A layout approach is attempted dedicatedly for MMICs (monolithic microwave integrated circuits), on which predominant layout elements are transistors, resistors, capacitors, inductors, coplanar waveguides, T junctions, etc., formed by the GaAs fabrication process. The layout issue typical of such MMICs consists essentially in how to realize a single layer placement of different shapes of layout elements under a variety of spacing, orientating, and shaping constraints. Each layout element is modeled to simplify placement tasks subject to different placement constraints, and then a set of the interconnection requirements among elements is represented by a graph, to which a planarization algorithm is effectively applied. As a result of this planarization, a placement procedure is constructed mainly by repeated application of a merging scheme. A number of experimental results are also shown to demonstrate the practicability of the described layout approach.