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31 results on '"Vagnon, Eric"'

11. Effect of Conducting and Semiconducting Nanoparticles on the AC Breakdown Voltage and Electrostatic Charging Tendency of Synthetic Ester

Author

Khelifa, Hocine, Beroual, Abderrahmane, and Vagnon, Eric

Abstract

This work aims to study the effect of conducting and semiconducting nanoparticles (NPs) on ac breakdown voltage (ac-BDV) and the electrostatic charging tendency (ECT) of synthetic ester (SE), namely, MIDEL 7131; ac-BDV and ECT are two important properties that must be considered when choosing an insulating oil for use in power transformers. The NPs being tested are iron oxide (Fe3O4, fullerene (C60, and copper oxide (CuO) NPs at 0.1-g/L (0.01 wt%) concentration. An improved nanofluid (NF) preparation procedure and the ECT test cell are presented. This latter consists of a spinning disk covered on both sides by the solid insulator being tested and immersed in the investigated liquid. It is observed that NF with Fe3O4NPs shows the best improvement of ac-BDV; this improvement is about 22.44%. The improvements are about 7.81% and 8.24% with 0.1-g/L CuO and C60NFs, respectively. Regarding ECT, the measurement results show that the liquid volume charge density increases with disk rotation speed over time; a lower ECT is observed with the three NFs. Also, the NFs show a similar ECT at low speed (200 r/min); beyond that speed, the effect of adding CuO and C60NPs on the ECT reduction of MIDEL 7131 becomes more significant than that with Fe3O4NPs.

Published
2023
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22. Etudes de faisabilité d'un module de puissance 3D de type presspack pour des applications de faible et moyenne puissances

Author

Vagnon, Eric, Crébier, Jean-Christophe, Avenas, Yvan, Jeannin, Pierre-Olivier, Laboratoire de Génie Electrique de Grenoble (G2ELab), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut Polytechnique de Grenoble - Grenoble Institute of Technology-Centre National de la Recherche Scientifique (CNRS), and Vagnon, Eric

Subjects
[SPI.NRJ]Engineering Sciences [physics]/Electric power, [SPI.NRJ] Engineering Sciences [physics]/Electric power
Abstract

L'objet de cette étude porte sur le packaging des composants actifs de puissance verticaux utilisés dans les modules de puissance, de la centaine de W à quelques kW. Nous exposerons l'approche que nous nous proposons d'appliquer pour envisager de manière innovante l'encapsulation des composants actifs de puissance. Celle-ci nous permet, entre autres, d'améliorer le comportement de la cellule de commutation traditionnellement utilisée en électronique de puissance. Nous définissons un élément générique qui pourrait être l'élément de base utilisé pour l'assemblage des modules de puissance. Le concept s'appuie sur une géométrie en 3 Dimensions de la cellule de commutation. La stratégie de mise en oeuvre est basée sur le contact faiblement pressé. Après la caractérisation électro-thermique du contact pressé dans le cas d'un contact Al-Cu puis Cu-face d'une diode, le concept a été illustré par la réalisation d'un module 3D de puissance pressé à mise en oeuvre simplifiée.

Published
2008

23. Composants actifs de puissance et architectures 3D pour une meilleure gestion du contact ETM

Author

Crébier, Jean-Christophe, Avenas, Yvan, Vladimirova, Kremena, Jeannin, Pierre-Olivier, Schaeffer, Christian, Vagnon, Eric, Thollin, Benoît, Laboratoire de Génie Electrique de Grenoble (G2ELab), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut Polytechnique de Grenoble - Grenoble Institute of Technology-Centre National de la Recherche Scientifique (CNRS), and Garcia, Sylvie

Subjects
[SPI.NRJ]Engineering Sciences [physics]/Electric power, ComputingMilieux_MISCELLANEOUS, [SPI.NRJ] Engineering Sciences [physics]/Electric power
Abstract

International audience

Published
2010

24. Solutions innovantes pour le packaging de convertisseurs statiques polyphasés

Author

Vagnon, Eric, Garcia, Sylvie, Laboratoire de Génie Electrique de Grenoble (G2ELab), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut Polytechnique de Grenoble - Grenoble Institute of Technology-Centre National de la Recherche Scientifique (CNRS), Institut National Polytechnique de Grenoble - INPG, and Jean-Christophe CREBIER

Subjects
doublesidded cooling, [SPI]Engineering Sciences [physics], Packaging, refroidissement double face, [SPI] Engineering Sciences [physics], polyphased converters, contact press, encapsulation, pressed contact, convertisseurs polyphasés, Power Chip-on-Chip Concept, Structure 3D, 3D Structure
Abstract

Today, power electronics has evolved in an environmental context where energy conservation is a central issue. For electronic engineers, the technological translation of this dilemma is the research of conversion structures optimizing the performance, reliability and absorbed or produced energy quality. This effort to optimize energy cannot be satisfactory without adaptive research material for industrial and domestic applications (electric aircraft, lighting ...). In this context, this work seeks innovative packaging solutions for static converters that meet the requirements of these new constraints where miniaturization, reliability or EMC immunity to disturbances are crucial., L'électronique de puissance d'aujourd'hui s'inscrit dans un contexte environnemental où l'économie d'énergie est au centre des préoccupations. La traduction technologique d'une telle problématique sera, pour l'électronicien, la recherche de structures de conversion optimisant à la fois le rendement, la fiabilité et la qualité de l'énergie absorbée ou produite. Cet effort d'optimisation énergétique ne saurait être satisfaisant sans une recherche d'adaptation matérielle aux applications industrielles ou domestiques visées (avion tout électrique, éclairage...). C'est dans ce contexte que se situe ce travail de thèse, visant à chercher des solutions innovantes en terme de package de convertisseurs statiques satisfaisant les exigences de ces nouveaux secteurs d'exploitation, dans lesquels la miniaturisation, la fiabilité ou encore l'immunité aux perturbations CEM sont déterminants.

Published
2010

25. A Busbar Like Power Module Based on 3D Power Chip on Chip Hybrid Integration

Author

Vagnon, Eric, Jeannin, Pierre-Olivier, Crébier, Jean-Christophe, Avenas, Yvan, Laboratoire de Génie Electrique de Grenoble (G2ELab), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut Polytechnique de Grenoble - Grenoble Institute of Technology-Centre National de la Recherche Scientifique (CNRS), and Garcia, Sylvie

Subjects
[SPI.NRJ]Engineering Sciences [physics]/Electric power, ComputingMilieux_MISCELLANEOUS, [SPI.NRJ] Engineering Sciences [physics]/Electric power
Abstract

International audience

Published
2010

30. Series connection of IGBT

Author

Van Nguyen, The, primary, Jeannin, Pierre-Olivier, additional, Vagnon, Eric, additional, Frey, David, additional, and Crebier, Jean-Christophe, additional

Published
2010
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31. A Busbar Like Power Module Based On 3D Chip On Chip Hybrid Integration

Author

Yvan Avenas, Kevin Guepratte, P. O. Jeannin, J. C. Crebier, Eric Vagnon, Vagnon, Eric, Laboratoire de Génie Electrique de Grenoble (G2ELab), and Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut Polytechnique de Grenoble - Grenoble Institute of Technology-Centre National de la Recherche Scientifique (CNRS)

Subjects
Engineering, power/drive interaction, Busbar, packaging, 02 engineering and technology, 7. Clean energy, Electromagnetic interference, Chip on Chip approach, EMI, component, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, radiated field, business.industry, Buck converter, [SPI.NRJ]Engineering Sciences [physics]/Electric power, 020208 electrical & electronic engineering, Electrical engineering, Three-dimensional integrated circuit, 020206 networking & telecommunications, Power (physics), electrostatic analisys, press pack implementation, Power module, Logic gate, business, [SPI.NRJ] Engineering Sciences [physics]/Electric power
Abstract

The paper focuses on a new generation of power modules, trying to optimize the tradeoff between thermal and EMI managements. At the same time, the packaging approach is considered in order to simplify the implementation of the power dies while improving the reliability of the structure. The approach considers the hybrid integration of the power dies, one on top of the other into a 3D Chip On Chip configuration. Thanks to this structure, the power dies can be directly inserted within electrical plates, the whole structure emulating a busbar like power module. The paper presents the characteristics and the benefits of the approach. Then, it focuses on the practical characterization of two prototypes: a buck converter structure and a full bridge, single phase diode rectifier. Both of them are based on double sided thermal cooling and electro-thermal contacts are obtained by pressure. The prototypes exhibit great performances while offering really reduced parasitic and EMI coupling.

Published
2009

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