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Low-power pulsed-laser annealing was applied to Zn+-implanted InP samples. In order to avoid surface oxidation during the treatment, the laser irradiation was carried out in inert ambient of nitrogen at different pressures. The analytical techniques used include Rutherford backscattering spectroscopy, reflection high energy electron diffraction, and electrical measurements. The highest carrier activation, about 80%, was achieved at the same laser power density (6.5 MW/cm2) at which the best crystal recovery was obtained.

The structure of (100) silicon implanted with Zn+ ions at an energy of 50 keV was studied. The ion doses were varied from 1×1015 to 1×1017 cm−2 and the beam current density was 10 μA cm−2. The analytical techniques employed for sample characterization included cross‐sectional transmission electron microscopy and x‐ray energy dispersion analysis. The energy deposition of the ion beam was calculated by using computer simulation codes. For the two lower doses of 1×1015 and 1×1016 a crystalline‐to‐amorphous transformation was observed in the implanted layer and this was correlated with the thermal history of the implants and the attendant changes in morphology. In contrast, an amorphous‐to‐crystalline transition was found to occur at higher doses, namely 5×1016 and 1×1017, where the formation of a complex, structured layer consisting of an amorphous phase mixed with crystalline grains of Zn and partly recrystallized Si was identified together with other specific structural features. Detailed characterization ...

Low‐power annealing by a pulsed laser is used to recover the structure of low‐dose implanted (100) GaAs crystals. Reflection high‐energy electron diffraction with variable glancing incidence is employed to detect the structural changes at different depths in the specimens. The depth dependence of the damage is studied in more detail by Rutherford backscattering analysis. The annealing results depend on the irradiation conditions. A laser energy window below the melting threshold is found within which the structure can be restored to about as high degree of crystallinity as the virgin one, without any visible surface damage. A simple theoretical estimate shows that the temperature rise of the material is far below the melting threshold. This rise is too short in time to cause substantial dopant diffusion; however, it can enhance well the point‐defect mobility.