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The rapid development of miniaturized, high-frequency, and highly integrated microelectronic devices has brought about critical issues in electromagnetic compatibility and thermal management. In recent years, there has been significant interest in lightweight polymer-based composites that offer both electromagnetic interference (EMI) shielding and thermal conductivity. One promising approach involves constructing three-dimensional (3D) interconnection networks using functional fillers in the polymer matrix. These networks have been proven effective in enhancing the thermal and electrical conductivity of the composites. This mini-review focuses on the preparation and properties of 3D network-reinforced polymer composites, specifically those incorporating metal, carbon, ceramic, and hybrid networks. By comparing the effects of different filler types and distribution on the composite materials, the advantages of 3D interconnected conductive networks in polymer composites are highlighted. Additionally, this review addresses the challenges faced in the field of multifunctional thermal management and electromagnetic protection materials and provides insights into future development trends and application prospects of 3D structured composites. [ABSTRACT FROM AUTHOR]

In ternary nitrides, the Ga0.9Fe3.1N sample has ultimately been prepared through solid‐gas preparation for the gallium‐richest phase GaFe3N. The substitution of gallium atoms for iron atoms weakens the saturation magnetization of ferromagnetic γʹ‐Fe4N and induces the transmission from ferromagnetism to antiferromagnetism. A new magnetic behavior, defined as the spin glassy magnetic state, has been observed in the temperature‐dependent magnetic performance measurement process for Ga0.9Fe3.1N. The magnetic competition between ferromagnetic and antiferromagnetic Fe–Fe bonds will lead to the spin frustration of the magnetic system. And even the positional disorders caused by substitution, will all be responsible for the spin glassy behavior in Ga0.9Fe3.1N. [ABSTRACT FROM AUTHOR]

Choledochal cysts (CCs) are an important risk factor for cholangiocarcinoma, though their etiology remains debated. Given the vital role of bile fluid in digestive processes within the biliary system, examining such mechanisms from the perspective of bile fluid dynamics may offer additional insights for clinical use. This study utilized magnetic resonance imaging (MRI)-based patient-specific scans for detailed reconstruction and further employed the computational fluid dynamic method to assess the physiological functions of each system, including refilling and emptying processes. The impact of bile rheological property was also examined. Key biomechanical parameters—pressure and wall shear stress (WSS)—were displayed on a two-dimensional plane via surface mapping for enhanced visualization and comparative analysis. Outcomes demonstrated a significant reduction in bile flow velocity in CCs patients due to common bile duct's anatomical features and bile's shear-thinning, non-Newtonian nature, with a notable increase in pressure drop observed. In healthy biliary systems, WSS variations were minimal; however, in CCs patients, extreme WSS differences were found, with the highest WSS in the segmental bile duct and the lowest in the dilatation area, presenting a magnitude difference of approximately 1000. CCs one showed WSS levels 100–250 times higher than healthy ones in the common bile duct. Bile rheological properties substantially affect pressure and WSS patterns, particularly WSS, where pathological bile caused a tenfold increase in WSS compared to healthy bile. The findings aimed to enhance the understanding of biliary fluid mechanics in CCs and offer insights into selected fluidic variables for future microfluidic chip experiments. [ABSTRACT FROM AUTHOR]

The high integration density of microelectronic devices leads to local heat accumulation, and effective heat dissipation and signal transmission of packaging materials have become the primary issues to be solved. However, existing polymer materials have difficulty meeting the requirements due to their unsatisfactory thermal conductivity and thermal expansion properties. In this work, we proposed the use of digital light processing (DLP) printing technology to construct a triply periodic minimum surface (TPMS) skeleton, and a continuous and efficient heat conduction path was successfully constructed in epoxy resin by impregnating h-BN on the skeleton surface. When the loading of h-BN was 20 vol%, the thermal conductivity of the TPMS(SiO 2)@BN/EP(BN) composites was 1.86 W/(m·K), which was 786 % higher than that of pure epoxy resin. In addition, the thermal expansion coefficient of the composites decreased by more than 70 %. At the test frequencies of 3∼10 MHz, the composites showed stable dielectric properties, and the dielectric constant was always maintained in a low range, between 3.85 and 4.15. This work has realized the transformation of the method for constructing a heat conduction path from disordered to ordered and from random to repeatable. This provides a new strategy for the selection of microelectronic packaging materials. [ABSTRACT FROM AUTHOR]