1. Diffusion Reaction of Oxygen in HfO2/SiO2/Si Stacks.
- Author
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S. Ferrari and M. Fanciulli
- Subjects
- *
SILICON , *OXIDATION , *SEPARATION (Technology) , *SOLID solutions - Abstract
We study the oxidation mechanism of silicon in the presence of a thin HfO2layer. We performed a set of annealing in 18O2atmosphere on HfO2/SiO2/Si stacks observing the 18O distribution in the SiO2layer with time-of-flight secondary ion mass spectrometry (ToF-SIMS). The 18O distribution in HfO2/SiO2/Si stacks upon 18O2annealing suggests that what is responsible for SiO2growth is the molecular O2, whereas no contribution is found of the atomic oxygen to the oxidation. By studying the dependence of the oxidation velocity from oxygen partial pressure and annealing temperature, we demonstrate that the rate-determining step of the oxidation is the oxygen exchange at the HfO2/SiO2interface. When moisture is chemisorbed in HfO2films, the oxidation of the underlying silicon substrate becomes extremely fast and its kinetics can be described as a wet silicon oxidation process. The silicon oxidation during O2annealing of the atomic layer deposited HfO2/Si is fast in its early stage due to chemisorbed moisture and becomes slow after the first 10 s. [ABSTRACT FROM AUTHOR]
- Published
- 2006
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