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Frequency-agile lasers that can simultaneously feature low noise characteristics as well as fast mode hop-free frequency tuning are keystone components for applications ranging from frequency modulated continuous wave (FMCW) LiDAR, to coherent optical communication and gas sensing. The hybrid integration of III-V gain media with low-loss photonic integrated circuits (PICs) has recently enabled integrated lasers with faster tuning and lower phase noise than the best legacy systems, including fiber lasers. In addition, lithium niobate on insulator (LNOI) PICs have enabled to exploit the Pockels effect to demonstrate self-injection locked hybrid lasers with tuning rates reaching peta-hertz per second. However, Pockels-tunable laser archetypes relying on high-Q optical microresonators have thus far only achieved limited output powers, are difficult to operate and stabilize due to the dynamics of self-injection locking, and require many analog control parameters. Here, we overcome this challenge by leveraging an extended distributed Bragg reflector (E-DBR) architecture to demonstrate a simple and turn-key operable frequency-agile Pockels laser that can be controlled with single analog operation and modulation inputs. Our laser supports a continuous mode hop-free tuning range of over 10 GHz with good linearity and flat actuation bandwidth up to 10 MHz, while achieving over 15 mW in-fiber output power at 1545 nm and kHz-level intrinsic linewidth, a combination unmet by legacy bulk lasers. This hybrid laser design combines an inexpensive reflective semiconductor optical amplifier (RSOA) with an electro-optic DBR PIC manufactured at wafer-scale on a LNOI platform. We showcase the performance and flexibility of this laser in proof-of-concept coherent optical ranging (FMCW LiDAR) demonstration, achieving a 4 cm distance resolution and in a hydrogen cyanide spectroscopy experiment., Comment: 10 pages, 5 figures

Silicon nitride (Si$_3$N$_4$) photonic integrated circuits (PICs) have shown low linear loss, negligible nonlinear loss, and high power handling over traditional silicon photonics. To achieve high-density photonic integration and high effective nonlinearity through tight optical confinement, thick stoichiometric Si$_3$N$_4$ films are indispensable. However, when using low-pressure chemical vapor deposition (LPCVD) to achieve high optical material transparency, Si$_3$N$_4$ films exhibit large tensile stress on the order of GPa. Methods for crack prevention are therefore essential. The photonic Damascene process has addressed this issue, attaining record low loss Si$_3$N$_4$ PICs, but it lacks control of the waveguide height. Conversely, precise waveguide dimension and ultra-low loss have been achieved with subtractive processing, but this method is not compatible with mass production due to the use of electron beam lithography. To date, an outstanding challenge is to attain both lithographic precision and ultra-low loss in high confinement Si$_3$N$_4$ PICs that are compatible with large-scale foundry manufacturing. Here, we present a single-step deposited, DUV-based subtractive method for producing wafer-scale ultra-low loss Si$_3$N$_4$ PICs that harmonize these necessities. By employing deep etching of densely distributed, interconnected trenches into the substrate, we effectively mitigate the tensile stress in the Si$_3$N$_4$ layer, enabling direct deposition of thick films without cracking and substantially prolonged storage duration. Lastly, we identify ultraviolet (UV) radiation-induced damage that can be remedied through rapid thermal annealing. Collectively, we develop ultra-low loss Si$_3$N$_4$ microresonators and 0.5 m-long spiral waveguides with losses down to 1.4 dB/m at 1550 nm with high production yield., Comment: 2023 Conference on Lasers and Electro-Optics (CLEO). IEEE, 2023

Recent decades have seen significant advancements in integrated photonics, driven by improvements in nanofabrication technology. This field has developed from integrated semiconductor lasers and low-loss waveguides to optical modulators, enabling the creation of sophisticated optical systems on a chip scale capable of performing complex functions like optical sensing, signal processing, and metrology. The tight confinement of optical modes in photonic waveguides further enhances the optical nonlinearity, leading to a variety of nonlinear optical phenomena such as optical frequency combs, second-harmonic generation, and supercontinuum generation. Active tuning of photonic circuits is crucial not only for offsetting variations caused by fabrication in large-scale integration, but also serves as a fundamental component in programmable photonic circuits. Piezoelectric actuation in photonic devices offers a low-power, high-speed solution and is essential in the design of future photonic circuits due to its compatibility with materials like Si and Si3N4, which do not exhibit electro-optic effects. Here, we provide a detailed review of the latest developments in piezoelectric tuning and modulation, by examining various piezoelectric materials, actuator designs tailored to specific applications, and the capabilities and limitations of current technologies. Additionally, we explore the extensive applications enabled by piezoelectric actuators, including tunable lasers, frequency combs, quantum transducers, and optical isolators. These innovative ways of managing photon propagation and frequency on-chip are expected to be highly sought after in the future advancements of advanced photonic chips for both classical and quantum optical information processing and computing.

Microwaves generated by optical techniques have demonstrated unprecedentedly low noise and hold significance in various applications such as communication, radar, instrumentation, and metrology. To date, the purest microwave signals are generated using optical frequency division with femtosecond mode-locked lasers. However, many femtosecond laser combs have a radio frequency (RF) repetition rate in the hundreds of megahertz range, necessitating methods to translate the generated low-noise RF signal to the microwave domain. Benchtop pulse interleavers can multiply the pulse repetition rate, avoid saturation of photodetectors, and facilitate the generation of high-power low-noise microwave signals, which have to date only been demonstrated using optical fibers or free space optics. Here, we introduce a large-scale photonic integrated circuit-based interleaver, offering size reduction and enhanced stability. The all-on-chip interleaver attains a 64-fold multiplication of the repetition rate, directly translated from 216 MHz to 14 GHz in microwave Ku-Band. By overcoming photodetector saturation, the generated microwave power was improved by 36 dB, with a phase noise floor reduced by more than 10 folds to -160 dBc/Hz on the 14 GHz carrier. The device is based on a low-loss and high-density photonic integrated circuit fabricated by the photonic Damascene process. Six cascaded stages of Mach-Zehnder interferometers with optical delay lines up to 33 centimeters long are fully integrated into a compact footprint of 8.5 mmx1.7 mm. The lithographically defined precision of the optical waveguide path length enables the scaling up of the interleaved frequency to millimeter-wave bands, which is challenging the fiber-based counterparts. This interleaver has the potential to reduce the cost and footprint of mode-locked-laser-based microwave generation, allowing for field deployment.

Frequency metrology lies at the heart of precision measurement. Optical frequency combs provide a coherent link uniting the microwave and optical domains in the electromagnetic spectrum, with profound implications in timekeeping, sensing and spectroscopy, fundamental physics tests, exoplanet search, and light detection and ranging. Here, we extend this frequency link to free electrons by coherent modulation of the electron phase by a continuous-wave laser locked to a fully stabilized optical frequency comb. Microwave frequency standards are transferred to the optical domain via the frequency comb, and are further imprinted in the electron spectrum by optically modulating the electron phase with a photonic chip-based microresonator. As a proof-of-concept demonstration, we apply this frequency link in the calibration of an electron spectrometer, and use the electron spectrum to measure the optical frequency. Our work bridges frequency domains differed by a factor of $\sim10^{13}$ and carried by different physical objects, establishes a spectroscopic connection between electromagnetic waves and free-electron matter waves, and has direct ramifications in ultrahigh-precision electron spectroscopy.

The electronic structure evolutions of few-layer black phosphorus (BP) under pressure shows a wealth of phenomena, such as the nonmonotonic change of direct gap at the {\Gamma} point, the layer-number dependence, and the distinct responses to normal and hydrostatic pressures. A full and unified understanding to these rich phenomena remains lacking. Here, we provide a unified understanding from the competition between interlayer quasi-bonding (QB) interactions and intralayer chemical bonding interactions. The former decreases while the latter increases the band gap under pressure and the origin can be correlated to different combinations of inter- and intra-layer antibonding or bonding interactions at the band edges. More interestingly, the interlayer QB interactions are a coexistence of two categories of interactions, namely, the coexistence of interactions between bands of the same occupancy (occupied-occupied and empty-empty interactions) and of different occupancies (occupied-empty interaction); and, the overall effect is a four-level interaction, which explains the anomalous interlayer-antibonding feature of the conduction band edge of bilayer BP. Our current study lay the foundation for the electronic structure tuning of two-dimensional (2D) BP, and, our analysis method for multi-energy-level interactions can be applied to other 2D semiconductor homo- and hetero-structures that have occupied-empty interlayer interactions.