1. Mechanism on M (M[dbnd]Ni, Mo, Ni[sbnd]Mo) as deep level impurity reducing the TCR of Si-rich Cr[sbnd]Si resistive films.
- Author
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Wang, X.Y., Liu, Y.P., Ding, B.N., Li, M.X., Chen, T.N., and Zhu, X.T.
- Subjects
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MAGNETRONS , *X-ray diffraction , *SEMICONDUCTORS , *ENERGY bands , *SPUTTERING (Physics) - Abstract
Cr Si–M (M Ni, Mo, Ni Mo) resistive films were prepared by magnetron sputtering technique at the same process conditions. Experimental results shows that the metal M can reduce the temperature coefficient of resistance (TCR) of Si-rich Cr Si resistive films, and that the resistive films follow the sequence of Cr Si Mo (6.34 at%) < Cr Si Ni (9.97 at%) < Cr Si Ni (6.08 at%) Mo (2.47 at%) according to TCR tending to zero. XRD analysis reveals that CrSi 2 is the main conductive phase in the prepared Cr Si–M resistive films. In order to explore the reasons that M can reduce the TCR of Si-rich Cr Si resistive films, first principles was used to study the influence of M on the performance of CrSi 2 from state density and band structure. The first-principles study on M-doped CrSi 2 shows that M may exist in CrSi 2 semiconductor in the form of deep level impurity, and an energy band model on both Ni and Mo-doped CrSi 2 is constructed to reflect the results of first-principles simulation. Based on the established model, a mechanism is proposed that deep level impurities as electron traps capturing electrons and the formation of tight-binding excitons can suppress the non-equilibrium hot carriers against being contributed to the conductivity of CrSi 2 semiconductor. As a result, the TCR of Si-rich Cr Si resistive films is reduced due to the doping of M as deep level impurity. [ABSTRACT FROM AUTHOR]
- Published
- 2017
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