1. Reactions of Cu(hfac)2 and Co2(CO)8 during Chemical Vapor Deposition of Copper−Cobalt Films
- Author
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Mark J. Hampden-Smith, Toivo T. Kodas, Shuo Gu, and Xuebin Yao
- Subjects
General Chemical Engineering ,Inorganic chemistry ,chemistry.chemical_element ,General Chemistry ,Chemical vapor deposition ,Chemical reaction ,Toluene ,Copper ,Isotropic etching ,Gas phase ,chemistry.chemical_compound ,chemistry ,Materials Chemistry ,Cobalt metal ,Cobalt - Abstract
The reactions of Co2(CO)8 and submicron cobalt particles with Cu(hfac)2 (hfac = hexafluoroacetylacetonate) were studied in toluene. Reactions between these species in the gas phase were studied in a hot-wall, parallel-plate chemical vapor deposition (CVD) reactor. Similar results were obtained with both methods. The overall chemical reactions can be expressed by the following equations: 2Cu(hfac)2 + Co2(CO)6 → 2Cu + 2Co(hfac)2 + 8CO and Cu(hfac)2 + Co → Cu +Co(hfac)2. These results suggested that Co2(CO)8 is not a good source precursor for CVD of Cu−Co binary films when used in conjunction with copper(II) and some copper(I) hexafluoroacetylacetonate compounds and that chemical etching of cobalt metal by Cu(hfac)2 needs to be taken into account when depositing this binary film with copper(I) and copper(II) hexafluoroacetylacetonate compounds as copper source precursors.
- Published
- 1998
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