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Nonaqueous dispersions of graphene nanoplatelets (GrNPs) can be used to prepare thin films and coatings free of surfactants, but typically involve polar organic solvents with high boiling points and low exposure limits. Here, we describe the mechanochemical exfoliation and dispersion of GrNPs in volatile aprotic solvents such as ethyl acetate (EtOAc) and acetone, which rank favorably in green solvent selection guides. GrNPs in powder form were exfoliated with a solvent on a horizontal ball mill for 48 h and then sonicated at moderate power to produce suspensions in excess of 300 μg/mL with minimum loss of dispersion stability over 7 weeks at room temperature. Atomic force microscopy of individual particles indicates a median thickness and lateral width of 8–10 layers and 180 nm, respectively. GrNP films can be deposited by conventional airbrush equipment with a dry time of seconds and applied as layers and coatings that enhance the reproducibility and performance of electronic devices. We demonstrate the utility of spray-coated GrNPs as contact layers for low-cost electrochemical sensing with improvements in intrabatch reproducibility and as conformal coatings on metal heat sinks with enhanced rates of heat dissipation. [ABSTRACT FROM AUTHOR]

The miniaturization and widespread deployment of electronic devices across diverse environments have heightened their vulnerability to corrosion, particularly affecting copper traces within printed circuit boards (PCBs). Conventional protective methods, such as conformal coatings, face challenges including the necessity for a critical thickness to ensure effective barrier properties and the requirement for multiple steps of drying and curing to eliminate solvent entrapment within polymer coatings. This study investigates cold atmospheric plasma (CAP) as an innovative technique for directly depositing ultrathin silicon oxide (SiO x ) coatings onto copper surfaces to enhance corrosion protection in PCBs. A systematic investigation was undertaken to examine how the scanning speed of the CAP deposition head impacts the film quality and corrosion resistance. The research aims to determine the optimal scanning speed of the CAP deposition head that achieves complete surface coverage while promoting effective cross-linking and minimizing unreacted precursor entrapment, resulting in superior electrical barrier and mechanical properties. The CAP coating process demonstrated the capability of depositing SiO x onto copper surfaces at various thicknesses ranging from 70 to 1110 nm through a single deposition process by simply adjusting the scanning speed of the plasma head (5-75 mm/s). Evaluation of material corrosion barrier characteristics revealed that scanning speeds of 45 mm/s of the plasma deposition head provided an effective coating thickness of 140 nm, exhibiting superior corrosion resistance (30-fold) compared to that of uncoated copper. As a proof of concept, the efficacy of CAP-deposited SiO x coatings was demonstrated by protecting an LED circuit in saltwater and by coating printed circuits for potential agricultural sensor applications. These CAP-deposited coatings offer performance comparable to or superior to traditional conformal polymeric coatings. This research presents CAP-deposited SiO x coatings as a promising approach for effective and scalable corrosion protection in miniaturized electronics.