5 results on '"Xiong, Jieran"'
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2. Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging
3. Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints
4. Erratum to: Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints
5. Preparation, Microstructure and Properties of Environmentally Friendly Sn-58Bi Eutectic Solder Ribbon for Electronic Package
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