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This article addresses the design of a compact heat exchanger for the cooling of electronic systems. The Quality Function Deployment (QFD) method is used to identify crucial product features to improve device performance and key customer requirements. The QFD simplifies management processes, allowing modifications to device components, such as design parameters (dimensions and materials) and operating conditions (flow type and preferred temperature range). The study was applied to analyse the fundamental features of a compact heat exchanger, assessing their impact on enhancing heat transfer intensity during fluid flow through mini-channels. The thermal efficiency of the compact heat exchanger was tested experimentally. The results allow to verify the results obtained from the numerical simulations due to Simcenter STAR-CCM+. Consequently, the experimental part was reduced in favour of numerical simulations conducted using this commercial CFD software version 2020.2.1 Build 15.04.01. The numerical simulations performed with the aid of CFD showed increases in the heat transfer coefficient of up to 180% compared to the case treated as a reference. The application of the QFD matrix significantly reduces the time required to develop suitable design and material solutions and determine the operating parameters for the cooling of miniature electronic devices. [ABSTRACT FROM AUTHOR]