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Silicon carbide fiber-reinforced silicon carbide matrix ceramic composites (SiCf/SiC) are extensively utilized in high-temperature resistant materials in the aerospace industry. This study investigated the influence of stacking structure on the performance of SiCf/SiC laminated composite plates with film cooling. Initially, the thermal conductivity of cross-piled SiCf/SiC composites was determined using the laser flash analysis (LFA) method and differential scanning calorimetry (DSC) method. Subsequently, a representative volume element (RVE) model that reflected the stacking structure was established. The anisotropic thermal conductivity of the unidirectional SiCf/SiC layer was calculated using numerical methods and experimental results. Finally, numerical simulations were carried out to assess the film cooling effectiveness of various stacking sequences and layers. The results showed that the thermal conductivity values predicted by the RVE model for the laminated composite aligned well with the experimental results, and the unidirectional SiCf/SiC composite thermal conductivities at different temperatures were obtained. The stacking sequence impacted the temperature distribution near the film hole, with the [0-90-0] structure exhibiting a more pronounced effect on film cooling performance compared with the [0-90] and [0-90-90-0] structures. The performance of the film cooling in the laminated SiCf/SiC composites was consistent across all stacking layers [0-90]1, [0-90]2, and [0-90]3. The maximum difference in overall cooling efficiency was 1.7% between [0-90-0]1 and [0-90]1 and [0-90-90-0]1 [ABSTRACT FROM AUTHOR]

SiC fiber-reinforced silicon matrix (SiCf/SiC) composites are of significant interest for the aircraft engine. The thermal conductive behaviors of [0-90-0]s SiCf/SiC composites along in-plane and out-of-plane (thickness) directions were reported in this paper. The thermal conductivity of the SiCf/SiC composite was tested by using the steady-state measuring apparatus. Then, the thermal conductivity of the SiC matrix was predicted by finite element analysis (FEA). The representative volume element (RVE) models of SiCf/SiC composites were built, and FEA was used to investigate thermal conductive behaviors. It was found that the thermal conductivity along the fiber radial direction was greater than it was in the axial direction in the SiCf/SiC composite and that the thermal conductivity of the out-of-plane direction is lower than that of the in-plane one. The thermal conductivity of the SiCf/SiC composite in the in-plane direction at room temperature was 31.1 Wm−1K−1 and 28.5 Wm−1K−1, and the thermal conductivity in the thickness direction was 24.9 Wm−1K−1. The experimental thermal conductivity showed a good agreement with the thermal conductivity of FEA. [ABSTRACT FROM AUTHOR]