is significantly enhanced, while the ambipolar effect is suppressed. Additionally, using a Schottky contact at the drain/source, instead of ion implantation drain/source, reduces leakage current and thermal budget. Moreover, the tunneling region is replaced by an intrinsic SiGe pocket posing a narrower bandgap, which increases the probability of band-to-band tunneling and enhances the ION current. Our simulations are based on the feasibility of the actual process, thorough Sentaurus TCAD simulations demonstrate that the Pocket-SGO iTFET exhibits an average and minimum subthreshold swing of S.Savg = 16.2 mV/Dec and S.Smin = 4.62 mV/Dec, respectively. At VD = 0.2 V, the ION current is 1.81 × 10–6 A/μm, and the ION/IOFF ratio is 1.34 × 109. The Pocket-SGO iTFET design shows great potential for ultra-low-power devices that are required for the Internet of Things (IoT) and AI applications. [ABSTRACT FROM AUTHOR]

Two-dimensional (2D) atomic threshold switching field-effect transistors (ATS-FETs), which integrate 2D FET with threshold switching (TS) devices, have garnered attention as part of the subthreshold swing (SS) improvement for next-generation low-power devices. For industrial applications of 2D ATS-FET, it is important to secure the threshold voltage (Vth) modulation technique. Here, Vth engineering is performed by altering the counter electrode (CE) of a TS device, and the electrical performance of the ATS-FET is systematically investigated. The work function difference between the active electrode and CE alters the internal electric field (E-field) formed between these two electrodes. This severely affects the metal ion migration of the active electrode and induces the Vth shift of the ATS-FET. Because the proposed Vth adjusting technique does not affect the channel material, the MoS2 ATS-FET with the proposed technique can shift Vth while maintaining a high on–off ratio of >105 A on average and achieves an ultra-low average SS of ∼10.929 mV/dec. Moreover, the SS variation due to the random interface traps between the channel and gate dielectric is sufficiently suppressed. This study is expected to be a cornerstone for ATS-FET research by offering a compact platform to adjust Vth without deteriorating steep-slope characteristics.

Abstract For next‐generation electronics and optoelectronics, 2D‐layered nanomaterial‐based field effect transistors (FETs) have garnered attention as promising candidates owing to their remarkable properties. However, their subthreshold swings (SS) cannot be lower than 60 mV/decade owing to the limitation of the thermionic carrier injection mechanism, and it remains a major challenge in 2D‐layered nanomaterial‐based transistors. Here, a gate‐connected MoS2 atomic threshold switching FET using a nitrogen‐doped HfO2‐based threshold switching (TS) device is developed. The proposed device achieves an extremely low SS of 11 mV/decade and a high on‐off ratio of ≈106 by maintaining a high on‐state drive current due to the steep switching of the TS device at the gate region. In particular, the proposed device can function as an infrared detectable phototransistor with excellent optical properties. The proposed device is expected to pave the way for the development of future 2D channel‐based electrical and optical transistors.

For next‐generation electronics and optoelectronics, 2D‐layered nanomaterial‐based field effect transistors (FETs) have garnered attention as promising candidates owing to their remarkable properties. However, their subthreshold swings (SS) cannot be lower than 60 mV/decade owing to the limitation of the thermionic carrier injection mechanism, and it remains a major challenge in 2D‐layered nanomaterial‐based transistors. Here, a gate‐connected MoS2 atomic threshold switching FET using a nitrogen‐doped HfO2‐based threshold switching (TS) device is developed. The proposed device achieves an extremely low SS of 11 mV/decade and a high on‐off ratio of ≈106 by maintaining a high on‐state drive current due to the steep switching of the TS device at the gate region. In particular, the proposed device can function as an infrared detectable phototransistor with excellent optical properties. The proposed device is expected to pave the way for the development of future 2D channel‐based electrical and optical transistors. [ABSTRACT FROM AUTHOR]

Abstract: Complementary fully-depleted Ge interband-tunneling field-effect transistors (TFETs) and static inverters are modeled to quantify TFET performance relative to Si MOSFETs. SYNOPSYS TCAD is used to compute the two-dimensional electrostatics and determine the tunnel junction electric field. This electric field is used in an analytic expression to compute the tunnel current. The speed and power performance of TFETs are compared with the nMOSFET at the same supply voltage, 0.5V. For a gate length of 20nm, Ge tunnel transistors can provide similar speed in comparison to 45-nm-node nMOSFETs (18nm gate length), but saves more than 2× in power and lowers energy by over 7×. Toward demonstrating these transistors, a process for forming submicron p+n+ Ge tunnel junctions has been utilized in which Al-doped p+ Ge is regrown on n+ Ge, following melt-back of a patterned Al deposition. Transmission electron microscopy (TEM) reveals the regrown film and a contact microstructure consistent with the Al–Ge phase diagram. The low peak-to-valley current ratio (PVR) of devices produced by this growth method is likely a result of point defects or junction doping non-uniformity as TEM suggest no dislocations at the regrown junction. The PVR of these junctions does not improve as the device area is reduced from 100 to 0.1μm2, a size smaller than the formation scale for grains in the Al–Ge system. [Copyright &y& Elsevier]

Contact engineering for monolayered transition metal dichalcogenides (TMDCs) is considered to be of fundamental challenge for realizing high-performance TMDCs-based (opto) electronic devices. Here, an innovative concept is established for a device configuration with metallic copper monosulfide (CuS) electrodes that induces sulfur vacancy healing in the monolayer molybdenum disulfide (MoS 2 ) channel. Excess sulfur adatoms from the metallic CuS electrodes are donated to heal sulfur vacancy defects in MoS 2 that surprisingly improve the overall performance of its devices. The electrode-induced self-healing mechanism is demonstrated and analyzed systematically using various spectroscopic analyses, density functional theory (DFT) calculations, and electrical measurements. Without any passivation layers, the self-healed MoS 2 (photo)transistor with the CuS contact electrodes show outstanding room temperature field effect mobility of 97.6 cm 2 (Vs) -1 , On/Off ratio > 10 8 , low subthreshold swing of 120 mV per decade, high photoresponsivity of 1 × 10 4  A W -1 , and detectivity of 10 13 jones, which are the best among back-gated transistors that employ 1L MoS 2 . Using ultrathin and flexible 2D CuS and MoS 2 , mechanically flexible photosensor is also demonstrated, which shows excellent durability under mechanical strain. These findings demonstrate a promising strategy in TMDCs or other 2D material for the development of high performance and functional devices including self-healable sulfide electrodes., (© 2021 Wiley-VCH GmbH.)