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Highlights: The SiO2 nanofiber membranes and MXene@c-MWCNT6:4 as one unit layer (SMC1) were bonded together with 5 wt% PVA solution. When the structural unit is increased to three layers, the resulting SMC3 has an average electromagnetic interference SET of 55.4 dB and a low thermal conductivity of 0.062 W m−1 K−1. SMCx exhibit stable electromagnetic interference shielding and excellent thermal insulation even in extreme heat and cold environment. A lightweight flexible thermally stable composite is fabricated by combining silica nanofiber membranes (SNM) with MXene@c-MWCNT hybrid film. The flexible SNM with outstanding thermal insulation are prepared from tetraethyl orthosilicate hydrolysis and condensation by electrospinning and high-temperature calcination; the MXene@c-MWCNTx:y films are prepared by vacuum filtration technology. In particular, the SNM and MXene@c-MWCNT6:4 as one unit layer (SMC1) are bonded together with 5 wt% polyvinyl alcohol (PVA) solution, which exhibits low thermal conductivity (0.066 W m−1 K−1) and good electromagnetic interference (EMI) shielding performance (average EMI SET, 37.8 dB). With the increase in functional unit layer, the overall thermal insulation performance of the whole composite film (SMCx) remains stable, and EMI shielding performance is greatly improved, especially for SMC3 with three unit layers, the average EMI SET is as high as 55.4 dB. In addition, the organic combination of rigid SNM and tough MXene@c-MWCNT6:4 makes SMCx exhibit good mechanical tensile strength. Importantly, SMCx exhibit stable EMI shielding and excellent thermal insulation even in extreme heat and cold environment. Therefore, this work provides a novel design idea and important reference value for EMI shielding and thermal insulation components used in extreme environmental protection equipment in the future. [ABSTRACT FROM AUTHOR]

In response to the increasing utilization of communication technology, there is a growing need for electromagnetic interference (EMI) shielding materials to adapt to diverse application scenarios. In this study, the self‐destructible EMI shielding films (SEFs) that possess the unique capability to reduce conductivity and shielding efficiency through temperature elevation are introduced. The SEFs effectively fulfill the requirement of triggering EMI shielding failure under specific conditions, which can be achieved by simply spraying a mixture of thermally expandable microspheres (TEMs), conductive fillers, and resin substrates. The segregated structures resulting from the incorporation of TEMs confer exceptional electrical conductivity and superior EMI shielding performance at low conductive filler content. When the ambient temperature surpasses the glass transition temperature of the TEM shell, the thermally expandable characteristics cause a disruption in the conductive path of the SEFs, leading to a significant decline in shielding effectiveness. Additionally, the SEFs exhibit outstanding Joule heating effects (90 °C) at low voltage (1.5 V) within a brief time frame (10 s). Importantly, when employed as Joule heaters, the SEFs possess an intrinsic safety mechanism that automatically ceases operation in the event of circuit overload, thus minimizing any potential risks. [ABSTRACT FROM AUTHOR]

Highlights In this paper, a hybrid approach was employed by integrating a high‐modulus, high‐tensile‐strength carbon fiber fabric (CFF) with a low‐density, high‐toughness silk nonwoven fabric (SNWF) to fabricate CFF‐SNWF reinforced epoxy (CFF‐SNWF/EP) hybrid composites. Through the surface freeze‐induced self‐assembly process, the multiscale hybrid modified layers were successfully constructed on the surfaces of both CFF and SNWF. This novel approach effectively enhanced the interfacial strength of the hybrid fibers (HFs). Comparing the performance of the modified composites with unmodified CFF reinforced epoxy (CFF/EP), significant improvements in both tensile strength and interlaminar shear strength were observed. Specifically, the tensile strength and interlaminar shear strength of the modified composites reached 626.7 and 39.16 MPa, a rise scope of 17.1% and 14.8%, respectively. In addition, the hybrid fibers reinforced polymers (HFRPs) exhibited a superior electromagnetic interference (EMI) shielding capabilities. For insistence, the modified CFF/EP with a thickness of 2.0 mm showed an impressive EMI shielding effectiveness value of 50 dB. These findings underscore the promising application potential of CFF‐SNWF/EP hybrid composites, particularly in the field of consumer electronics. The surface of hybrid fiber was modified by PDA‐GO‐OCNTs‐WPU. Multi‐scale structure contributes a lot in composite performance. Hybrid effect before and after interfacial modification is performed. The hybrid interface modification and hybrid structure were analyzed. [ABSTRACT FROM AUTHOR]